JPS63219149A - 混成集積回路 - Google Patents
混成集積回路Info
- Publication number
- JPS63219149A JPS63219149A JP61247924A JP24792486A JPS63219149A JP S63219149 A JPS63219149 A JP S63219149A JP 61247924 A JP61247924 A JP 61247924A JP 24792486 A JP24792486 A JP 24792486A JP S63219149 A JPS63219149 A JP S63219149A
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- printed circuit
- circuit board
- substrate
- flexible lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 239000000463 material Substances 0.000 claims abstract description 17
- 238000007789 sealing Methods 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims description 34
- 239000002184 metal Substances 0.000 claims description 34
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 abstract description 8
- 230000037431 insertion Effects 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 abstract 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61247924A JPS63219149A (ja) | 1986-10-17 | 1986-10-17 | 混成集積回路 |
| DE8787114938T DE3777324D1 (de) | 1986-10-15 | 1987-10-13 | Integrierte hybridschaltungsanordnung, die in einen sockel eingesteckt werden kann. |
| EP87114938A EP0264780B1 (en) | 1986-10-15 | 1987-10-13 | Hybrid integrated circuit device capable of being inserted into socket |
| US07/107,990 US4884125A (en) | 1986-10-15 | 1987-10-13 | Hybrid integrated circuit device capable of being inserted into socket |
| KR1019870011409A KR900007232B1 (ko) | 1986-10-15 | 1987-10-14 | 혼성집적회로 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61247924A JPS63219149A (ja) | 1986-10-17 | 1986-10-17 | 混成集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63219149A true JPS63219149A (ja) | 1988-09-12 |
| JPH0469821B2 JPH0469821B2 (en, 2012) | 1992-11-09 |
Family
ID=17170570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61247924A Granted JPS63219149A (ja) | 1986-10-15 | 1986-10-17 | 混成集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63219149A (en, 2012) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4953006A (en) * | 1989-07-27 | 1990-08-28 | Northern Telecom Limited | Packaging method and package for edge-coupled optoelectronic device |
| JPH04354357A (ja) * | 1991-05-31 | 1992-12-08 | Nippondenso Co Ltd | 電子装置の製造方法 |
-
1986
- 1986-10-17 JP JP61247924A patent/JPS63219149A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4953006A (en) * | 1989-07-27 | 1990-08-28 | Northern Telecom Limited | Packaging method and package for edge-coupled optoelectronic device |
| JPH04354357A (ja) * | 1991-05-31 | 1992-12-08 | Nippondenso Co Ltd | 電子装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0469821B2 (en, 2012) | 1992-11-09 |
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