JPS6317980A - ウエハ貼着用粘着シ−ト - Google Patents

ウエハ貼着用粘着シ−ト

Info

Publication number
JPS6317980A
JPS6317980A JP61161680A JP16168086A JPS6317980A JP S6317980 A JPS6317980 A JP S6317980A JP 61161680 A JP61161680 A JP 61161680A JP 16168086 A JP16168086 A JP 16168086A JP S6317980 A JPS6317980 A JP S6317980A
Authority
JP
Japan
Prior art keywords
adhesive
adhesive sheet
wafer
radiation
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61161680A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0258306B2 (ref
Inventor
Kazuyoshi Ebe
和義 江部
Hiroaki Narita
博昭 成田
Katsuhisa Taguchi
田口　克久
Yoshitaka Akeda
明田　好孝
Takanori Saito
斉藤　隆則
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
F S K KK
FSK Corp
Original Assignee
F S K KK
FSK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by F S K KK, FSK Corp filed Critical F S K KK
Priority to JP61161680A priority Critical patent/JPS6317980A/ja
Priority to DE19863639266 priority patent/DE3639266A1/de
Priority to US06/932,210 priority patent/US4756968A/en
Priority to PH34523A priority patent/PH23580A/en
Priority to MYPI86000164A priority patent/MY100214A/en
Priority to KR1019860010787A priority patent/KR910007086B1/ko
Priority to NL8603269A priority patent/NL191241C/xx
Priority to FR8618037A priority patent/FR2592390B1/fr
Priority to GB8630956A priority patent/GB2184741B/en
Priority to US07/111,849 priority patent/US4965127A/en
Publication of JPS6317980A publication Critical patent/JPS6317980A/ja
Priority to MYPI89000327A priority patent/MY104709A/en
Priority to GB8916855A priority patent/GB2221468B/en
Priority to GB8916856A priority patent/GB2221469B/en
Priority to GB8916857A priority patent/GB2221470B/en
Priority to US07/549,496 priority patent/US5187007A/en
Publication of JPH0258306B2 publication Critical patent/JPH0258306B2/ja
Priority to SG1143/92A priority patent/SG114392G/en
Priority to SG1146/92A priority patent/SG114692G/en
Priority to SG1145/92A priority patent/SG114592G/en
Priority to SG1144/92A priority patent/SG114492G/en
Priority to HK1057/92A priority patent/HK105792A/xx
Priority to HK1055/92A priority patent/HK105592A/xx
Priority to HK1054/92A priority patent/HK105492A/xx
Priority to HK1056/92A priority patent/HK105692A/xx
Priority to NL9302148A priority patent/NL9302148A/nl
Priority to NL9302147A priority patent/NL9302147A/nl
Priority to NL9302150A priority patent/NL193617C/nl
Priority to NL9302149A priority patent/NL9302149A/nl
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Adhesive Tapes (AREA)
  • Dicing (AREA)
JP61161680A 1985-12-27 1986-07-09 ウエハ貼着用粘着シ−ト Granted JPS6317980A (ja)

Priority Applications (27)

Application Number Priority Date Filing Date Title
JP61161680A JPS6317980A (ja) 1986-07-09 1986-07-09 ウエハ貼着用粘着シ−ト
DE19863639266 DE3639266A1 (de) 1985-12-27 1986-11-17 Haftfolie
US06/932,210 US4756968A (en) 1985-12-27 1986-11-18 Adhesive sheets
PH34523A PH23580A (en) 1985-12-27 1986-11-24 Adhesive sheet
MYPI86000164A MY100214A (en) 1985-12-27 1986-12-02 Adhesive sheet
KR1019860010787A KR910007086B1 (ko) 1985-12-27 1986-12-15 점착시이트
NL8603269A NL191241C (nl) 1985-12-27 1986-12-23 Kleefvel voor halfgeleiders.
FR8618037A FR2592390B1 (fr) 1985-12-27 1986-12-23 Feuille adhesive utilisable notamment pour le decoupage de pastilles semiconductrices sous la forme de microplaquettes
GB8630956A GB2184741B (en) 1985-12-27 1986-12-29 Adhesive sheet suitable for use in the preparation of semiconductor chips
US07/111,849 US4965127A (en) 1985-12-27 1987-10-22 Adhesive sheets
MYPI89000327A MY104709A (en) 1985-12-27 1989-05-15 Adhesive sheet.
GB8916857A GB2221470B (en) 1985-12-27 1989-07-24 Adhesive sheet suitable for semiconductor wafer processing
GB8916856A GB2221469B (en) 1985-12-27 1989-07-24 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
GB8916855A GB2221468B (en) 1985-12-27 1989-07-24 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
US07/549,496 US5187007A (en) 1985-12-27 1990-06-29 Adhesive sheets
SG1143/92A SG114392G (en) 1985-12-27 1992-11-02 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
SG1146/92A SG114692G (en) 1985-12-27 1992-11-02 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
SG1145/92A SG114592G (en) 1985-12-27 1992-11-02 Adhesive sheet suitable for semiconductor wafer processing
SG1144/92A SG114492G (en) 1985-12-27 1992-11-02 Adhesive sheet suitable for use in the preparation of semiconductor chips
HK1056/92A HK105692A (en) 1985-12-27 1992-12-31 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
HK1054/92A HK105492A (en) 1985-12-27 1992-12-31 Adhesive sheet suitable for semiconductor wafer processing
HK1057/92A HK105792A (en) 1985-12-27 1992-12-31 Adhesive sheet suitable for use in the preparation of semiconductor chips
HK1055/92A HK105592A (en) 1985-12-27 1992-12-31 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
NL9302148A NL9302148A (nl) 1985-12-27 1993-12-09 Kleefvel voor halfgeleiders.
NL9302147A NL9302147A (nl) 1985-12-27 1993-12-09 Kleefvel voor halfgeleiders.
NL9302150A NL193617C (nl) 1985-12-27 1993-12-09 Kleefvel voor halfgeleiders.
NL9302149A NL9302149A (nl) 1985-12-27 1993-12-09 Kleefvel voor halfgeleiders.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61161680A JPS6317980A (ja) 1986-07-09 1986-07-09 ウエハ貼着用粘着シ−ト

Publications (2)

Publication Number Publication Date
JPS6317980A true JPS6317980A (ja) 1988-01-25
JPH0258306B2 JPH0258306B2 (ref) 1990-12-07

Family

ID=15739800

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61161680A Granted JPS6317980A (ja) 1985-12-27 1986-07-09 ウエハ貼着用粘着シ−ト

Country Status (1)

Country Link
JP (1) JPS6317980A (ref)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4999242A (en) * 1987-07-08 1991-03-12 Furukawa Electric Co., Ltd. Radiation-curable adhesive tape
JPH0366772A (ja) * 1989-08-05 1991-03-22 Furukawa Electric Co Ltd:The 放射線硬化性粘着テープ
JPH03221647A (ja) * 1990-01-25 1991-09-30 Matetsukusu:Kk コンクリート構造体の形成方法及びコンクリート構造体
JPH03260246A (ja) * 1990-03-09 1991-11-20 Matetsukusu:Kk 軽量コンクリート成形体の形成方法及び軽量コンクリート成形体
JP2001168064A (ja) * 1999-12-09 2001-06-22 Disco Abrasive Syst Ltd ペレット押上部材及びペレットピックアップ装置
JP2006522475A (ja) * 2003-04-02 2006-09-28 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 可撓性電子装置及び可撓性装置を製造する方法
WO2020262482A1 (ja) 2019-06-24 2020-12-30 日本ポリエチレン株式会社 フィルム状成形体用樹脂及びそれからなる成形品

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5991182A (ja) * 1982-11-17 1984-05-25 Nitto Electric Ind Co Ltd 感圧性接着テ−プ類の製造法
JPS60196956A (ja) * 1984-03-12 1985-10-05 Nitto Electric Ind Co Ltd 半導体ウエハ固定用接着薄板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5991182A (ja) * 1982-11-17 1984-05-25 Nitto Electric Ind Co Ltd 感圧性接着テ−プ類の製造法
JPS60196956A (ja) * 1984-03-12 1985-10-05 Nitto Electric Ind Co Ltd 半導体ウエハ固定用接着薄板

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4999242A (en) * 1987-07-08 1991-03-12 Furukawa Electric Co., Ltd. Radiation-curable adhesive tape
JPH0366772A (ja) * 1989-08-05 1991-03-22 Furukawa Electric Co Ltd:The 放射線硬化性粘着テープ
JPH03221647A (ja) * 1990-01-25 1991-09-30 Matetsukusu:Kk コンクリート構造体の形成方法及びコンクリート構造体
JPH03260246A (ja) * 1990-03-09 1991-11-20 Matetsukusu:Kk 軽量コンクリート成形体の形成方法及び軽量コンクリート成形体
JP2001168064A (ja) * 1999-12-09 2001-06-22 Disco Abrasive Syst Ltd ペレット押上部材及びペレットピックアップ装置
JP2006522475A (ja) * 2003-04-02 2006-09-28 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 可撓性電子装置及び可撓性装置を製造する方法
US7951687B2 (en) 2003-04-02 2011-05-31 Polymer Vision Limited Method of manufacturing a flexible electronic device and flexible device
WO2020262482A1 (ja) 2019-06-24 2020-12-30 日本ポリエチレン株式会社 フィルム状成形体用樹脂及びそれからなる成形品

Also Published As

Publication number Publication date
JPH0258306B2 (ref) 1990-12-07

Similar Documents

Publication Publication Date Title
US4965127A (en) Adhesive sheets
US5187007A (en) Adhesive sheets
JP2601956B2 (ja) 再剥離型粘着性ポリマー
JP3388674B2 (ja) エネルギー線硬化型感圧接着剤組成物およびその利用方法
JP2726350B2 (ja) ウェハ貼着用粘着シート
JPH0827239A (ja) エネルギー線硬化型感圧粘着剤組成物およびその利用方法
JPS6317981A (ja) 粘着シ−ト
JPS62153377A (ja) ウェハダイシング用粘着シート
JPS62153376A (ja) ウェハダイシング用粘着シート
JPH08188757A (ja) 半導体ウエハ加工用粘着シート
JPS6317980A (ja) ウエハ貼着用粘着シ−ト
JPH0786212A (ja) ウェハ貼着用粘着シート
GB2221469A (en) Adhesive sheet suitable for use in dicing semiconductor wafers into chips
JP3073239B2 (ja) ウェハ貼着用粘着シート
JP2005235795A (ja) 半導体ウエハ加工用粘着テープ
JPS63299246A (ja) ウェハ貼着用粘着シ−ト
JP2545170B2 (ja) ウェハ貼着用粘着シ―トおよびウェハダイシング方法
JP2728333B2 (ja) ウェハ貼着用粘着シートおよびチップのピックアップ方法
JPH10310748A (ja) 半導体ウエハ加工用粘着シート
JPH0214384B2 (ref)
JPH1161065A (ja) 半導体ウエハ加工用粘着シート
JPH057168B2 (ref)
JPS63193981A (ja) ウエハ貼着用粘着シ−ト
JPS62153375A (ja) ウエハダイシング用粘着シート
JP2000328023A (ja) 粘着シート

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term