JPH0426780B2 - - Google Patents

Info

Publication number
JPH0426780B2
JPH0426780B2 JP62032859A JP3285987A JPH0426780B2 JP H0426780 B2 JPH0426780 B2 JP H0426780B2 JP 62032859 A JP62032859 A JP 62032859A JP 3285987 A JP3285987 A JP 3285987A JP H0426780 B2 JPH0426780 B2 JP H0426780B2
Authority
JP
Japan
Prior art keywords
vapor
hmds
semiconductor substrate
substrate
hexamethyldisilazane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62032859A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63199423A (ja
Inventor
Yukio Imoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP62032859A priority Critical patent/JPS63199423A/ja
Publication of JPS63199423A publication Critical patent/JPS63199423A/ja
Publication of JPH0426780B2 publication Critical patent/JPH0426780B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP62032859A 1987-02-16 1987-02-16 半導体基板表面処理方法 Granted JPS63199423A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62032859A JPS63199423A (ja) 1987-02-16 1987-02-16 半導体基板表面処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62032859A JPS63199423A (ja) 1987-02-16 1987-02-16 半導体基板表面処理方法

Publications (2)

Publication Number Publication Date
JPS63199423A JPS63199423A (ja) 1988-08-17
JPH0426780B2 true JPH0426780B2 (enExample) 1992-05-08

Family

ID=12370570

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62032859A Granted JPS63199423A (ja) 1987-02-16 1987-02-16 半導体基板表面処理方法

Country Status (1)

Country Link
JP (1) JPS63199423A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020226160A1 (ja) * 2019-05-09 2020-11-12 ナミックス株式会社 複合銅部材

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3833232A1 (de) * 1988-09-30 1990-04-05 Leybold Ag Verfahren und vorrichtung zum verdampfen von bei raumtemperatur fluessigen monomeren
US5332444A (en) * 1992-11-25 1994-07-26 Air Products And Chemicals, Inc. Gas phase cleaning agents for removing metal containing contaminants from integrated circuit assemblies and a process for using the same
JP4901572B2 (ja) * 2007-04-27 2012-03-21 Ｄｘアンテナ株式会社 電子機器における押しボタン構造
KR100856331B1 (ko) 2007-05-21 2008-09-04 주식회사 케이씨텍 건조제 공급장치
JP4952610B2 (ja) * 2008-02-15 2012-06-13 東京エレクトロン株式会社 基板処理装置、基板処理方法並びに記憶媒体
JP6298690B2 (ja) * 2014-04-09 2018-03-20 株式会社ディスコ 保護膜形成方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AR220507A1 (es) * 1975-09-26 1980-11-14 Albany Int Corp Dispositivo para esparcir un material vaporizable por difusion de vapor,en una proporcion predeterminada
JPS558583A (en) * 1979-03-02 1980-01-22 Toshiba Corp Steam generator
JPS5753933A (en) * 1980-09-18 1982-03-31 Toshiba Corp Manufacture of semiconductor element
JPS58190027A (ja) * 1982-04-30 1983-11-05 Nec Kyushu Ltd 半導体基板有機処理装置
JPS5929679U (ja) * 1982-08-18 1984-02-24 三洋電機株式会社 蒸発装置
JPS59175122A (ja) * 1983-03-23 1984-10-03 Nec Corp 半導体基板塗布前処理装置
JPS59228719A (ja) * 1983-06-10 1984-12-22 Hitachi Tokyo Electronics Co Ltd 電子部品の製造方法および製造装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020226160A1 (ja) * 2019-05-09 2020-11-12 ナミックス株式会社 複合銅部材

Also Published As

Publication number Publication date
JPS63199423A (ja) 1988-08-17

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