JPS6318334B2 - - Google Patents

Info

Publication number
JPS6318334B2
JPS6318334B2 JP58119404A JP11940483A JPS6318334B2 JP S6318334 B2 JPS6318334 B2 JP S6318334B2 JP 58119404 A JP58119404 A JP 58119404A JP 11940483 A JP11940483 A JP 11940483A JP S6318334 B2 JPS6318334 B2 JP S6318334B2
Authority
JP
Japan
Prior art keywords
diode
large diameter
diameter portion
electrode
diameter part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58119404A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6010761A (ja
Inventor
Kazunao Kudo
Hiromi Koyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP58119404A priority Critical patent/JPS6010761A/ja
Publication of JPS6010761A publication Critical patent/JPS6010761A/ja
Publication of JPS6318334B2 publication Critical patent/JPS6318334B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/00
    • H10W70/20

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP58119404A 1983-06-30 1983-06-30 ダイオ−ド電極部品 Granted JPS6010761A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58119404A JPS6010761A (ja) 1983-06-30 1983-06-30 ダイオ−ド電極部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58119404A JPS6010761A (ja) 1983-06-30 1983-06-30 ダイオ−ド電極部品

Publications (2)

Publication Number Publication Date
JPS6010761A JPS6010761A (ja) 1985-01-19
JPS6318334B2 true JPS6318334B2 (index.php) 1988-04-18

Family

ID=14760640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58119404A Granted JPS6010761A (ja) 1983-06-30 1983-06-30 ダイオ−ド電極部品

Country Status (1)

Country Link
JP (1) JPS6010761A (index.php)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61182040U (index.php) * 1985-04-30 1986-11-13
JPS62188791A (ja) * 1986-02-15 1987-08-18 Nishimura Watanabe Chiyuushiyutsu Kenkyusho:Kk Ni,Co,Zn,Cu,Mn及びCrの電解採取方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5883154U (ja) * 1981-11-30 1983-06-06 日本電気ホームエレクトロニクス株式会社 電子部品

Also Published As

Publication number Publication date
JPS6010761A (ja) 1985-01-19

Similar Documents

Publication Publication Date Title
JPS632332A (ja) ダイボンデイングプロセス
US6518653B1 (en) Lead frame and semiconductor device
JPS6318334B2 (index.php)
US6512674B1 (en) Package for semiconductor device having radiating substrate and radiator fin
JP3427492B2 (ja) 凸型ヒートシンク付き半導体装置及びその凸型ヒートシンクの製造方法
JPS63102326A (ja) クラツド材
JPS637029B2 (index.php)
JPH0758138A (ja) ワイヤボンディング構造およびそのボンディング方法
JP2895975B2 (ja) セラミックパッケージ
JPS6347341B2 (index.php)
JPS6125252Y2 (index.php)
JPS62287657A (ja) 半導体装置
JPH06268093A (ja) セラミックパッケージ型半導体装置
JPH0621304A (ja) リードフレーム及び半導体装置の製造方法
JP2808955B2 (ja) 複合リードフレーム
JPS6225906Y2 (index.php)
JPS60106370U (ja) 外部リ−ド端子の取付構造
JPH0341475Y2 (index.php)
JPS5844597Y2 (ja) Icパツケ−ジ用リ−ド構造
JPS607750A (ja) 絶縁型半導体装置
JPS5915386B2 (ja) 半導体装置用ヘッダの製造方法
JPS6032775Y2 (ja) 気密端子
JPH0155578B2 (index.php)
JPH07122668A (ja) 半導体装置及びそのパッケージ
JPH0883817A (ja) 半導体集積回路およびその製造方法