JPS6320139Y2 - - Google Patents
Info
- Publication number
- JPS6320139Y2 JPS6320139Y2 JP4233578U JP4233578U JPS6320139Y2 JP S6320139 Y2 JPS6320139 Y2 JP S6320139Y2 JP 4233578 U JP4233578 U JP 4233578U JP 4233578 U JP4233578 U JP 4233578U JP S6320139 Y2 JPS6320139 Y2 JP S6320139Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- multilayer
- wiring board
- large current
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 13
- 239000010409 thin film Substances 0.000 claims description 10
- 239000012212 insulator Substances 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- -1 70 μm Chemical compound 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4233578U JPS6320139Y2 (en, 2012) | 1978-03-31 | 1978-03-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4233578U JPS6320139Y2 (en, 2012) | 1978-03-31 | 1978-03-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54144254U JPS54144254U (en, 2012) | 1979-10-06 |
JPS6320139Y2 true JPS6320139Y2 (en, 2012) | 1988-06-03 |
Family
ID=28914647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4233578U Expired JPS6320139Y2 (en, 2012) | 1978-03-31 | 1978-03-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6320139Y2 (en, 2012) |
-
1978
- 1978-03-31 JP JP4233578U patent/JPS6320139Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS54144254U (en, 2012) | 1979-10-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6078700B1 (ja) | プリント回路基板、回路、及び回路を製造するための方法 | |
JPH0544837B2 (en, 2012) | ||
US20040166709A1 (en) | High current, high mechanical strength connectors for insulated metal substrate circuit boards | |
JPS6366868A (ja) | 電気要素 | |
JPS6320139Y2 (en, 2012) | ||
JPS60257191A (ja) | プリント配線板 | |
JPH0754874B2 (ja) | 多層プリント配線板 | |
JPS63271996A (ja) | 大電流用プリント基板 | |
JP2001102747A (ja) | 多層基板とその製造方法および該多層基板への同軸コネクタ取り付け構造 | |
JPH0219982Y2 (en, 2012) | ||
JPH04139783A (ja) | Ic搭載用可撓性回路基板及びその製造法 | |
JPH0747897Y2 (ja) | プリント基板 | |
JPS59175788A (ja) | 導体切り出し配線板 | |
JPH0351964Y2 (en, 2012) | ||
JP2001156419A (ja) | プリント配線板およびその製造方法 | |
JP3250140B2 (ja) | 無線機のシールド装置 | |
JPS6214717Y2 (en, 2012) | ||
JPH08204299A (ja) | 配線構造 | |
JPS60128694A (ja) | 導体粉末溶解配線板 | |
JPS61264796A (ja) | 回路基板 | |
JPS58164130U (ja) | スイツチ回路板 | |
JP2973687B2 (ja) | ラジアルリード電子部品 | |
JPH03255691A (ja) | プリント配線板 | |
JPS5823955B2 (ja) | インサツハイセンバン | |
JPS6167234A (ja) | 混成集積回路のリ−ド線の接続方法 |