JPS63199423A - 半導体基板表面処理方法 - Google Patents

半導体基板表面処理方法

Info

Publication number
JPS63199423A
JPS63199423A JP62032859A JP3285987A JPS63199423A JP S63199423 A JPS63199423 A JP S63199423A JP 62032859 A JP62032859 A JP 62032859A JP 3285987 A JP3285987 A JP 3285987A JP S63199423 A JPS63199423 A JP S63199423A
Authority
JP
Japan
Prior art keywords
hmds
semiconductor substrate
vapor
hexamethyldisilazane
evaporator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62032859A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0426780B2 (enExample
Inventor
Yukio Imoto
幸男 井本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62032859A priority Critical patent/JPS63199423A/ja
Publication of JPS63199423A publication Critical patent/JPS63199423A/ja
Publication of JPH0426780B2 publication Critical patent/JPH0426780B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP62032859A 1987-02-16 1987-02-16 半導体基板表面処理方法 Granted JPS63199423A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62032859A JPS63199423A (ja) 1987-02-16 1987-02-16 半導体基板表面処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62032859A JPS63199423A (ja) 1987-02-16 1987-02-16 半導体基板表面処理方法

Publications (2)

Publication Number Publication Date
JPS63199423A true JPS63199423A (ja) 1988-08-17
JPH0426780B2 JPH0426780B2 (enExample) 1992-05-08

Family

ID=12370570

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62032859A Granted JPS63199423A (ja) 1987-02-16 1987-02-16 半導体基板表面処理方法

Country Status (1)

Country Link
JP (1) JPS63199423A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5069930A (en) * 1988-09-30 1991-12-03 Leybold Aktiengesellschaft Method for the evaporation of monomers that are liquid at room temperature
JPH06228592A (ja) * 1992-11-25 1994-08-16 Air Prod And Chem Inc 基板の金属含有汚染物質清浄化用ガス状清浄剤及びこれを用いた基板の清浄化方法
KR100856331B1 (ko) 2007-05-21 2008-09-04 주식회사 케이씨텍 건조제 공급장치
JP2008276429A (ja) * 2007-04-27 2008-11-13 Dx Antenna Co Ltd 電子機器における押しボタン構造
JP2009194246A (ja) * 2008-02-15 2009-08-27 Tokyo Electron Ltd 気化装置、基板処理装置、基板処理方法並びに記憶媒体
JP2015201562A (ja) * 2014-04-09 2015-11-12 株式会社ディスコ 保護膜形成方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102871133B1 (ko) * 2019-05-09 2025-10-15 나믹스 가부시끼가이샤 복합 구리 부재

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5255969A (en) * 1975-09-26 1977-05-07 Albany Int Corp Apparatus for emitting controlled steam
JPS558583A (en) * 1979-03-02 1980-01-22 Toshiba Corp Steam generator
JPS5753933A (en) * 1980-09-18 1982-03-31 Toshiba Corp Manufacture of semiconductor element
JPS58190027A (ja) * 1982-04-30 1983-11-05 Nec Kyushu Ltd 半導体基板有機処理装置
JPS5929679U (ja) * 1982-08-18 1984-02-24 三洋電機株式会社 蒸発装置
JPS59175122A (ja) * 1983-03-23 1984-10-03 Nec Corp 半導体基板塗布前処理装置
JPS59228719A (ja) * 1983-06-10 1984-12-22 Hitachi Tokyo Electronics Co Ltd 電子部品の製造方法および製造装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5255969A (en) * 1975-09-26 1977-05-07 Albany Int Corp Apparatus for emitting controlled steam
JPS558583A (en) * 1979-03-02 1980-01-22 Toshiba Corp Steam generator
JPS5753933A (en) * 1980-09-18 1982-03-31 Toshiba Corp Manufacture of semiconductor element
JPS58190027A (ja) * 1982-04-30 1983-11-05 Nec Kyushu Ltd 半導体基板有機処理装置
JPS5929679U (ja) * 1982-08-18 1984-02-24 三洋電機株式会社 蒸発装置
JPS59175122A (ja) * 1983-03-23 1984-10-03 Nec Corp 半導体基板塗布前処理装置
JPS59228719A (ja) * 1983-06-10 1984-12-22 Hitachi Tokyo Electronics Co Ltd 電子部品の製造方法および製造装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5069930A (en) * 1988-09-30 1991-12-03 Leybold Aktiengesellschaft Method for the evaporation of monomers that are liquid at room temperature
JPH06228592A (ja) * 1992-11-25 1994-08-16 Air Prod And Chem Inc 基板の金属含有汚染物質清浄化用ガス状清浄剤及びこれを用いた基板の清浄化方法
EP0605785A3 (en) * 1992-11-25 1994-11-02 Air Prod & Chem Cleaning for the removal of metal contaminants from integrated circuit assemblies.
JP2008276429A (ja) * 2007-04-27 2008-11-13 Dx Antenna Co Ltd 電子機器における押しボタン構造
KR100856331B1 (ko) 2007-05-21 2008-09-04 주식회사 케이씨텍 건조제 공급장치
JP2009194246A (ja) * 2008-02-15 2009-08-27 Tokyo Electron Ltd 気化装置、基板処理装置、基板処理方法並びに記憶媒体
JP2015201562A (ja) * 2014-04-09 2015-11-12 株式会社ディスコ 保護膜形成方法

Also Published As

Publication number Publication date
JPH0426780B2 (enExample) 1992-05-08

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