JPS6317334B2 - - Google Patents
Info
- Publication number
- JPS6317334B2 JPS6317334B2 JP57162730A JP16273082A JPS6317334B2 JP S6317334 B2 JPS6317334 B2 JP S6317334B2 JP 57162730 A JP57162730 A JP 57162730A JP 16273082 A JP16273082 A JP 16273082A JP S6317334 B2 JPS6317334 B2 JP S6317334B2
- Authority
- JP
- Japan
- Prior art keywords
- silicon
- film
- silicon dioxide
- dielectric film
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76297—Dielectric isolation using EPIC techniques, i.e. epitaxial passivated integrated circuit
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Element Separation (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16273082A JPS5951544A (ja) | 1982-09-17 | 1982-09-17 | 誘電体分離半導体集積回路装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16273082A JPS5951544A (ja) | 1982-09-17 | 1982-09-17 | 誘電体分離半導体集積回路装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5951544A JPS5951544A (ja) | 1984-03-26 |
JPS6317334B2 true JPS6317334B2 (enrdf_load_stackoverflow) | 1988-04-13 |
Family
ID=15760174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16273082A Granted JPS5951544A (ja) | 1982-09-17 | 1982-09-17 | 誘電体分離半導体集積回路装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5951544A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60177644A (ja) * | 1984-02-23 | 1985-09-11 | Matsushita Electric Works Ltd | 高耐圧半導体装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS568842A (en) * | 1979-07-04 | 1981-01-29 | Nippon Telegr & Teleph Corp <Ntt> | Semiconductor integrated circuit device |
-
1982
- 1982-09-17 JP JP16273082A patent/JPS5951544A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5951544A (ja) | 1984-03-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0423422B2 (enrdf_load_stackoverflow) | ||
JPH0834242B2 (ja) | 半導体装置およびその製造方法 | |
KR960005552B1 (ko) | 반도체 소자의 분리막 형성 방법 | |
US5061653A (en) | Trench isolation process | |
JPH0758676B2 (ja) | 半導体装置における基板の製造方法 | |
JP2589209B2 (ja) | 半導体装置の素子間分離領域の形成方法 | |
US6103581A (en) | Method for producing shallow trench isolation structure | |
JPS6317334B2 (enrdf_load_stackoverflow) | ||
US5208167A (en) | Method for producing SOI substrate | |
JPS6257232A (ja) | アイソレ−シヨンデバイス及びその製法 | |
JPS6351537B2 (enrdf_load_stackoverflow) | ||
JP2812013B2 (ja) | 半導体装置の製造方法 | |
JPS5828731B2 (ja) | ゼツエンキバンジヨウヘノ シリコンソウサクセイホウホウ | |
JPS6244415B2 (enrdf_load_stackoverflow) | ||
JPH0754826B2 (ja) | 半導体装置の製造方法 | |
JPH02205339A (ja) | 半導体装置の製造方法 | |
KR100204418B1 (ko) | 반도체 소자 분리방법 | |
JPS6359538B2 (enrdf_load_stackoverflow) | ||
JPS6244411B2 (enrdf_load_stackoverflow) | ||
JPH0258778B2 (enrdf_load_stackoverflow) | ||
JPS5939044A (ja) | 絶縁分離集積回路用基板の製造方法 | |
KR980012255A (ko) | 반도체장치의 소자분리 방법 | |
JPS58130555A (ja) | 半導体装置 | |
JPH0737974A (ja) | 半導体装置の製造方法 | |
JPS6226182B2 (enrdf_load_stackoverflow) |