JPS6320317B2 - - Google Patents
Info
- Publication number
- JPS6320317B2 JPS6320317B2 JP6218881A JP6218881A JPS6320317B2 JP S6320317 B2 JPS6320317 B2 JP S6320317B2 JP 6218881 A JP6218881 A JP 6218881A JP 6218881 A JP6218881 A JP 6218881A JP S6320317 B2 JPS6320317 B2 JP S6320317B2
- Authority
- JP
- Japan
- Prior art keywords
- silver
- copper
- plated
- plating
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010949 copper Substances 0.000 claims description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 32
- 229910052802 copper Inorganic materials 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 26
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 22
- 239000004332 silver Substances 0.000 claims description 22
- 229910052709 silver Inorganic materials 0.000 claims description 21
- 238000007747 plating Methods 0.000 claims description 19
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 13
- 239000007864 aqueous solution Substances 0.000 claims description 10
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 claims description 8
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 229910001430 chromium ion Inorganic materials 0.000 claims description 7
- 238000005096 rolling process Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000005260 corrosion Methods 0.000 description 8
- 230000007797 corrosion Effects 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 8
- 238000007254 oxidation reaction Methods 0.000 description 8
- 239000007788 liquid Substances 0.000 description 5
- JHWIEAWILPSRMU-UHFFFAOYSA-N 2-methyl-3-pyrimidin-4-ylpropanoic acid Chemical compound OC(=O)C(C)CC1=CC=NC=N1 JHWIEAWILPSRMU-UHFFFAOYSA-N 0.000 description 4
- 239000010953 base metal Substances 0.000 description 4
- 238000005868 electrolysis reaction Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 229910001245 Sb alloy Inorganic materials 0.000 description 3
- 238000002845 discoloration Methods 0.000 description 3
- LFAGQMCIGQNPJG-UHFFFAOYSA-N silver cyanide Chemical compound [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 2
- QLOKJRIVRGCVIM-UHFFFAOYSA-N 1-[(4-methylsulfanylphenyl)methyl]piperazine Chemical compound C1=CC(SC)=CC=C1CN1CCNCC1 QLOKJRIVRGCVIM-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- ZMZDMBWJUHKJPS-UHFFFAOYSA-M Thiocyanate anion Chemical compound [S-]C#N ZMZDMBWJUHKJPS-UHFFFAOYSA-M 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229940117975 chromium trioxide Drugs 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N chromium trioxide Inorganic materials O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- GAMDZJFZMJECOS-UHFFFAOYSA-N chromium(6+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Cr+6] GAMDZJFZMJECOS-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- WBTCZEPSIIFINA-MSFWTACDSA-J dipotassium;antimony(3+);(2r,3r)-2,3-dioxidobutanedioate;trihydrate Chemical compound O.O.O.[K+].[K+].[Sb+3].[Sb+3].[O-]C(=O)[C@H]([O-])[C@@H]([O-])C([O-])=O.[O-]C(=O)[C@H]([O-])[C@@H]([O-])C([O-])=O WBTCZEPSIIFINA-MSFWTACDSA-J 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- ZMZDMBWJUHKJPS-UHFFFAOYSA-N hydrogen thiocyanate Natural products SC#N ZMZDMBWJUHKJPS-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
- 229940074439 potassium sodium tartrate Drugs 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- BSWGGJHLVUUXTL-UHFFFAOYSA-N silver zinc Chemical compound [Zn].[Ag] BSWGGJHLVUUXTL-UHFFFAOYSA-N 0.000 description 1
- PXLIDIMHPNPGMH-UHFFFAOYSA-N sodium chromate Chemical compound [Na+].[Na+].[O-][Cr]([O-])(=O)=O PXLIDIMHPNPGMH-UHFFFAOYSA-N 0.000 description 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6218881A JPS57177988A (en) | 1981-04-24 | 1981-04-24 | Manufacture of silver plated copper material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6218881A JPS57177988A (en) | 1981-04-24 | 1981-04-24 | Manufacture of silver plated copper material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57177988A JPS57177988A (en) | 1982-11-01 |
| JPS6320317B2 true JPS6320317B2 (cs) | 1988-04-27 |
Family
ID=13192908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6218881A Granted JPS57177988A (en) | 1981-04-24 | 1981-04-24 | Manufacture of silver plated copper material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57177988A (cs) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023147501A (ja) * | 2022-03-30 | 2023-10-13 | 古河電気工業株式会社 | 電気接点材料、ならびにこれを用いた接点、端子およびコネクタ |
| JP2023147500A (ja) * | 2022-03-30 | 2023-10-13 | 古河電気工業株式会社 | 電気接点材料、ならびにこれを用いた接点、端子およびコネクタ |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9102062D0 (en) * | 1991-01-31 | 1991-03-13 | Otter Controls Ltd | Improvements relating to conductors for switching applications |
| US7631798B1 (en) * | 2008-10-02 | 2009-12-15 | Ernest Long | Method for enhancing the solderability of a surface |
-
1981
- 1981-04-24 JP JP6218881A patent/JPS57177988A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023147501A (ja) * | 2022-03-30 | 2023-10-13 | 古河電気工業株式会社 | 電気接点材料、ならびにこれを用いた接点、端子およびコネクタ |
| JP2023147500A (ja) * | 2022-03-30 | 2023-10-13 | 古河電気工業株式会社 | 電気接点材料、ならびにこれを用いた接点、端子およびコネクタ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57177988A (en) | 1982-11-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3417395B2 (ja) | 半導体装置用リードフレーム及びその製造方法及びそれを用いた半導体装置 | |
| JPH0224037B2 (cs) | ||
| JPH0329879B2 (cs) | ||
| JPH08250865A (ja) | 電子ハウジングの製作に利用するシート上での金属ウイスカの形成を防止することにより電子ハウジングの信頼性をより高くする方法 | |
| JPS60106993A (ja) | はんだ接合性パラジウム−ニツケル被膜及びその製造方法 | |
| US3616280A (en) | Nonaqueous electroplating solutions and processing | |
| US3554881A (en) | Electrochemical process for the surface treatment of titanium,alloys thereof and other analogous metals | |
| US3989606A (en) | Metal plating on aluminum | |
| US3622470A (en) | Continuous plating method | |
| US3573008A (en) | Composite metal article of copper material with a coat of nickel and tin | |
| JPS6142796B2 (cs) | ||
| Pushpavanam et al. | Rhodium—Electrodeposition and applications | |
| JPS625999B2 (cs) | ||
| JPS6320317B2 (cs) | ||
| KR102295180B1 (ko) | 전기전도성, 내식성 및 내구성 향상을 위한 은-나노 합금 도금액 조성물 및 이를 이용한 도금 방법 | |
| JPS63137193A (ja) | 電子部品用ステンレス接点材料およびその製造方法 | |
| JPS5836071B2 (ja) | 銀メッキ鉄及び鉄合金の製造方法 | |
| JPH01176086A (ja) | 耐久性を有する電解用電極及びその製造方法 | |
| JPH0128106B2 (cs) | ||
| JPS6389698A (ja) | 銅箔の処理方法 | |
| JP2537108B2 (ja) | プリント回路用銅箔及びその製造方法 | |
| JPH048883B2 (cs) | ||
| TWI846573B (zh) | 鍍銀皮膜及具備該鍍銀皮膜之電接點 | |
| US2742687A (en) | Low tin content, durable, tinned copper conductor | |
| US4071417A (en) | Process for decreasing the porosity of gold |