JPS63173623A - Manufacture of laminated plate - Google Patents
Manufacture of laminated plateInfo
- Publication number
- JPS63173623A JPS63173623A JP62006389A JP638987A JPS63173623A JP S63173623 A JPS63173623 A JP S63173623A JP 62006389 A JP62006389 A JP 62006389A JP 638987 A JP638987 A JP 638987A JP S63173623 A JPS63173623 A JP S63173623A
- Authority
- JP
- Japan
- Prior art keywords
- pin
- press
- caulking
- fitting
- guide hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000010030 laminating Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 20
- 238000000465 moulding Methods 0.000 description 5
- 238000002788 crimping Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000001580 bacterial effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 210000004709 eyebrow Anatomy 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
［技術分野］
本発明は眉間位置合わせ精度を向上させる多層板の製造
方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing a multilayer board that improves glabella alignment accuracy.
［背景技術１
従来上り、第３図及び第４図に示すように内層材１にプ
リプレグのような樹脂絶縁層２を介して外層材３を配置
し、この積み重ね体４に穿孔した内層材１の外枠部５を
貫通するガイド孔６にガイドピン１１を挿通して複数組
みの積み重ね体４をステンレス板１２を介在させて金型
１３に配置し、次いでクッシａン材１４を介して熱盤１
５間に配置して積層一体化することにより多層板が製造
されており、この場合がイドピン１１により成形及び外
形加工時における位置ずれを防止しているが、ガイドピ
ン１１がずれ応力に耐えられず、層間位置精度はそれほ
ど高くな（、特に２０−以上の厚物の多層板の場合にあ
っては眉間位置ずれの不良品が続出してしまった。[Background technology 1] Conventionally, as shown in FIGS. 3 and 4, an outer layer material 3 is placed on an inner layer material 1 with a resin insulating layer 2 such as prepreg interposed therebetween, and an inner layer material 1 is formed by perforating this stacked body 4. A guide pin 11 is inserted into a guide hole 6 penetrating the outer frame 5 of the structure, and a plurality of sets of stacked bodies 4 are placed in a mold 13 with a stainless steel plate 12 interposed therebetween. Board 1
A multilayer board is manufactured by placing the guide pins 11 between the 5 and 5 and laminating them in an integrated manner.In this case, the id pins 11 prevent positional displacement during molding and contour processing, but the guide pins 11 cannot withstand the displacement stress. First, the interlayer positional accuracy is not so high (particularly in the case of multilayer boards with a thickness of 20 mm or more, there have been many defective products with misalignment between the eyebrows).
このため、本発明者は既に、第６図に示すようながしぬ
ピン８′を開発して、このかしめピン８′を第５図に示
すように積み重ね体４のガイド孔６に挿入して他端をか
しめて（かしめ部１０）積み重ね体４を一体化させた後
、積層成形して多層板を！１！！逸する方法を開発して
おり、確かにこの方法によれば層間位置合わせ精度は向
上するものの、かしめピン８′の肉厚が大きい場合には
かしめ圧力が大となり大型のかしめ機を必要として、作
業に手間を要してしまっており、又かしめｇＳｌｏにク
ラックが発生して脆くなってしまいかしめ固定の信頼性
が得られないという問題が新たに発生した。For this reason, the present inventor has already developed a caulking pin 8' as shown in FIG. After caulking the edges (caulking part 10) to integrate the stacked body 4, lamination molding is performed to form a multilayer board! 1! ! Although this method does improve the interlayer alignment accuracy, if the thickness of the caulking pin 8' is large, the caulking pressure becomes large and a large caulking machine is required. The work is time-consuming, and a new problem has arisen in that the caulking gSlo develops cracks and becomes brittle, making the caulking and fixation unreliable.
［発明の目的］
本発明は上記事情に鑑みて為されたものであり、その目
的とするところは、多層板の製造方法において、眉間位
置合い精度を高めることができ、しかも作業性が高く、
かしめ信頼性を向上させ、かしめ磯の小型化を可能とす
ることにある。[Object of the Invention] The present invention has been made in view of the above circumstances, and its purpose is to improve glabella positioning accuracy in a method for manufacturing a multilayer board, and to provide high workability.
The object is to improve the caulking reliability and to make it possible to downsize the caulking iso.
［発明の開示］
本発明の多層板の製造方法は、内層材１に樹脂絶縁層２
を介して外層材３を配置し、この積み重ね体４に内層材
１の外枠部５を貫通するガイド孔６を穿孔し、一端にフ
ランジ部７を有するかしめピン８をガイド孔６に挿通さ
せて積み重ね体４を一体化させて積層成形する多層板の
製造方法であ１て、かしめピン８を筒状体１６の一端に
フランジ部７を有する受けピン８ａと圧入体１７の一端
にフランジ部７を有する圧入ピン８ａとで形成し、積み
重ね体４のガイド孔６にその一端から受けピン８ａの筒
状体１６を挿入すると共に他端から圧入ピン８ｂの圧入
体１７を挿入して圧入体１７を受けピン８ａの筒状体１
６に圧入させることを特徴とするものであり、この構成
により上記目的が達成されたものである。即ち、かしめ
ピン８により積み重ね体４を一体化させて積層成形する
ので、成形時及び外形加工時の層間の位置ずれを確実に
防止でさ、眉間位置合い精度の高い多層板を製造するこ
とができ、しかも積み重ね体４のガイド孔６にその一端
から受けピン８ａの筒状体１６を挿入すると共に他端か
ら圧入ビン８ｂの圧入体１７を挿入して受けピン８ａの
筒状体１６に圧入させることにより積み重ね体４を一体
化するので、簡単にかしめ固定でき、作業性に優れ、従
ってかしめ機の小型化も可能で、しかもかしめ固定の信
頼性が向上するものである。[Disclosure of the Invention] The method for manufacturing a multilayer board of the present invention includes a resin insulating layer 2 on an inner layer material 1.
The outer layer material 3 is arranged through the stacked body 4, and a guide hole 6 is bored through the outer frame portion 5 of the inner layer material 1, and a caulking pin 8 having a flange portion 7 at one end is inserted into the guide hole 6. In this method, a caulking pin 8 is attached to one end of a cylindrical body 16 with a receiving pin 8a having a flange portion 7, and one end of a press-fitting body 17 has a flange portion. The cylindrical body 16 of the receiving pin 8a is inserted into the guide hole 6 of the stacked body 4 from one end, and the press-fit body 17 of the press-fit pin 8b is inserted from the other end to form a press-fit body. 17 and the cylindrical body 1 of the receiving pin 8a
6, and this configuration achieves the above object. That is, since the stacked bodies 4 are integrated by the caulking pins 8 and laminated and molded, misalignment between the layers during molding and contour processing can be reliably prevented, and a multilayer board with high glabella alignment accuracy can be manufactured. In addition, the cylindrical body 16 of the receiving pin 8a is inserted into the guide hole 6 of the stacked body 4 from one end, and the press-fitting body 17 of the press-fitting pin 8b is inserted from the other end to be press-fitted into the cylindrical body 16 of the receiving pin 8a. By doing so, the stacked bodies 4 are integrated, so that they can be easily caulked and fixed, and the workability is excellent. Therefore, it is possible to downsize the caulking machine, and the reliability of caulking and fixation is improved.
以下本発明を添付の図面に基づいて説明する。The present invention will be explained below based on the accompanying drawings.
本発明でいう内層材１とは銅張積層板の両面又は片面に
常法により導体パターン９が形成されたものである。こ
の実施例では内層材１は両面板であり、両面に樹脂絶縁
ＷＪ２を介して外層材３が配置されて積み重ね体４が構
成されている。樹脂絶縁層２はプリプレグとか樹脂フィ
ルムなどであり、外層材３としては銅箔とかの金属箔と
か片面銅張積層板などである。The inner layer material 1 referred to in the present invention is a copper-clad laminate having a conductor pattern 9 formed on both or one surface thereof by a conventional method. In this embodiment, the inner layer material 1 is a double-sided board, and the outer layer material 3 is placed on both sides with a resin insulation WJ2 interposed therebetween to form a stacked body 4. The resin insulating layer 2 is made of prepreg, resin film, etc., and the outer layer material 3 is made of metal foil such as copper foil, or a single-sided copper-clad laminate.
この積み重ね体４の外周部に、内層材１の製品にならな
い余白の部分である外枠部５を貫通させてガイド孔６を
穿孔する。A guide hole 6 is bored in the outer periphery of this stacked body 4 by penetrating the outer frame part 5 which is a blank part of the inner layer material 1 that will not be used as a product.
かしめピン８は両端が開口した筒状体１６の一端にフラ
ンジ部７を有する受けピン８ａと圧入体１７の一層にフ
ランジＷｆ１７を有する圧入ピン８ａとで形成されてお
り、かしめ固定に際して圧入ピン８ａの圧入体１７が受
けピン８ａの筒状体１６に圧入される。圧入ピン８ｂの
圧入体１７は両端がが５■の場合、受けピン８ａの筒状
体１６の内径と圧入ピン８ｂの圧入体１７の外径とは５
．００〜５，００５＋＋＋＋＊に対して５．００３−５
．００８１１ｍである。これら受けピン８ａ及び圧入ピ
ン８ｂは、２０ｍｍ以上の厚物の多層板の製造には肉厚
が０．６ｍｍ以上で、フランジ部の直径が８〜２０ＩＩ
Ｉ＋１のものが好ましい。The caulking pin 8 is formed of a receiving pin 8a having a flange portion 7 at one end of a cylindrical body 16 with both ends open, and a press-fitting pin 8a having a flange Wf17 on one layer of the press-fitting body 17. When fixing by caulking, the press-fitting pin 8a The press-fit body 17 is press-fit into the cylindrical body 16 of the receiving pin 8a. If the press-fit body 17 of the press-fit pin 8b has a diameter of 5 mm at both ends, the inner diameter of the cylindrical body 16 of the receiving pin 8a and the outer diameter of the press-fit body 17 of the press-fit pin 8b are 5 mm.
．． 5.003-5 for 00-5,005+++++*
．． It is 00811m. These receiving pins 8a and press-fit pins 8b must have a wall thickness of 0.6 mm or more and a flange diameter of 8 to 20 mm for manufacturing multilayer boards with a thickness of 20 mm or more.
I+1 is preferred.
このかしめピン８の受けピン８ａの筒状体１６を積み重
ね体４のガイド孔６の下端から圧入し、ガイド孔６の上
端から圧入ピン８ｂの圧入体１７を挿入して受けピン８
ａの筒状体１６に圧入させ、両７ランジ部７を積み重ね
体４の両面に圧接させて積み重ね体４をかしめ固定する
。この状態で、従来と同様にして積み重ね体４を金型１
３に配置し、更にクツシラン材１４を介して熱盤１５間
に配置して積層一体化させる。成形条件は、圧力が普通
４０〜５０ｋｇ／ａｍ”であるが、紙フェノール積層板
では７０ｋＦｌ／ａｍ２以上の高圧であったり、エポキ
シ樹脂プリプレグの特性によっては２０ｋｇ／ｃｍ”以
下の低圧であり、又、温度も通常１６５〜１７５℃ある
など、請入舌＋３４ｋｔｊ層府社中↓Ｌゆトス プレ１
ｒ酪１イ積み重ね体４の両面から突出するかしめピン８
のフランジ部７は金型１３に形成された凹部により吸収
される。尚、長尺のかしめピン８を採用することにより
従来のように複数組みの積み重ね体４をステンレス板１
２を介して重ねて一度に複数の多層板を形成するように
してもよい。The cylindrical body 16 of the receiving pin 8a of the caulking pin 8 is press-fitted from the lower end of the guide hole 6 of the stacked body 4, and the press-fitting body 17 of the press-fitting pin 8b is inserted from the upper end of the guide hole 6.
It is press-fitted into the cylindrical body 16 of a, and both 7 flange parts 7 are brought into pressure contact with both surfaces of the stacked body 4, and the stacked body 4 is caulked and fixed. In this state, the stacked body 4 is placed in the mold 1 in the same manner as before.
3, and further placed between the heating plates 15 with a kutsushiran material 14 interposed therebetween, so that they are laminated and integrated. The molding conditions are normally 40 to 50 kg/am'', but for paper phenolic laminates, the pressure may be as high as 70 kFl/am2 or more, or as low as 20 kg/cm'' or less depending on the characteristics of the epoxy resin prepreg. , the temperature is usually 165-175℃, etc.
r Locking pin 8 protruding from both sides of stacked body 4
The flange portion 7 is absorbed by a recess formed in the mold 13. In addition, by adopting the long caulking pin 8, multiple sets of stacked bodies 4 can be connected to the stainless steel plate 1 as in the conventional case.
Alternatively, a plurality of multilayer plates may be formed at once by stacking them with each other.
積層一体化させた後は、その状態で外形加工を施し、次
いで常法により外層材１に導体パターンを形成し、スル
ーホールめっきを施して多層プリント配線板として実用
に供する。After the lamination and integration, external processing is performed in that state, and then a conductor pattern is formed on the outer layer material 1 by a conventional method, and through-hole plating is applied to provide a multilayer printed wiring board for practical use.
［発明の効果１
本発明にあっては、かしめピンをかしめることにより積
み重ね体を一体化させて積層成形するので、成形時及び
外形加工時の眉間の位置ずれを確実に防止でき、眉間位
置合い精度の高い多層板を製造することができ、しかも
かしめピンを筒状体の一端にフランジ部を有する受けピ
ンと圧入体の一端にフランジ部を有する圧入ピンとで形
成し、積み重ね体のガイド孔にその一端から受けピンの
筒状体を挿入すると共に他端から圧入ピンの圧入体を挿
入して圧入体を受けピンの筒状体に圧入させて積み重ね
体を一体化するので、簡単にかしめ固定でさ、作業性に
優れ、従ってかしめ機も小型化が可能で、しかもかしめ
固定の信頼性が向上するものである。[Advantageous Effects of the Invention 1] In the present invention, the stacked bodies are integrated and laminated by crimping the crimping pins, so that misalignment of the glabella during molding and contour processing can be reliably prevented, and the glabella position can be adjusted. It is possible to manufacture a multilayer board with high fitting accuracy, and the caulking pin is formed by a receiving pin having a flange at one end of the cylindrical body and a press-fitting pin having a flange at one end of the press-fitting body. The cylindrical body of the receiving pin is inserted from one end, and the press-fitting body of the press-fitting pin is inserted from the other end, and the press-fitting body is press-fitted into the cylindrical body of the receiving pin to integrate the stacked body, so it is easily caulked and fixed. Therefore, the workability is excellent, the crimping machine can be downsized, and the reliability of crimping and fixing is improved.
第１図は本発明における積み重ね体を示す断面図、第２
図（ａ）（ｂ）は同上におけるかしめピンを示す側面図
及び分解側面図、第３図は従来例を示す概略断面図、第
４図は同上における積み重ね体を示す断面図、第５図は
本発明者が本発明の以前に開発した多層板の製造方法に
おける積み重ね体を示す一部省略断面図、第６図（ａ）
（ｂ）は同上におけるかしめピンを示す側面図及び底面
図であって、１は内層材、２は樹脂絶縁層、３は外層材
、４は積み重ね体、５は外枠部、６はガイド孔、７はフ
ランジ部、８はかしめピン、８ａは受けピン、８ｂは圧
入ピン、１６は筒状体、１７は圧入体である。
代理人 弁理士 石 １）長 七
８ｂ・・・圧入ピン
第３図
ｂ
第４図
第５図
第６菌
ｒｉ ） ５ａａｔ世位 ９ Ｗ位 １９ 粁日消
「９＾−−１も「リ ＾手続補正書（自発）
１、事件の表示
昭和６２年特許［１＠６３８９号
２、発明の名称
多層板の製造方法
３、補正をする者
事件との関係 特許出願人
住 所 大阪府門真市大字門真１０４８番地名称（５８
３）松下電工株式会社
代表者 藤 井 貞 夫
４、代理人
郵便番号 ５３０
住 所 大阪市北区梅田１丁目１２番１７号５、補正命
令の日付
自 発
１− ／ ／１１Ｉ′％ＩＷＺＪａ＋ ｙｚ７ｊ Ａ
ｕ ＩＪ ＯＶ／ｌ＆ＶｌｌＩ−Ｊτ１４，１７ＩＩ
ＩＩ」と補正致します。
（２） 同上第６ 頁’１４ 行目ノｒ２０＋ｍＪヲ
ｒ２．Ｏｍａ＋Ｊと補正致します。Fig. 1 is a sectional view showing a stacked body according to the present invention;
Figures (a) and (b) are a side view and an exploded side view showing the caulking pin in the same as above, Figure 3 is a schematic sectional view showing a conventional example, Figure 4 is a sectional view showing a stacked body in the same as above, and Figure 5 is FIG. 6(a) is a partially omitted sectional view showing a stacked body in a method for manufacturing a multilayer board developed by the present inventor prior to the present invention.
(b) is a side view and a bottom view showing the caulking pin in the same as above, where 1 is an inner layer material, 2 is a resin insulating layer, 3 is an outer layer material, 4 is a stacked body, 5 is an outer frame part, and 6 is a guide hole. , 7 is a flange portion, 8 is a caulking pin, 8a is a receiving pin, 8b is a press-fit pin, 16 is a cylindrical body, and 17 is a press-fit body. Agent Patent Attorney Ishi 1) Long 78b...Press-in pin Fig. 3b Fig. 4 Fig. 5 Fig. 6 Bacterial ri) 5aat rank 9 W rank 19 璁 day ``9^--1 also ``ri ^ Procedural amendment (spontaneous) 1. Indication of the case 1988 Patent [1 @ 6389 No. 2. Name of the invention Method for manufacturing multilayer board 3. Person making the amendment Relationship with the case Patent applicant address Oaza, Kadoma City, Osaka Prefecture Kadoma 1048 address name (58
3) Matsushita Electric Works Co., Ltd. Representative: Sadao Fujii 4, Agent postal code: 530 Address: 1-12-17-5 Umeda, Kita-ku, Osaka City, Date of amendment order: 1- / /11I'%IWZJa+yz7jA
u IJ OV/l&VllI-Jτ14,17II
I will correct it as "II". (2) Same as above, page 6, line '14, r20+mJor2. We will correct it as Oma+J.
Claims (1)
の積み重ね体に内層材の外枠部を貫通するガイド孔を穿
孔し、かしめピンをガイド孔に挿通させて積み重ね体を
一体化させて積層成形する多層板の製造方法であって、
かしめピンを筒状体の一端にフランジ部を有する受けピ
ンと圧入体の一端にフランジ部を有する圧入ピンとで形
成し、積み重ね体のガイド孔にその一端から受けピンの
筒状体を挿入すると共に他端から圧入ピンの圧入体を挿
入して圧入体を受けピンの筒状体に圧入させることを特
徴とする多層板の製造方法。(1) Arrange the outer layer material on the inner layer material via the resin insulation layer, drill a guide hole that penetrates the outer frame of the inner layer material in this stacked body, and insert a caulking pin into the guide hole to integrate the stacked body. A method for manufacturing a multilayer board by laminating and forming the
The caulking pin is formed of a receiving pin having a flange portion at one end of a cylindrical body and a press-fitting pin having a flange portion at one end of the press-fitting body, and the cylindrical body of the receiving pin is inserted into the guide hole of the stacked body from one end, and the other is inserted into the guide hole of the stacked body. A method for manufacturing a multilayer board, characterized by inserting a press-fitting body of a press-fitting pin from an end and press-fitting the press-fitting body into a cylindrical body of a receiving pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62006389A JPS63173623A (en) | 1987-01-14 | 1987-01-14 | Manufacture of laminated plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62006389A JPS63173623A (en) | 1987-01-14 | 1987-01-14 | Manufacture of laminated plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63173623A true JPS63173623A (en) | 1988-07-18 |
| JPH0427023B2 JPH0427023B2 (en) | 1992-05-08 |
Family
ID=11637018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62006389A Granted JPS63173623A (en) | 1987-01-14 | 1987-01-14 | Manufacture of laminated plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63173623A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4959116A (en) * | 1988-03-24 | 1990-09-25 | Alps Electric Co., Ltd. | Production of metal base laminate plate including applying an insulator film by powder coating |
| US8057623B2 (en) | 2006-07-14 | 2011-11-15 | Airbus Operations Limited | Composite manufacturing method |
| CN105392304A (en) * | 2015-10-21 | 2016-03-09 | 胜宏科技（惠州）股份有限公司 | Circuit board press-fit method |
-
1987
- 1987-01-14 JP JP62006389A patent/JPS63173623A/en active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4959116A (en) * | 1988-03-24 | 1990-09-25 | Alps Electric Co., Ltd. | Production of metal base laminate plate including applying an insulator film by powder coating |
| US8057623B2 (en) | 2006-07-14 | 2011-11-15 | Airbus Operations Limited | Composite manufacturing method |
| US9764518B2 (en) | 2006-07-14 | 2017-09-19 | Airbus Operations Limited | Composite manufacturing method |
| CN105392304A (en) * | 2015-10-21 | 2016-03-09 | 胜宏科技（惠州）股份有限公司 | Circuit board press-fit method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0427023B2 (en) | 1992-05-08 |
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