JPS63224940A - プリント配線板材料 - Google Patents
プリント配線板材料Info
- Publication number
- JPS63224940A JPS63224940A JP5971987A JP5971987A JPS63224940A JP S63224940 A JPS63224940 A JP S63224940A JP 5971987 A JP5971987 A JP 5971987A JP 5971987 A JP5971987 A JP 5971987A JP S63224940 A JPS63224940 A JP S63224940A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- ppo
- resin
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Landscapes
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5971987A JPS63224940A (ja) | 1987-03-15 | 1987-03-15 | プリント配線板材料 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5971987A JPS63224940A (ja) | 1987-03-15 | 1987-03-15 | プリント配線板材料 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63224940A true JPS63224940A (ja) | 1988-09-20 |
JPH0564586B2 JPH0564586B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-09-14 |
Family
ID=13121292
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5971987A Granted JPS63224940A (ja) | 1987-03-15 | 1987-03-15 | プリント配線板材料 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63224940A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02145624A (ja) * | 1987-05-14 | 1990-06-05 | Rogers Corp | 熱硬化成形方法 |
JPH10338809A (ja) * | 1997-04-08 | 1998-12-22 | Sumitomo Chem Co Ltd | 低誘電率樹脂とパラ配向芳香族ポリアミドとからなる複合フィルム、そのプリプレグおよびそれらの用途 |
US6949289B1 (en) | 1998-03-03 | 2005-09-27 | Ppg Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
US7354641B2 (en) | 2004-10-12 | 2008-04-08 | Ppg Industries Ohio, Inc. | Resin compatible yarn binder and uses thereof |
CN105984180A (zh) * | 2015-02-11 | 2016-10-05 | 律胜科技股份有限公司 | 用于高频印刷电路板的铜箔基板材及其应用 |
-
1987
- 1987-03-15 JP JP5971987A patent/JPS63224940A/ja active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02145624A (ja) * | 1987-05-14 | 1990-06-05 | Rogers Corp | 熱硬化成形方法 |
JPH10338809A (ja) * | 1997-04-08 | 1998-12-22 | Sumitomo Chem Co Ltd | 低誘電率樹脂とパラ配向芳香族ポリアミドとからなる複合フィルム、そのプリプレグおよびそれらの用途 |
US6949289B1 (en) | 1998-03-03 | 2005-09-27 | Ppg Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
US7354641B2 (en) | 2004-10-12 | 2008-04-08 | Ppg Industries Ohio, Inc. | Resin compatible yarn binder and uses thereof |
CN105984180A (zh) * | 2015-02-11 | 2016-10-05 | 律胜科技股份有限公司 | 用于高频印刷电路板的铜箔基板材及其应用 |
Also Published As
Publication number | Publication date |
---|---|
JPH0564586B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-09-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |