JPS63173623A - 多層板の製造方法 - Google Patents
多層板の製造方法Info
- Publication number
- JPS63173623A JPS63173623A JP62006389A JP638987A JPS63173623A JP S63173623 A JPS63173623 A JP S63173623A JP 62006389 A JP62006389 A JP 62006389A JP 638987 A JP638987 A JP 638987A JP S63173623 A JPS63173623 A JP S63173623A
- Authority
- JP
- Japan
- Prior art keywords
- pin
- press
- caulking
- fitting
- guide hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000010030 laminating Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 20
- 238000000465 moulding Methods 0.000 description 5
- 238000002788 crimping Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000001580 bacterial effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 210000004709 eyebrow Anatomy 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62006389A JPS63173623A (ja) | 1987-01-14 | 1987-01-14 | 多層板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62006389A JPS63173623A (ja) | 1987-01-14 | 1987-01-14 | 多層板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63173623A true JPS63173623A (ja) | 1988-07-18 |
| JPH0427023B2 JPH0427023B2 (cs) | 1992-05-08 |
Family
ID=11637018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62006389A Granted JPS63173623A (ja) | 1987-01-14 | 1987-01-14 | 多層板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63173623A (cs) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4959116A (en) * | 1988-03-24 | 1990-09-25 | Alps Electric Co., Ltd. | Production of metal base laminate plate including applying an insulator film by powder coating |
| US8057623B2 (en) | 2006-07-14 | 2011-11-15 | Airbus Operations Limited | Composite manufacturing method |
| CN105392304A (zh) * | 2015-10-21 | 2016-03-09 | 胜宏科技（惠州）股份有限公司 | 一种线路板压合方法 |
-
1987
- 1987-01-14 JP JP62006389A patent/JPS63173623A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4959116A (en) * | 1988-03-24 | 1990-09-25 | Alps Electric Co., Ltd. | Production of metal base laminate plate including applying an insulator film by powder coating |
| US8057623B2 (en) | 2006-07-14 | 2011-11-15 | Airbus Operations Limited | Composite manufacturing method |
| US9764518B2 (en) | 2006-07-14 | 2017-09-19 | Airbus Operations Limited | Composite manufacturing method |
| CN105392304A (zh) * | 2015-10-21 | 2016-03-09 | 胜宏科技（惠州）股份有限公司 | 一种线路板压合方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0427023B2 (cs) | 1992-05-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3660726A (en) | Multi-layer printed circuit board and method of manufacture | |
| EP1107654A4 (en) | FILM FOR CONDUCTOR PLATE, METHOD FOR PRODUCING A CONTACT HOLE, FILLED CONTACT HOLE RESIN FOIL, PCB AND METHOD FOR THE PRODUCTION THEREOF | |
| DE102014107299B4 (de) | Chipkartenmodul, Chipkarte, und Verfahren zum Herstellen eines Chipkartenmoduls | |
| CN101203095A (zh) | 多层柔性电路板的制备方法 | |
| US20080314621A1 (en) | Parallel chip embedded printed circuit board and manufacturing method thereof | |
| JPS63173623A (ja) | 多層板の製造方法 | |
| JPH05343847A (ja) | 多層印刷配線板の製造方法 | |
| US20190335593A1 (en) | Method of manufacturing the printed circuit board | |
| JPS63262038A (ja) | Ｆｇコイル付きモ−タ用プリントコイル | |
| JP2870351B2 (ja) | キャビティ付セラミック多層回路基板の製造方法 | |
| JPH08228052A (ja) | 金属嵌合基板の製造方法 | |
| JPH0427022B2 (cs) | ||
| CN215871951U (zh) | 电路板组件 | |
| JPH047581Y2 (cs) | ||
| JPH1041623A (ja) | メタルコアプリント配線板およびその製造方法 | |
| JPS5868999A (ja) | 多層プリント配線板の製造方法 | |
| JP2570619B2 (ja) | 多層印刷配線板およびその製造方法 | |
| JP3266986B2 (ja) | セラミック多層基板の製造方法 | |
| JPH01112797A (ja) | 多層印刷配線板の製造方法 | |
| JPS59114887A (ja) | プリント回路板 | |
| JPH03250789A (ja) | 多層プリント配線板 | |
| JPH06152149A (ja) | 多層プリント配線板の穴明け方法 | |
| JP3760496B2 (ja) | 多層プリント配線板の製造方法 | |
| JPS63153895A (ja) | 多層配線板の製造方法 | |
| JPH11220259A (ja) | 多層プリント配線板の製造方法 |