JPS6322611B2 - - Google Patents

Info

Publication number
JPS6322611B2
JPS6322611B2 JP57107804A JP10780482A JPS6322611B2 JP S6322611 B2 JPS6322611 B2 JP S6322611B2 JP 57107804 A JP57107804 A JP 57107804A JP 10780482 A JP10780482 A JP 10780482A JP S6322611 B2 JPS6322611 B2 JP S6322611B2
Authority
JP
Japan
Prior art keywords
casting
lead frame
casting mold
positioning
positioning pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57107804A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58225641A (ja
Inventor
Kazuo Yamanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP57107804A priority Critical patent/JPS58225641A/ja
Publication of JPS58225641A publication Critical patent/JPS58225641A/ja
Publication of JPS6322611B2 publication Critical patent/JPS6322611B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57107804A 1982-06-23 1982-06-23 キヤステイングモ−ルド製造法 Granted JPS58225641A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57107804A JPS58225641A (ja) 1982-06-23 1982-06-23 キヤステイングモ−ルド製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57107804A JPS58225641A (ja) 1982-06-23 1982-06-23 キヤステイングモ−ルド製造法

Publications (2)

Publication Number Publication Date
JPS58225641A JPS58225641A (ja) 1983-12-27
JPS6322611B2 true JPS6322611B2 (enExample) 1988-05-12

Family

ID=14468451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57107804A Granted JPS58225641A (ja) 1982-06-23 1982-06-23 キヤステイングモ−ルド製造法

Country Status (1)

Country Link
JP (1) JPS58225641A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01107152U (enExample) * 1988-01-12 1989-07-19

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5270766A (en) * 1975-12-10 1977-06-13 Toshiba Corp Semiconductor device

Also Published As

Publication number Publication date
JPS58225641A (ja) 1983-12-27

Similar Documents

Publication Publication Date Title
US6441402B2 (en) Optical electronic apparatus and method for producing the same
US4933729A (en) Photointerrupter
JPH05210030A (ja) 光結合構造とその基体およびこのような構造を実現する方法
US7268958B2 (en) Holder and optical element
JPS58225641A (ja) キヤステイングモ−ルド製造法
JP4166887B2 (ja) 光半導体装置
JPS63104486A (ja) 反射型光センサ−
US7574716B2 (en) Guide mechanism and optical drive utilizing the same
JP3201014B2 (ja) 半導体装置
JP2565160B2 (ja) 発光装置
JPH06163950A (ja) 半導体装置
KR830000971Y1 (ko) 기판장치
JPH01211954A (ja) 半導体ステムの製造方法
JPH07254623A (ja) 光電変換装置及びその製造方法
JPH0224388B2 (enExample)
KR200148117Y1 (ko) 고체 촬상 소자 패키지용 글래스 리드 구조
US4433409A (en) Pick-up assembly for video disc player
JPS60678Y2 (ja) 光学式読取装置
JPH0231342A (ja) ピックアップ機構の受光素子固定構造
JPS5972763A (ja) 固体イメ−ジセンサ
JPH05129730A (ja) モールド型半導体レーザ装置
JPH0334674B2 (enExample)
JPS63170949A (ja) 半導体装置
JPH0320896Y2 (enExample)
JPH0751800Y2 (ja) 光電変換素子