JPS63180996U - - Google Patents
Info
- Publication number
- JPS63180996U JPS63180996U JP7212087U JP7212087U JPS63180996U JP S63180996 U JPS63180996 U JP S63180996U JP 7212087 U JP7212087 U JP 7212087U JP 7212087 U JP7212087 U JP 7212087U JP S63180996 U JPS63180996 U JP S63180996U
- Authority
- JP
- Japan
- Prior art keywords
- board
- electronic
- view
- electronic devices
- electronic circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の一実施例に於ける側面図、第
２図は本体基板部分の平面図、第３図は基板部分
の平面図、第４図は組立・構成を拡大して示す側
面図、第５図はチツプ電子部品の一例の斜視図、
第６図は他のチツプ電子部品の斜視図、第７図は
他の組立・構成を示す側面図、第８図は従来例の
側面図である。
１……基板、２……本体基板、４……パワート
ランジスタ、６……半導体ＩＣ、１１……チツプ
電子部品、１４……孔、１５……ハンダ、１７…
…ハンダ付けランド、１９……角型チツプ電子部
品。
Fig. 1 is a side view of an embodiment of the present invention, Fig. 2 is a plan view of the main body board portion, Fig. 3 is a plan view of the board portion, and Fig. 4 is a side view showing an enlarged assembly and configuration. Figure 5 is a perspective view of an example of a chip electronic component.
FIG. 6 is a perspective view of another chip electronic component, FIG. 7 is a side view showing another assembly/configuration, and FIG. 8 is a side view of a conventional example. DESCRIPTION OF SYMBOLS 1... Board, 2... Main board, 4... Power transistor, 6... Semiconductor IC, 11... Chip electronic component, 14... Hole, 15... Solder, 17...
...Soldering land, 19...Square chip electronic component.
Claims (1)
バイスを搭載して電子回路を構成した基板をリー
ドレスチツプ電子部品を介して電気的・機械的に
接続・固定して成る電子回路装置。 An electronic circuit device consisting of a board on which power electronic devices are mounted, and a board on which electronic devices are mounted to form an electronic circuit, which are electrically and mechanically connected and fixed via leadless chip electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7212087U JPS63180996U (en) | 1987-05-14 | 1987-05-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7212087U JPS63180996U (en) | 1987-05-14 | 1987-05-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63180996U true JPS63180996U (en) | 1988-11-22 |
Family
ID=30915293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7212087U Pending JPS63180996U (en) | 1987-05-14 | 1987-05-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63180996U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5722267B2 (en) * | 1974-06-03 | 1982-05-12 | ||
| JPS5920675B2 (en) * | 1975-06-05 | 1984-05-15 | 久光製薬 （株） | Method for producing a novel pyrimido[4,5-d]pyrimidine derivative |
-
1987
- 1987-05-14 JP JP7212087U patent/JPS63180996U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5722267B2 (en) * | 1974-06-03 | 1982-05-12 | ||
| JPS5920675B2 (en) * | 1975-06-05 | 1984-05-15 | 久光製薬 （株） | Method for producing a novel pyrimido[4,5-d]pyrimidine derivative |