JPH03106260U - - Google Patents
Info
- Publication number
- JPH03106260U JPH03106260U JP1604990U JP1604990U JPH03106260U JP H03106260 U JPH03106260 U JP H03106260U JP 1604990 U JP1604990 U JP 1604990U JP 1604990 U JP1604990 U JP 1604990U JP H03106260 U JPH03106260 U JP H03106260U
- Authority
- JP
- Japan
- Prior art keywords
- preheating zone
- heating chamber
- reflow soldering
- soldering apparatus
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000005192 partition Methods 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 2
- 239000006071 cream Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1604990U JPH03106260U (enrdf_load_stackoverflow) | 1990-02-20 | 1990-02-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1604990U JPH03106260U (enrdf_load_stackoverflow) | 1990-02-20 | 1990-02-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03106260U true JPH03106260U (enrdf_load_stackoverflow) | 1991-11-01 |
Family
ID=31519335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1604990U Pending JPH03106260U (enrdf_load_stackoverflow) | 1990-02-20 | 1990-02-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03106260U (enrdf_load_stackoverflow) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63177960A (ja) * | 1987-01-20 | 1988-07-22 | Kenji Kondo | リフロ−はんだ付け装置 |
JPS63180368A (ja) * | 1987-01-21 | 1988-07-25 | Eiteitsuku Tekutoron Kk | リフロ−半田付け方法及び装置 |
JPS63278668A (ja) * | 1987-05-11 | 1988-11-16 | Eiteitsuku Tekutoron Kk | リフロ−半田付け装置 |
JPH01215462A (ja) * | 1988-02-23 | 1989-08-29 | Eiteitsuku Tekutoron Kk | リフロー半田付け方法及び装置 |
-
1990
- 1990-02-20 JP JP1604990U patent/JPH03106260U/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63177960A (ja) * | 1987-01-20 | 1988-07-22 | Kenji Kondo | リフロ−はんだ付け装置 |
JPS63180368A (ja) * | 1987-01-21 | 1988-07-25 | Eiteitsuku Tekutoron Kk | リフロ−半田付け方法及び装置 |
JPS63278668A (ja) * | 1987-05-11 | 1988-11-16 | Eiteitsuku Tekutoron Kk | リフロ−半田付け装置 |
JPH01215462A (ja) * | 1988-02-23 | 1989-08-29 | Eiteitsuku Tekutoron Kk | リフロー半田付け方法及び装置 |