JPS63201070A - セラミツクの接合方法 - Google Patents
セラミツクの接合方法Info
- Publication number
- JPS63201070A JPS63201070A JP2980987A JP2980987A JPS63201070A JP S63201070 A JPS63201070 A JP S63201070A JP 2980987 A JP2980987 A JP 2980987A JP 2980987 A JP2980987 A JP 2980987A JP S63201070 A JPS63201070 A JP S63201070A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- ceramics
- foil
- brazing
- joining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims description 51
- 238000000034 method Methods 0.000 title claims description 30
- 238000005304 joining Methods 0.000 title claims description 16
- 238000005219 brazing Methods 0.000 claims description 25
- 239000011888 foil Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 18
- 229910045601 alloy Inorganic materials 0.000 claims description 14
- 239000000956 alloy Substances 0.000 claims description 14
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 238000001465 metallisation Methods 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 description 21
- 239000002184 metal Substances 0.000 description 21
- 150000002739 metals Chemical class 0.000 description 9
- 239000010936 titanium Substances 0.000 description 8
- 239000010949 copper Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 238000010791 quenching Methods 0.000 description 4
- 239000000470 constituent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229910020598 Co Fe Inorganic materials 0.000 description 1
- 229910002519 Co-Fe Inorganic materials 0.000 description 1
- 229910017945 Cu—Ti Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2980987A JPS63201070A (ja) | 1987-02-13 | 1987-02-13 | セラミツクの接合方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2980987A JPS63201070A (ja) | 1987-02-13 | 1987-02-13 | セラミツクの接合方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63201070A true JPS63201070A (ja) | 1988-08-19 |
JPH0475871B2 JPH0475871B2 (enrdf_load_stackoverflow) | 1992-12-02 |
Family
ID=12286351
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2980987A Granted JPS63201070A (ja) | 1987-02-13 | 1987-02-13 | セラミツクの接合方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63201070A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04321572A (ja) * | 1990-11-13 | 1992-11-11 | Endress & Hauser Gmbh & Co | 圧力センサ |
JP2006327888A (ja) * | 2005-05-27 | 2006-12-07 | Nissan Motor Co Ltd | セラミックスと金属のろう付け構造体 |
JP2022056203A (ja) * | 2020-09-29 | 2022-04-08 | 株式会社フェローテックホールディングス | 接合基板および接合方法 |
-
1987
- 1987-02-13 JP JP2980987A patent/JPS63201070A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04321572A (ja) * | 1990-11-13 | 1992-11-11 | Endress & Hauser Gmbh & Co | 圧力センサ |
JP2006327888A (ja) * | 2005-05-27 | 2006-12-07 | Nissan Motor Co Ltd | セラミックスと金属のろう付け構造体 |
JP2022056203A (ja) * | 2020-09-29 | 2022-04-08 | 株式会社フェローテックホールディングス | 接合基板および接合方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0475871B2 (enrdf_load_stackoverflow) | 1992-12-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4117968A (en) | Method for soldering metals with superhard man-made materials | |
US4217137A (en) | Gold based alloy composition and brazing therewith, particularly for ceramic-metal seals in electrical feedthroughs | |
EP0005312B1 (en) | Gold alloys, a method of brazing and articles formed thereby | |
US4797328A (en) | Soft-solder alloy for bonding ceramic articles | |
US4121750A (en) | Processes for soldering aluminum-containing workpieces | |
CN106141494B (zh) | 用于钎焊钼铼合金箔材的钎料及制备方法和钎焊工艺 | |
US4859531A (en) | Method for bonding a cubic boron nitride sintered compact | |
US4580714A (en) | Hard solder alloy for bonding oxide ceramics to one another or to metals | |
JPS63201070A (ja) | セラミツクの接合方法 | |
JPS62137193A (ja) | 保存寿命を改良したはんだ付け用合金及びその製造方法及びはんだ付け法 | |
JPS62296991A (ja) | 界面活性添加物により湿潤性が改良された低融点はんだ | |
JPS63169348A (ja) | セラミツク接合用アモルフアス合金箔 | |
JPH02215140A (ja) | 半導体素子用金合金細線及びその接合方法 | |
CN115070258A (zh) | 一种锆基非晶合金钎料及其制备方法和应用 | |
CN112621020B (zh) | 一种镍基药芯钎料、制备方法及应用 | |
JPH02108493A (ja) | セラミックス接合材 | |
JPS6228067A (ja) | セラミツクスの接合方法 | |
JPS62263895A (ja) | ろう材 | |
JPH0339030B2 (enrdf_load_stackoverflow) | ||
EP1591191B1 (en) | Joining method by Au-Sn brazing material, its thickness being i.a. dependent on the Sn-content | |
JPS6134917B2 (enrdf_load_stackoverflow) | ||
JPH0649620B2 (ja) | セラミツクス部材と金属部材との接合方法 | |
JPH0215874A (ja) | 金属とセラミックの接合方法及び接合材 | |
JPH0450107B2 (enrdf_load_stackoverflow) | ||
JPS62275596A (ja) | ろう材 |