JPS63187372U - - Google Patents

Info

Publication number
JPS63187372U
JPS63187372U JP7907887U JP7907887U JPS63187372U JP S63187372 U JPS63187372 U JP S63187372U JP 7907887 U JP7907887 U JP 7907887U JP 7907887 U JP7907887 U JP 7907887U JP S63187372 U JPS63187372 U JP S63187372U
Authority
JP
Japan
Prior art keywords
electrode
wiring conductor
electronic component
solder
melts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7907887U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7907887U priority Critical patent/JPS63187372U/ja
Publication of JPS63187372U publication Critical patent/JPS63187372U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案による一実施例を示す要部側面
図、第2図は従来の電子部品とプリント基板の接
合状態を示す側面図、第3図は従来の電子部品の
接合不良を示す側面図である。 1:素子、2:リード端子、3:プリント基板
、4:配線、5:ハンダ、6:保護膜。
Fig. 1 is a side view of a main part showing an embodiment of the present invention, Fig. 2 is a side view showing a state of bonding between a conventional electronic component and a printed circuit board, and Fig. 3 is a side view showing a bonding failure of a conventional electronic component. It is a diagram. 1: Element, 2: Lead terminal, 3: Printed circuit board, 4: Wiring, 5: Solder, 6: Protective film.

Claims (1)

【実用新案登録請求の範囲】 電子部品を配線導体と電気的接続するために導
出された電極において、 少なくとも配線導体と対向する電極表面を、ハ
ンダ溶融点より低い温度で溶融する保護膜で被つ
てなることを特徴とする電極の保護構造。
[Claims for Utility Model Registration] In an electrode derived for electrically connecting an electronic component to a wiring conductor, at least the surface of the electrode facing the wiring conductor is covered with a protective film that melts at a temperature lower than the melting point of solder. A protective structure for an electrode characterized by:
JP7907887U 1987-05-25 1987-05-25 Pending JPS63187372U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7907887U JPS63187372U (en) 1987-05-25 1987-05-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7907887U JPS63187372U (en) 1987-05-25 1987-05-25

Publications (1)

Publication Number Publication Date
JPS63187372U true JPS63187372U (en) 1988-11-30

Family

ID=30928609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7907887U Pending JPS63187372U (en) 1987-05-25 1987-05-25

Country Status (1)

Country Link
JP (1) JPS63187372U (en)

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