JPS63224296A - Manufacture of ceramic multilayer interconnection board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a manufacturing process of a ceramic multilayer wiring board,
In particular, the present invention relates to a method for reducing interlayer misalignment due to dimensional changes in ceramic green sheets.

[Conventional technology]

Ceramic multilayer wiring boards are manufactured using the manufacturing process shown in Figure 3, and the dimensional stabilization treatment for reducing dimensional changes in ceramic green sheets is carried out under the conditions described in Japanese Patent Laid-Open No. 58-154293. This was done in the same way as the green sheet. This method was an effective means of stabilizing the dimensions when forming wiring patterns with relatively low density, but as the height changes and the area becomes larger, the difference in the amount of dimensional change depending on the layer increases. No consideration was given to this.

[Problem that the invention seeks to solve]

In the above conventional technology, the amount of dimensional change of each green sheet is
The difference between wiring patterns is taken into consideration, and as the pattern density and area increase, there is a problem that the difference in the amount of dimensional change between each layer becomes larger, especially after filling the through holes with conductive paste and printing the wiring pattern. Ta. This causes a misalignment between the eyebrows and poor conduction.

It is an object of the present invention to provide a method for manufacturing a ceramic substrate with no glabellar position and less bulkiness by matching the amount of dimensional change of the green sheets of each layer.

[Failure to solve the problem]

The above purpose is achieved by appropriately changing the conditions of the green sheet dimensional stabilization treatment for each layer. In other words, the stronger the dimensional stabilization treatment conditions are, the more the green sheet is filled with conductive paste and the size of the green sheet printed. Taking advantage of the fact that the amount of change can be reduced [7. Green sheets used for layers with large pattern density and area and large amount of dimensional change are subjected to dimensional stabilization treatment under strong conditions in advance, and other The layers are processed under weak conditions to match the amount of dimensional change in each layer.

[Effect]

Among the dimensional stabilization treatment conditions, for example, when the press pressure is changed, the amount of dimensional change of the green sheet is as shown in FIG. 4. Since this dimensional change is a change over time, it also depends on the standing time, but FIG. 4 shows the amount of dimensional change when left standing for 3 days.

As shown in Figure 4, the amount of dimensional change differs depending on the density of the pattern, so when these green sheets are stacked with the same pressure, misalignment will occur between the eyebrows. IJ-:/ Sheet 1
P1 = 5 to 10 kg/am'', and P2 = 50 to 100 for the green sheet 2 for high-density pattern formation.
If the treatment is carried out at "kg/am", the difference in the amount of dimensional change will be small and the interlayer misalignment can be reduced. [Example] Hereinafter, an example of the present invention will be explained with reference to FIG. 1. Green After creating the sheet, the green sea 71 that forms the low density pattern 4 is heated at 80 to 120°C with a weight of 5 to 10 kg/
The green sheet 2 forming the high-density pattern 5 was subjected to dimensional stabilization treatment of 50 to 1 am at 80 to 120°C.
Dimensional stabilization treatment of "oOkg/am" was performed in advance. Guide holes 6 were formed in these green sheets, through-holes were drilled, conductive paste was filled into the through-holes 8, and wiring printing 4 and 5 were performed. After that, each green sheet 1, 2 is set in the lamination jig 6, using the guide bin 7 to align the green sheets with the guide hole 5 as a reference.
10 kg/am”.Hot press pressure is
The pressure needs to be higher than the pressure for dimensional stabilization treatment. This is to prevent a gap between the eyebrows. This laminate is cut into external shapes and sintered to obtain a ceramic multilayer substrate.

FIG. 2 shows the dimensional change over time after patterning of the green sheet 1.2 according to this example.

The green sheet 1 with a low density pattern has a dimensional change as shown in 1, and the green sheet 2 with a high density pattern has a dimensional change as shown in 2. When green sheet No. 2 is subjected to the same dimensional stabilization treatment as No. 1, 3 days after pattern formation,
A dimensional change of about 0.17 inch occurs, and a difference of 0.15% from the green sheet 1 occurs, causing interlayer misalignment, and when the allowable amount of misalignment is 0.1 inch, a conduction failure (short) occurs. do.

In this example, the difference in the amount of dimensional change between green sheets 1 and 2 within three days after pattern formation is 0.05%, which is within the deviation tolerance, so a substrate without conduction defects can be obtained.

〔Effect of the invention〕

According to the present invention, it is possible to reduce the difference in the amount of dimensional change between the green sheets of each layer, thereby reducing interlayer misalignment,
This has the effect of reducing conduction defects.

[Brief explanation of the drawing]

Fig. 1 is a manufacturing process of an embodiment of the present invention, Fig. 2 is a characteristic diagram obtained by the present invention, Fig. 3 is a manufacturing process diagram of a ceramic multilayer substrate, and Fig. 4 is a characteristic that is the principle of the present invention. It is a line diagram. 3...Guide hole. 4.5...Wiring pattern. 6...... Lamination jig. 7・・・・・・・・・Guide bin. 8...Through hole.

Claims (1)

[Claims] 1. In the manufacturing process of ceramic multilayer wiring boards, by appropriately changing the dimensional stabilization processing conditions of ceramic green sheets for each layer, the amount of dimensional change in each layer with different pattern density is matched, and interlayer positional deviation is reduced. A method for manufacturing a ceramic multilayer wiring board, characterized in that: