JPS6322454B2 - - Google Patents
Info
- Publication number
- JPS6322454B2 JPS6322454B2 JP55132914A JP13291480A JPS6322454B2 JP S6322454 B2 JPS6322454 B2 JP S6322454B2 JP 55132914 A JP55132914 A JP 55132914A JP 13291480 A JP13291480 A JP 13291480A JP S6322454 B2 JPS6322454 B2 JP S6322454B2
- Authority
- JP
- Japan
- Prior art keywords
- chuck
- wafer
- replacement
- flatness
- chucks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55132914A JPS5758319A (en) | 1980-09-26 | 1980-09-26 | Wafer chuck device |
| DE3110341A DE3110341C2 (de) | 1980-03-19 | 1981-03-17 | Verfahren und Vorrichtung zum Ausrichten eines dünnen Substrats in der Bildebene eines Kopiergerätes |
| US06/245,193 US4391511A (en) | 1980-03-19 | 1981-03-18 | Light exposure device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55132914A JPS5758319A (en) | 1980-09-26 | 1980-09-26 | Wafer chuck device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5758319A JPS5758319A (en) | 1982-04-08 |
| JPS6322454B2 true JPS6322454B2 (enExample) | 1988-05-12 |
Family
ID=15092466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55132914A Granted JPS5758319A (en) | 1980-03-19 | 1980-09-26 | Wafer chuck device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5758319A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59121932A (ja) * | 1982-12-28 | 1984-07-14 | Fujitsu Ltd | 自動焦点制御装置 |
| NL2006565A (en) | 2010-06-30 | 2012-01-02 | Asml Holding Nv | Reticle clamping system. |
-
1980
- 1980-09-26 JP JP55132914A patent/JPS5758319A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5758319A (en) | 1982-04-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6862080B2 (en) | Substrate holding device, semiconductor manufacturing apparatus and device manufacturing method | |
| US7361234B2 (en) | Photolithographic stepper and/or scanner machines including cleaning devices and methods of cleaning photolithographic stepper and/or scanner machines | |
| JP3978140B2 (ja) | 処理ツールにおいて基板上の欠陥を検出するための構成および方法 | |
| JPS6322454B2 (enExample) | ||
| JP2002198304A (ja) | 処理液供給装置及び処理液供給方法 | |
| US4648708A (en) | Pattern transfer apparatus | |
| JP4544761B2 (ja) | プロキシミティギャップ制御方法、プロキシミティギャップ制御装置及びプロキシミティ露光装置 | |
| JPH0147007B2 (enExample) | ||
| JPS587055B2 (ja) | プロキシミテイ・アライナ−におけるギヤツプ設定装置 | |
| JP2001168010A (ja) | 基板の検査方法及び検査装置 | |
| JP2014139550A (ja) | 基板検査装置 | |
| JP2005064139A (ja) | 基板保持装置及び露光装置 | |
| JP4769451B2 (ja) | 露光装置 | |
| JPH11260676A (ja) | 半導体ウエハ、露光装置、露光方法及び半導体ウエハの位置決め方法 | |
| JP3624057B2 (ja) | 露光装置 | |
| JPH09219357A (ja) | 露光装置 | |
| JPH1097987A (ja) | 走査型露光装置および方法 | |
| JPH08321457A (ja) | 露光装置 | |
| JP7229307B2 (ja) | 半導体製造装置の設置システム及び設置方法並びに記憶媒体 | |
| JPH07142348A (ja) | 露光装置 | |
| JPH11176743A (ja) | 露光装置及び露光方法 | |
| JP2024032620A (ja) | 基板保持装置、基板保持方法及びリソグラフィ装置 | |
| JP3483403B2 (ja) | 露光装置 | |
| JPH06151271A (ja) | 露光装置 | |
| JPH10106934A (ja) | 露光方法及び露光装置 |