JPS6320017B2 - - Google Patents

Info

Publication number
JPS6320017B2
JPS6320017B2 JP57180352A JP18035282A JPS6320017B2 JP S6320017 B2 JPS6320017 B2 JP S6320017B2 JP 57180352 A JP57180352 A JP 57180352A JP 18035282 A JP18035282 A JP 18035282A JP S6320017 B2 JPS6320017 B2 JP S6320017B2
Authority
JP
Japan
Prior art keywords
region
wafer
isolation region
recess
island
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57180352A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5969944A (ja
Inventor
Masahiro Ogino
Shunichi Sato
Takeshi Sugihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP57180352A priority Critical patent/JPS5969944A/ja
Publication of JPS5969944A publication Critical patent/JPS5969944A/ja
Publication of JPS6320017B2 publication Critical patent/JPS6320017B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/764—Air gaps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
    • H01L21/76286—Lateral isolation by refilling of trenches with polycristalline material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
    • H01L21/76289—Lateral isolation by air gap

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Bipolar Transistors (AREA)
  • Element Separation (AREA)
  • Bipolar Integrated Circuits (AREA)
JP57180352A 1982-10-14 1982-10-14 底面絶縁体分離集積回路の製造方法 Granted JPS5969944A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57180352A JPS5969944A (ja) 1982-10-14 1982-10-14 底面絶縁体分離集積回路の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57180352A JPS5969944A (ja) 1982-10-14 1982-10-14 底面絶縁体分離集積回路の製造方法

Publications (2)

Publication Number Publication Date
JPS5969944A JPS5969944A (ja) 1984-04-20
JPS6320017B2 true JPS6320017B2 (enrdf_load_stackoverflow) 1988-04-26

Family

ID=16081730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57180352A Granted JPS5969944A (ja) 1982-10-14 1982-10-14 底面絶縁体分離集積回路の製造方法

Country Status (1)

Country Link
JP (1) JPS5969944A (enrdf_load_stackoverflow)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6080243A (ja) * 1983-10-08 1985-05-08 Nippon Telegr & Teleph Corp <Ntt> 半導体装置およびその製造方法
JPH077797B2 (ja) * 1984-11-14 1995-01-30 株式会社日立製作所 誘電体分離基体
JPS61296735A (ja) * 1985-06-25 1986-12-27 Nec Corp 半導体装置とその製造方法
JPS63120437A (ja) * 1986-11-10 1988-05-24 Agency Of Ind Science & Technol 半導体集積回路構造
JPS6450555A (en) * 1987-08-21 1989-02-27 Nec Corp Complementary mos transistor
JP2819582B2 (ja) * 1989-02-06 1998-10-30 日本電気株式会社 半導体装置の製造方法
GB9305448D0 (en) * 1993-03-17 1993-05-05 British Tech Group Semiconductor structure and method of manufacturing same
JP2001226586A (ja) * 2000-02-16 2001-08-21 Hitachi Chem Co Ltd 補強ウェハの製造方法及び電子部品
JP4973328B2 (ja) * 2007-06-14 2012-07-11 株式会社デンソー 半導体装置
JP4600563B2 (ja) * 2007-10-24 2010-12-15 株式会社デンソー 半導体装置及びその製造方法
US8710568B2 (en) 2007-10-24 2014-04-29 Denso Corporation Semiconductor device having a plurality of elements on one semiconductor substrate and method of manufacturing the same

Also Published As

Publication number Publication date
JPS5969944A (ja) 1984-04-20

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