JPS63203800A - タングステン合金めっき用電極の製造方法 - Google Patents

タングステン合金めっき用電極の製造方法

Info

Publication number
JPS63203800A
JPS63203800A JP3540687A JP3540687A JPS63203800A JP S63203800 A JPS63203800 A JP S63203800A JP 3540687 A JP3540687 A JP 3540687A JP 3540687 A JP3540687 A JP 3540687A JP S63203800 A JPS63203800 A JP S63203800A
Authority
JP
Japan
Prior art keywords
electrode
coating
iridium
tantalum
drying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3540687A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0355558B2 (enrdf_load_stackoverflow
Inventor
Takashi Komi
小見 崇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shimizu Co Ltd
Original Assignee
Shimizu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimizu Co Ltd filed Critical Shimizu Co Ltd
Priority to JP3540687A priority Critical patent/JPS63203800A/ja
Publication of JPS63203800A publication Critical patent/JPS63203800A/ja
Publication of JPH0355558B2 publication Critical patent/JPH0355558B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125Process of deposition of the inorganic material
    • C23C18/1279Process of deposition of the inorganic material performed under reactive atmosphere, e.g. oxidising or reducing atmospheres
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/1208Oxides, e.g. ceramics
    • C23C18/1216Metal oxides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1225Deposition of multilayers of inorganic material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
  • Chemically Coating (AREA)
JP3540687A 1987-02-17 1987-02-17 タングステン合金めっき用電極の製造方法 Granted JPS63203800A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3540687A JPS63203800A (ja) 1987-02-17 1987-02-17 タングステン合金めっき用電極の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3540687A JPS63203800A (ja) 1987-02-17 1987-02-17 タングステン合金めっき用電極の製造方法

Publications (2)

Publication Number Publication Date
JPS63203800A true JPS63203800A (ja) 1988-08-23
JPH0355558B2 JPH0355558B2 (enrdf_load_stackoverflow) 1991-08-23

Family

ID=12441009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3540687A Granted JPS63203800A (ja) 1987-02-17 1987-02-17 タングステン合金めっき用電極の製造方法

Country Status (1)

Country Link
JP (1) JPS63203800A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0347988A (ja) * 1989-07-14 1991-02-28 Nkk Corp 電極損傷度合いの小さい電気亜鉛系めっき鋼板の製造方法
JPH0499294A (ja) * 1990-08-09 1992-03-31 Daiso Co Ltd 酸素発生用陽極及びその製法
JP2009293117A (ja) * 2008-06-09 2009-12-17 Doshisha 亜鉛の電解採取用陽極および電解採取法
JP2010001556A (ja) * 2008-06-23 2010-01-07 Doshisha コバルトの電解採取用陽極および電解採取法
CN111088493A (zh) * 2019-12-26 2020-05-01 西安泰金工业电化学技术有限公司 一种钛基涂层钛阳极的制备方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100196094B1 (ko) 1992-03-11 1999-06-15 사토 히로시 산소발생전극

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4437948A (en) * 1981-10-16 1984-03-20 Bell Telephone Laboratories, Incorporated Copper plating procedure
JPS60155699A (ja) * 1983-12-27 1985-08-15 Permelec Electrode Ltd 液体給電法による金属の電解処理法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4437948A (en) * 1981-10-16 1984-03-20 Bell Telephone Laboratories, Incorporated Copper plating procedure
JPS60155699A (ja) * 1983-12-27 1985-08-15 Permelec Electrode Ltd 液体給電法による金属の電解処理法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0347988A (ja) * 1989-07-14 1991-02-28 Nkk Corp 電極損傷度合いの小さい電気亜鉛系めっき鋼板の製造方法
JPH0499294A (ja) * 1990-08-09 1992-03-31 Daiso Co Ltd 酸素発生用陽極及びその製法
JP2009293117A (ja) * 2008-06-09 2009-12-17 Doshisha 亜鉛の電解採取用陽極および電解採取法
JP2010001556A (ja) * 2008-06-23 2010-01-07 Doshisha コバルトの電解採取用陽極および電解採取法
CN111088493A (zh) * 2019-12-26 2020-05-01 西安泰金工业电化学技术有限公司 一种钛基涂层钛阳极的制备方法

Also Published As

Publication number Publication date
JPH0355558B2 (enrdf_load_stackoverflow) 1991-08-23

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