JPH0279284U - - Google Patents

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Publication number
JPH0279284U
JPH0279284U JP15500188U JP15500188U JPH0279284U JP H0279284 U JPH0279284 U JP H0279284U JP 15500188 U JP15500188 U JP 15500188U JP 15500188 U JP15500188 U JP 15500188U JP H0279284 U JPH0279284 U JP H0279284U
Authority
JP
Japan
Prior art keywords
semiconductor chips
semiconductor chip
storage container
chip storage
substance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15500188U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15500188U priority Critical patent/JPH0279284U/ja
Publication of JPH0279284U publication Critical patent/JPH0279284U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の半導体チツプ収納容器第１の
実施例の縦断面図、第２図は本考案の第２の実施
例の縦断面図、第３図は本考案の第３の実施例の
縦断面図である。第４図は従来の半導体チツプ収
納方法を示す図、第５図は従来の半導体チツプ収
納済の状態を示す図、第６図は第５図の縦断面図
である。 １……半導体チツプ収納容器のフタ、２，２′
，２″……ゴム状物質、３……半導体チツプ収納
容器のトレー、４……半導体チツプ、５……フイ
ルム、６……クリツプ。 FIG. 1 is a vertical cross-sectional view of a first embodiment of a semiconductor chip storage container of the present invention, FIG. 2 is a vertical cross-sectional view of a second embodiment of the present invention, and FIG. 3 is a vertical cross-sectional view of a third embodiment of the present invention. FIG. FIG. 4 is a diagram showing a conventional method for storing semiconductor chips, FIG. 5 is a diagram showing a state in which the conventional semiconductor chips are already stored, and FIG. 6 is a longitudinal sectional view of FIG. 5. 1...Lid of semiconductor chip storage container, 2, 2'
, 2''...Rubber-like substance, 3... Tray of semiconductor chip storage container, 4... Semiconductor chip, 5... Film, 6... Clip.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チツプを収納するプラスチツクあるいは
金属にて形成された容器の前記半導体チツプと接
する面にゴム状物質を被覆したことを特徴とする
半導体チツプ収納容器。 1. A semiconductor chip storage container for storing semiconductor chips, characterized in that the container made of plastic or metal is coated with a rubber-like substance on the surface that comes into contact with the semiconductor chips.
JP15500188U 1988-11-28 1988-11-28 Pending JPH0279284U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15500188U JPH0279284U (en) 1988-11-28 1988-11-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15500188U JPH0279284U (en) 1988-11-28 1988-11-28

Publications (1)

Publication Number Publication Date
JPH0279284U true JPH0279284U (en) 1990-06-19

Family

ID=31432231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15500188U Pending JPH0279284U (en) 1988-11-28 1988-11-28

Country Status (1)

Country Link
JP (1) JPH0279284U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005181314A (en) * 2003-12-16 2005-07-07 Xerox Corp Method of testing die
JP2012006603A (en) * 2010-06-22 2012-01-12 Hoya Corp Package and method of manufacturing optical element
JP2022162523A (en) * 2021-04-12 2022-10-24 ▲き▼邦科技股▲分▼有限公司 Try

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005181314A (en) * 2003-12-16 2005-07-07 Xerox Corp Method of testing die
JP4596560B2 (en) * 2003-12-16 2010-12-08 ゼロックス コーポレイション How to test a die
JP2012006603A (en) * 2010-06-22 2012-01-12 Hoya Corp Package and method of manufacturing optical element
JP2022162523A (en) * 2021-04-12 2022-10-24 ▲き▼邦科技股▲分▼有限公司 Try
US11764090B2 (en) 2021-04-12 2023-09-19 Chipbond Technology Corporation Tray

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