JPS6322454B2 - - Google Patents

Info

Publication number
JPS6322454B2
JPS6322454B2 JP55132914A JP13291480A JPS6322454B2 JP S6322454 B2 JPS6322454 B2 JP S6322454B2 JP 55132914 A JP55132914 A JP 55132914A JP 13291480 A JP13291480 A JP 13291480A JP S6322454 B2 JPS6322454 B2 JP S6322454B2
Authority
JP
Japan
Prior art keywords
chuck
wafer
replacement
flatness
chucks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55132914A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5758319A (en
Inventor
Yukio Kenbo
Yasuo Nakagawa
Nobuyuki Akyama
Susumu Aiuchi
Mineo Nomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP55132914A priority Critical patent/JPS5758319A/ja
Priority to DE3110341A priority patent/DE3110341C2/de
Priority to US06/245,193 priority patent/US4391511A/en
Publication of JPS5758319A publication Critical patent/JPS5758319A/ja
Publication of JPS6322454B2 publication Critical patent/JPS6322454B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/707Chucks, e.g. chucking or un-chucking operations or structural details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP55132914A 1980-03-19 1980-09-26 Wafer chuck device Granted JPS5758319A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP55132914A JPS5758319A (en) 1980-09-26 1980-09-26 Wafer chuck device
DE3110341A DE3110341C2 (de) 1980-03-19 1981-03-17 Verfahren und Vorrichtung zum Ausrichten eines dünnen Substrats in der Bildebene eines Kopiergerätes
US06/245,193 US4391511A (en) 1980-03-19 1981-03-18 Light exposure device and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55132914A JPS5758319A (en) 1980-09-26 1980-09-26 Wafer chuck device

Publications (2)

Publication Number Publication Date
JPS5758319A JPS5758319A (en) 1982-04-08
JPS6322454B2 true JPS6322454B2 (enExample) 1988-05-12

Family

ID=15092466

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55132914A Granted JPS5758319A (en) 1980-03-19 1980-09-26 Wafer chuck device

Country Status (1)

Country Link
JP (1) JPS5758319A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59121932A (ja) * 1982-12-28 1984-07-14 Fujitsu Ltd 自動焦点制御装置
NL2006565A (en) 2010-06-30 2012-01-02 Asml Holding Nv Reticle clamping system.

Also Published As

Publication number Publication date
JPS5758319A (en) 1982-04-08

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