JPS63177960A - リフロ−はんだ付け装置 - Google Patents

リフロ−はんだ付け装置

Info

Publication number
JPS63177960A
JPS63177960A JP62008965A JP896587A JPS63177960A JP S63177960 A JPS63177960 A JP S63177960A JP 62008965 A JP62008965 A JP 62008965A JP 896587 A JP896587 A JP 896587A JP S63177960 A JPS63177960 A JP S63177960A
Authority
JP
Japan
Prior art keywords
chamber
printed circuit
circuit board
reflow
heated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62008965A
Other languages
English (en)
Japanese (ja)
Other versions
JPH055581B2 (enrdf_load_stackoverflow
Inventor
Kenji Kondo
近藤　権士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP62008965A priority Critical patent/JPS63177960A/ja
Priority to KR1019880008802A priority patent/KR900002671A/ko
Publication of JPS63177960A publication Critical patent/JPS63177960A/ja
Publication of JPH055581B2 publication Critical patent/JPH055581B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP62008965A 1987-01-20 1987-01-20 リフロ−はんだ付け装置 Granted JPS63177960A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP62008965A JPS63177960A (ja) 1987-01-20 1987-01-20 リフロ−はんだ付け装置
KR1019880008802A KR900002671A (ko) 1987-01-20 1988-07-15 리플로우 납땜장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62008965A JPS63177960A (ja) 1987-01-20 1987-01-20 リフロ−はんだ付け装置

Publications (2)

Publication Number Publication Date
JPS63177960A true JPS63177960A (ja) 1988-07-22
JPH055581B2 JPH055581B2 (enrdf_load_stackoverflow) 1993-01-22

Family

ID=11707388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62008965A Granted JPS63177960A (ja) 1987-01-20 1987-01-20 リフロ−はんだ付け装置

Country Status (2)

Country Link
JP (1) JPS63177960A (enrdf_load_stackoverflow)
KR (1) KR900002671A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02284764A (ja) * 1989-04-25 1990-11-22 Osaka Asahi Kagaku Kk プリント基板の両面実装用半田付装置
JPH03106260U (enrdf_load_stackoverflow) * 1990-02-20 1991-11-01
US5154338A (en) * 1990-06-06 1992-10-13 Senju Metal Industry Co., Ltd. Solder reflow furnace
JPH04300066A (ja) * 1991-03-26 1992-10-23 Hitachi Techno Eng Co Ltd リフローはんだ付け方法およびその装置
EP0598367A1 (en) * 1992-11-17 1994-05-25 Matsushita Electric Industrial Co., Ltd. Reflow apparatus and method
JPH08250852A (ja) * 1995-03-10 1996-09-27 Senju Metal Ind Co Ltd リフロー方法、リフロー炉およびリフロー炉用熱風式ヒーター
CN109425107A (zh) * 2017-08-25 2019-03-05 张跃 一种高压运行的热风炉

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02284764A (ja) * 1989-04-25 1990-11-22 Osaka Asahi Kagaku Kk プリント基板の両面実装用半田付装置
JPH03106260U (enrdf_load_stackoverflow) * 1990-02-20 1991-11-01
US5154338A (en) * 1990-06-06 1992-10-13 Senju Metal Industry Co., Ltd. Solder reflow furnace
JPH04300066A (ja) * 1991-03-26 1992-10-23 Hitachi Techno Eng Co Ltd リフローはんだ付け方法およびその装置
US5203487A (en) * 1991-03-26 1993-04-20 Hitachi Techno Engineering Co., Ltd. Reflow soldering method and system therefor
EP0598367A1 (en) * 1992-11-17 1994-05-25 Matsushita Electric Industrial Co., Ltd. Reflow apparatus and method
US5524812A (en) * 1992-11-17 1996-06-11 Matsushita Electric Industrial Co., Ltd. Reflow apparatus and method
US5715990A (en) * 1992-11-17 1998-02-10 Matsushita Electric Industrial Co., Ltd. Reflow apparatus and method
JPH08250852A (ja) * 1995-03-10 1996-09-27 Senju Metal Ind Co Ltd リフロー方法、リフロー炉およびリフロー炉用熱風式ヒーター
CN109425107A (zh) * 2017-08-25 2019-03-05 张跃 一种高压运行的热风炉

Also Published As

Publication number Publication date
KR900002671A (ko) 1990-02-28
JPH055581B2 (enrdf_load_stackoverflow) 1993-01-22

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