JPS62272590A - Manufacture of ceramic board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] 3. Detailed Description of the Invention [Summary] A green sheet is formed using a carrier sheet on which a pattern is printed, and after removing the carrier sheet, the pattern is printed again over the pattern. This is a manufacturing method in which patterned wiring with a thick film thickness can be formed.

[Industrial application field]

The present invention relates to a method for manufacturing a ceramic substrate manufactured by laminating a plurality of green sheets on which patterned wiring is formed, and in particular, to achieve high-density packaging by increasing the film thickness of the patterned wiring. The present invention relates to a method for manufacturing a ceramic substrate.

Ceramic substrates that are widely used in electronic devices are generally manufactured by laminating a plurality of green sheets on which pattern wiring is formed by pattern printing, and hardening the stack by firing.

Ceramic substrates like this are becoming increasingly denser due to higher density packaging of semiconductor elements, etc.
In order to achieve higher density, the pattern width of pattern printing has become as narrow as possible.

However, narrowing the pattern width reduces the cross-sectional area of the pattern wiring, which has a negative effect on the propagation of electrical signals, especially in the case of long wiring patterns.

Therefore, even if the width of the pattern wiring becomes thinner due to higher density, the cross-sectional area will not be reduced by increasing the thickness, and the wiring can be formed in such a way that it will not affect the propagation of electrical signals. is desired.

[Conventional technology]

Conventionally, (a) (b) (c 1) (c 2) (d
) (e) Manufacturing was carried out as shown in the conventional manufacturing process diagram.

As shown in FIG. 4(a), first, the carrier sheet 2
A green sheet 1 with a thickness T is formed by pouring a ceramic raw material liquid onto a predetermined surface and drying it.The green sheet 1 formed with a thickness T is cut into a predetermined size as shown in (b). Then, the guide hole 11 and through hole 12 are processed.

Next, as shown in (C1), door electrical paste is applied to predetermined locations on the surface of the green sheet 1 to form a pattern arrangement 41A10. By this coating, a pattern arrangement "alO" having a width and a thickness t shown in (C2) is formed on the surface of the green sheet 1.

The green sheets 1 on which the pattern wiring 10 is formed in this way are stacked on a jig 13, as shown in FIG. This lamination is done by connecting the guide hole 11 of the green sheet 1 to the jig 13.
After stacking, they are pressurized with a predetermined pressure P by the lid plate 14 and heated to a predetermined value.

The thus laminated material is inserted into a firing furnace and fired at a high temperature. After firing, as shown in FIG. Manufacturing was going on.

[Problem that the invention seeks to solve]

In order to improve the packaging density on the board 15, the width of the pattern wiring 10 shown in (C2) is made as thin as bl, and a large number of pattern wiring 10 are provided in a predetermined space.

However, reducing the width to b1 reduces the film area of the pattern wiring 10, increases line resistance, and adversely affects the propagation of electrical signals.

Therefore, in order to prevent the cross-sectional area from decreasing even if the width is reduced to b1, it is possible to increase the thickness as shown by the dotted line tl.

However, the thickness t formed by applying conductive paste
For example, there is a limit to the pattern wiring 1 formed earlier.
It is conceivable to increase the thickness t by increasing the number of times of application by overlapping the 0 layer, but in reality, the overlap causes "sagging", and even if the width is formed to the width bl, bt, it becomes difficult to form the cross-sectional area shown by the dotted line.

Therefore, there is a problem in that it is not possible to improve the packaging density.

[Means for solving problems]

FIG. 1 is a diagram explaining the principle of the present invention.

As shown in Figure 1, pattern printing is carried out on a carrier sheet (
2) to form the first pattern (3).
A green sheet (1) is obtained by the step (A) and the carrier sheet (2) on which the first pattern (3) is formed.
a second step (B) of forming the carrier sheet (2);
) is removed, and a third step (C) of forming a second pattern (4) by printing the pattern again so as to overlap the first pattern (3).
5) is manufactured by forming.

Manufacturing in this manner solves the aforementioned problems.

[For production]

That is, by forming a green sheet using a carrier sheet on which a pattern has been printed in advance, a pattern is provided on the green sheet, and by further printing a pattern over the pattern, a thick pattern wiring with a predetermined width and thickness is formed. is formed.

Therefore, since the above-mentioned "sagging" does not occur, it is possible to easily form thin and thick pattern wiring, and it is possible to manufacture boards with high density packaging. .

〔Example〕

The present invention will be explained in detail below with reference to FIG.

FIGS. 2(a) to 2(f) are manufacturing process diagrams of an embodiment of the present invention. The same reference numerals indicate the same objects throughout the figures.

As shown in FIG. 2(a), first, the carrier sheet 2
A first pattern 3 with a thickness t is formed using a conductive paste by pattern printing, and as shown in FIG. A green sheet 1 of T is formed.

Next, as shown in (C), guide holes 11 and through holes 12 are formed on the surface from which the carrier sheet 2 has been removed, and as shown in (d), they are overlapped with the first pattern 3 and made conductive again. Pattern wiring 5 is formed by printing a pattern using body paste and stacking a second pattern 4 having a thickness t.

The thickness of the pattern wiring 5 formed by this lamination is t
It is possible to make the tl approximately twice as large.

Moreover, according to such lamination, the width b2. Each of b3 has a predetermined value because it does not "sag".

The green sheet 1 on which the pattern wiring 5 has been formed is held on the jig 13 as shown in (e) and (f) in the same manner as described above.
The substrate 15 in which the pattern wiring 5 is embedded can be manufactured by laminating, firing, and cutting.

Furthermore, the pattern wiring 5 is formed as shown in FIGS.
It may also be manufactured as shown in c).

As shown in FIG. 3(a), a first pattern 3 with a thickness t is formed.
When the raw material liquid of the green sheet 1 is poured onto the carrier sheet 2 on which the green sheet 1 is formed and the green sheet 1 formed to the thickness T is to be peeled off from the carrier sheet 2, as shown in FIG. The pattern 3 is also removed at the same time, and a groove IA having a depth t is formed by removing the pattern 3.

If a pattern is printed using a conductive paste so as to match the groove LA, a thick pattern wiring 5 having a thickness tl can be formed as shown in FIG. 3(C).

In this case, as in the above case, since "sagging" does not occur, the width b2. b3 can each be set to a predetermined value.

Therefore, by manufacturing in this way, it is possible to easily form the pattern wiring 5 having a narrow width.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to form a pattern wiring having a narrow width and a large thickness, thereby increasing the density of pattern wiring in a predetermined space.

In addition, since the cross-sectional area of the pattern wiring is not reduced, it is possible to prevent an adverse effect on the propagation of electrical signals, which has a great practical effect.

[Brief explanation of the drawing]

FIG. 1 is a diagram explaining the principle of the present invention. FIGS. 2(a) to 2(f) are manufacturing process diagrams of an embodiment of the present invention. FIGS. 3(a), 3(b), and 3(c) are explanatory diagrams of other embodiments of the present invention. <a) to (e) in FIG. 4 show conventional manufacturing process diagrams. In the figure, 1 is a green sheet and 2 is a carrier sheet. 3 is the first pattern, 4 is the second pattern. 5 is pattern wiring, A is the first process. B indicates the second step, and C indicates the third step. Complete lacquer work n Hara Puri Ei 4 Figure 1 Tree 7-1 θF4 Niyo Ichifu Seiri / 11 I Sat [Birat f5 Figure 2! Gusozo sheet Kizenaki n4+! - Bewa reverse side d explanatory diagram Fig. 3

Claims (1)

[Claims] A method for manufacturing a ceramic substrate in which a pattern wiring (5) is formed by printing a predetermined pattern on a green sheet (1), and is manufactured by a lamination process and a firing process, wherein the pattern printing is performed on a carrier. a first step (A) of forming a first pattern (3) on a sheet (2); and a first step (A) of forming a first pattern (3) on a sheet (2); a second step (B) of forming the first pattern (1); and after removing the carrier sheet (2), forming the first pattern (
A ceramic substrate characterized in that the pattern wiring (5) is formed by a third step (C) of forming a second pattern (4) by printing the pattern again so as to overlap with the pattern wiring (5). manufacturing method.