JPH0259170U - - Google Patents
Info
- Publication number
- JPH0259170U JPH0259170U JP13970988U JP13970988U JPH0259170U JP H0259170 U JPH0259170 U JP H0259170U JP 13970988 U JP13970988 U JP 13970988U JP 13970988 U JP13970988 U JP 13970988U JP H0259170 U JPH0259170 U JP H0259170U
- Authority
- JP
- Japan
- Prior art keywords
- taping
- tape
- adhesive surface
- taping tape
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 3
- 230000000630 rising effect Effects 0.000 claims description 2
- 238000005192 partition Methods 0.000 claims 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Description
第１図は本考案の一実施例を示す斜視図、第２
図は従来例を示す斜視図、第３図はテーピングテ
ープへのシールテープの熱接着状態を示す斜視図
、第４図はテーピング帯をリールに巻回した状態
を示す斜視図である。
１……テーピングテープ、１ａ……接着面、１
ｂ……立上り部、２……エンボス、３……送り孔
、４……シールテープ。
Fig. 1 is a perspective view showing one embodiment of the present invention;
3 is a perspective view showing a state in which a sealing tape is thermally bonded to a taping tape, and FIG. 4 is a perspective view showing a state in which a taping band is wound around a reel. 1...Taping tape, 1a...Adhesive surface, 1
b...Rising portion, 2...Emboss, 3...Spread hole, 4...Sealing tape.
Claims (1)
収納用エンボス及び該エンボス列に沿つて形成さ
れた接着面を有するテーピングテープと、該テー
ピングテープの接着面に熱融着され、前記エンボ
スを施蓋するシールテープとを備えた電子部品の
テーピング帯において、前記テーピングテープの
隣接するエンボス間を仕切る立上り部の高さを前
記接着面より低く設定したことを特徴とする電子
部品のテーピング帯。 A taping tape having embossments for storing chip-type electronic components arranged in rows at equal intervals and an adhesive surface formed along the emboss rows, and a taping tape that is heat-sealed to the adhesive surface of the taping tape, and the embossment is 1. A taping band for an electronic component comprising a sealing tape for closing the electronic component, characterized in that the height of a rising part that partitions between adjacent embossments of the taping tape is set lower than the adhesive surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13970988U JPH0259170U (en) | 1988-10-26 | 1988-10-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13970988U JPH0259170U (en) | 1988-10-26 | 1988-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0259170U true JPH0259170U (en) | 1990-04-27 |
Family
ID=31403221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13970988U Pending JPH0259170U (en) | 1988-10-26 | 1988-10-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0259170U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014091560A (en) * | 2012-11-05 | 2014-05-19 | Shin Etsu Polymer Co Ltd | Carrier tape |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61232171A (en) * | 1985-03-27 | 1986-10-16 | 株式会社村田製作所 | Electronic part run |
-
1988
- 1988-10-26 JP JP13970988U patent/JPH0259170U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61232171A (en) * | 1985-03-27 | 1986-10-16 | 株式会社村田製作所 | Electronic part run |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014091560A (en) * | 2012-11-05 | 2014-05-19 | Shin Etsu Polymer Co Ltd | Carrier tape |
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