JPS58225641A - キヤステイングモ−ルド製造法 - Google Patents

キヤステイングモ−ルド製造法

Info

Publication number
JPS58225641A
JPS58225641A JP57107804A JP10780482A JPS58225641A JP S58225641 A JPS58225641 A JP S58225641A JP 57107804 A JP57107804 A JP 57107804A JP 10780482 A JP10780482 A JP 10780482A JP S58225641 A JPS58225641 A JP S58225641A
Authority
JP
Japan
Prior art keywords
casting
lead frame
case
casting mold
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57107804A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6322611B2 (enExample
Inventor
Kazuo Yamanaka
山中　一雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP57107804A priority Critical patent/JPS58225641A/ja
Publication of JPS58225641A publication Critical patent/JPS58225641A/ja
Publication of JPS6322611B2 publication Critical patent/JPS6322611B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57107804A 1982-06-23 1982-06-23 キヤステイングモ−ルド製造法 Granted JPS58225641A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57107804A JPS58225641A (ja) 1982-06-23 1982-06-23 キヤステイングモ−ルド製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57107804A JPS58225641A (ja) 1982-06-23 1982-06-23 キヤステイングモ−ルド製造法

Publications (2)

Publication Number Publication Date
JPS58225641A true JPS58225641A (ja) 1983-12-27
JPS6322611B2 JPS6322611B2 (enExample) 1988-05-12

Family

ID=14468451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57107804A Granted JPS58225641A (ja) 1982-06-23 1982-06-23 キヤステイングモ−ルド製造法

Country Status (1)

Country Link
JP (1) JPS58225641A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01107152U (enExample) * 1988-01-12 1989-07-19

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5270766A (en) * 1975-12-10 1977-06-13 Toshiba Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5270766A (en) * 1975-12-10 1977-06-13 Toshiba Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01107152U (enExample) * 1988-01-12 1989-07-19

Also Published As

Publication number Publication date
JPS6322611B2 (enExample) 1988-05-12

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