JPS6317851B2 - - Google Patents

Info

Publication number
JPS6317851B2
JPS6317851B2 JP59245208A JP24520884A JPS6317851B2 JP S6317851 B2 JPS6317851 B2 JP S6317851B2 JP 59245208 A JP59245208 A JP 59245208A JP 24520884 A JP24520884 A JP 24520884A JP S6317851 B2 JPS6317851 B2 JP S6317851B2
Authority
JP
Japan
Prior art keywords
curing
resin
moisture
adhesion
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59245208A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61123620A (ja
Inventor
Isami Saito
Tatenobu Arai
Susumu Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59245208A priority Critical patent/JPS61123620A/ja
Publication of JPS61123620A publication Critical patent/JPS61123620A/ja
Publication of JPS6317851B2 publication Critical patent/JPS6317851B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP59245208A 1984-11-20 1984-11-20 樹脂組成物 Granted JPS61123620A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59245208A JPS61123620A (ja) 1984-11-20 1984-11-20 樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59245208A JPS61123620A (ja) 1984-11-20 1984-11-20 樹脂組成物

Publications (2)

Publication Number Publication Date
JPS61123620A JPS61123620A (ja) 1986-06-11
JPS6317851B2 true JPS6317851B2 (enExample) 1988-04-15

Family

ID=17130230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59245208A Granted JPS61123620A (ja) 1984-11-20 1984-11-20 樹脂組成物

Country Status (1)

Country Link
JP (1) JPS61123620A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4877440A (en) * 1985-05-29 1989-10-31 E. I. Du Pont De Nemours And Company Thiophenesulfonamide herbicides
US8450148B2 (en) 2006-12-14 2013-05-28 Infineon Technologies, Ag Molding compound adhesion for map-molded flip-chip

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57155753A (en) * 1981-03-20 1982-09-25 Mitsubishi Electric Corp Sealing resin compound for semiconductor

Also Published As

Publication number Publication date
JPS61123620A (ja) 1986-06-11

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