JPS63167768U - - Google Patents
Info
- Publication number
- JPS63167768U JPS63167768U JP6082587U JP6082587U JPS63167768U JP S63167768 U JPS63167768 U JP S63167768U JP 6082587 U JP6082587 U JP 6082587U JP 6082587 U JP6082587 U JP 6082587U JP S63167768 U JPS63167768 U JP S63167768U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- light emitting
- heat sink
- header
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011810 insulating material Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図乃至第３図は本考案発光装置の一つの実
施例を説明するためのもので、第１図は断面図、
第２図は分解斜視図、第３図は製造に用いるリー
ドクレームの平面図、第４図は従来例を示す分解
斜視図である。
符号の説明、１……ヘツダー、２，２……リー
ド、２ａ……発光素子支持リード、２ｂ……アー
スリード、３……発光素子、４……位置決め溝、
５……ヒートシンク、６，６……逃げ孔、７ａ，
７ｂ……隆起部、８……逃げ孔。
1 to 3 are for explaining one embodiment of the light emitting device of the present invention, and FIG. 1 is a sectional view;
FIG. 2 is an exploded perspective view, FIG. 3 is a plan view of a lead claim used for manufacturing, and FIG. 4 is an exploded perspective view of a conventional example. Explanation of symbols: 1...Header, 2, 2...Lead, 2a...Light emitting element support lead, 2b...Earth lead, 3...Light emitting element, 4...Positioning groove,
5...Heat sink, 6,6...Escape hole, 7a,
7b... Protuberance, 8... Relief hole.
Claims (1)
ドを含む複数のリードが貫通状に保持され、 上記ヘツダーの下面に位置決め溝が形成され、 上記位置決め溝に対応する位置が上側に隆起せ
しめられ上記各リードと対応する位置にリード逃
げ孔に形成されたヒートシンクが、上記ヘツダー
の下面に、上記隆起部が上記位置決め溝内に嵌ま
り各リード逃げ孔にリードが通る状態で固定され
、 上記発光素子支持リードのリード逃げ孔から下
側へ突出した部分が折り曲げられてヒートシンク
の下面に固定され、 ヒートシンクの下面にアースリードが固定され
てなる ことを特徴とする発光装置。[Claim for Utility Model Registration] A header made of an insulating material holds a plurality of leads including a light emitting element support lead in a penetrating manner, a positioning groove is formed on the lower surface of the header, and a position corresponding to the positioning groove is on the upper side. A heat sink formed in lead relief holes at positions corresponding to the respective leads is fixed to the lower surface of the header with the raised portions fitting into the positioning grooves and the leads passing through the respective lead relief holes. A light emitting device characterized in that a portion of the light emitting element support lead protruding downward from the lead relief hole is bent and fixed to the lower surface of a heat sink, and a ground lead is fixed to the lower surface of the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6082587U JPS63167768U (en) | 1987-04-22 | 1987-04-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6082587U JPS63167768U (en) | 1987-04-22 | 1987-04-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63167768U true JPS63167768U (en) | 1988-11-01 |
Family
ID=30893592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6082587U Pending JPS63167768U (en) | 1987-04-22 | 1987-04-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63167768U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008258620A (en) * | 2007-03-30 | 2008-10-23 | Seoul Semiconductor Co Ltd | Light emitting diode lamp with low thermal resistance |
-
1987
- 1987-04-22 JP JP6082587U patent/JPS63167768U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008258620A (en) * | 2007-03-30 | 2008-10-23 | Seoul Semiconductor Co Ltd | Light emitting diode lamp with low thermal resistance |
| EP1976032A3 (en) * | 2007-03-30 | 2009-11-25 | Seoul Semiconductor Co., Ltd. | Light emitting diode lamp with low thermal resistance |
| JP2011216919A (en) * | 2007-03-30 | 2011-10-27 | Seoul Semiconductor Co Ltd | Light emitting diode lamp with low thermal resistance |