JPS63174483U - - Google Patents
Info
- Publication number
- JPS63174483U JPS63174483U JP3624287U JP3624287U JPS63174483U JP S63174483 U JPS63174483 U JP S63174483U JP 3624287 U JP3624287 U JP 3624287U JP 3624287 U JP3624287 U JP 3624287U JP S63174483 U JPS63174483 U JP S63174483U
- Authority
- JP
- Japan
- Prior art keywords
- component
- jig
- thermal conductivity
- printed board
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Description
第１図は、本考案のボンデイング治具の一実施
例の図、第２図は、従来のレーザ接合を説明する
図である。
図において、１０は本考案のボンデイング治具
本体、１１はチツプ、１２は本体構成材である。
FIG. 1 is a diagram of an embodiment of the bonding jig of the present invention, and FIG. 2 is a diagram illustrating conventional laser bonding. In the figure, 10 is the bonding jig main body of the present invention, 11 is a chip, and 12 is a main body component.
Claims (1)
接合する際使用する治具であつて、熱伝導度の大
なる材料で該部品のそれぞれのリード線を前記プ
リント板の部品パターンに圧接するよう接合点ご
とに配置した複数のチツプ１１を熱伝導度の小な
る材料で該チツプ１１の隣接間隙を埋設して連接
形成されてなることを特徴とするボンデイング治
具。 A jig used to join the lead wires of a component to a component pattern on a printed board, and is a jig that uses a material with high thermal conductivity to press each lead wire of the component to the component pattern on the printed board at the joining point. 1. A bonding jig characterized in that a plurality of chips 11 are arranged one after another and are connected by filling the gaps between adjacent chips 11 with a material having low thermal conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3624287U JPH0432785Y2 (en) | 1987-03-11 | 1987-03-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3624287U JPH0432785Y2 (en) | 1987-03-11 | 1987-03-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63174483U true JPS63174483U (en) | 1988-11-11 |
| JPH0432785Y2 JPH0432785Y2 (en) | 1992-08-06 |
Family
ID=30846466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3624287U Expired JPH0432785Y2 (en) | 1987-03-11 | 1987-03-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0432785Y2 (en) |
-
1987
- 1987-03-11 JP JP3624287U patent/JPH0432785Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0432785Y2 (en) | 1992-08-06 |
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