KR900002671A - 리플로우 납땜장치 - Google Patents

리플로우 납땜장치 Download PDF

Info

Publication number
KR900002671A
KR900002671A KR1019880008802A KR880008802A KR900002671A KR 900002671 A KR900002671 A KR 900002671A KR 1019880008802 A KR1019880008802 A KR 1019880008802A KR 880008802 A KR880008802 A KR 880008802A KR 900002671 A KR900002671 A KR 900002671A
Authority
KR
South Korea
Prior art keywords
chamber
reflow
heated air
preheating
reflow soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019880008802A
Other languages
English (en)
Korean (ko)
Inventor
겐시 곤도오
Original Assignee
겐시 곤도오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 겐시 곤도오 filed Critical 겐시 곤도오
Publication of KR900002671A publication Critical patent/KR900002671A/ko
Priority to KR2019910001173U priority Critical patent/KR910003176Y1/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1019880008802A 1987-01-20 1988-07-15 리플로우 납땜장치 Withdrawn KR900002671A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019910001173U KR910003176Y1 (ko) 1988-07-15 1991-01-28 리플로우 납땜장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62008965A JPS63177960A (ja) 1987-01-20 1987-01-20 リフロ−はんだ付け装置
JP8965 1987-01-20

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR2019910001173U Division KR910003176Y1 (ko) 1988-07-15 1991-01-28 리플로우 납땜장치

Publications (1)

Publication Number Publication Date
KR900002671A true KR900002671A (ko) 1990-02-28

Family

ID=11707388

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880008802A Withdrawn KR900002671A (ko) 1987-01-20 1988-07-15 리플로우 납땜장치

Country Status (2)

Country Link
JP (1) JPS63177960A (enrdf_load_stackoverflow)
KR (1) KR900002671A (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02284764A (ja) * 1989-04-25 1990-11-22 Osaka Asahi Kagaku Kk プリント基板の両面実装用半田付装置
JPH03106260U (enrdf_load_stackoverflow) * 1990-02-20 1991-11-01
US5154338A (en) * 1990-06-06 1992-10-13 Senju Metal Industry Co., Ltd. Solder reflow furnace
JPH07115166B2 (ja) * 1991-03-26 1995-12-13 日立テクノエンジニアリング株式会社 リフローはんだ付け方法およびその装置
KR0123188B1 (ko) * 1992-11-17 1997-12-03 모리시타 요이찌 리플로장치
JPH08250852A (ja) * 1995-03-10 1996-09-27 Senju Metal Ind Co Ltd リフロー方法、リフロー炉およびリフロー炉用熱風式ヒーター
CN207395480U (zh) * 2017-08-25 2018-05-22 张跃 一种保温结构

Also Published As

Publication number Publication date
JPS63177960A (ja) 1988-07-22
JPH055581B2 (enrdf_load_stackoverflow) 1993-01-22

Similar Documents

Publication Publication Date Title
KR890012523A (ko) 리플로우 납땜 방법 및 그장치
KR950024624A (ko) 리폴로장치
US4792302A (en) Continuous solder reflow system
EP1106294A3 (en) Soldering machine
EP0279604A3 (en) Focused convection reflow soldering method and apparatus
DE3876988D1 (de) Loetgeraet.
US5180096A (en) Method and apparatus for reflow-soldering of printed circuit boards
MY121702A (en) Electronic unit soldering apparatus
ATE27931T1 (de) Wellenloeten von intergrierten schaltungen.
KR900002671A (ko) 리플로우 납땜장치
DE3873266D1 (de) Durchlaufofen zum anloeten von elektronischen bauteilen.
MY129904A (en) Apparatus and method for soldering electronic components to printed circuit boards
JPS61289697A (ja) リフロー装置
JPS614870U (ja) リフロ−炉
KR870004649A (ko) 납땜 장치
CA2544758A1 (en) Dual stage pre-heater
MY111280A (en) Hot air blow type heaters and the users in reflow furnace
JP2002280721A5 (enrdf_load_stackoverflow)
ATE28044T1 (de) Entloetgeraet.
JP3818713B2 (ja) 熱風加熱装置
ATE167978T1 (de) Gurtband zum bereitstellen von lotdepots zum auflöten von bauelementen auf eine leiterplatte
JPS6482691A (en) Attachment of surface mounting component to printed board
JPH0380581B2 (enrdf_load_stackoverflow)
JPH0739482Y2 (ja) リフロー炉
JPH04339561A (ja) 自動はんだ付け装置用プリヒータ

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19880715

PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19880715

Comment text: Request for Examination of Application

PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 19901128

Patent event code: PE09021S01D

PC1205 Withdrawal of application forming a basis of a converted application
WICV Withdrawal of application forming a basis of a converted application