JPS63167769U - - Google Patents
Info
- Publication number
- JPS63167769U JPS63167769U JP6082687U JP6082687U JPS63167769U JP S63167769 U JPS63167769 U JP S63167769U JP 6082687 U JP6082687 U JP 6082687U JP 6082687 U JP6082687 U JP 6082687U JP S63167769 U JPS63167769 U JP S63167769U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting device
- emitting element
- view
- conductive member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011810 insulating material Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図乃至第３図は本考案発光装置の一つの実
施例を説明するためのもので、第１図は断面図、
第２図は分解斜視図、第３図は製造に用いるリー
ドフレームの斜視図、第４図乃至第６図は本考案
発光装置の第２の実施例を説明するためのもので
、第４図は断面図、第５図は分解斜視図、第６図
は製造に用いるリードフレームの斜視図、第７図
は発光装置の従来例の一を示す斜視図である。
符号の説明、１……ヘツダー、２……リード、
２ａ……発光素子支持リード、３……発光素子、
７，１２……アース端子となる導電部材。
1 to 3 are for explaining one embodiment of the light emitting device of the present invention, and FIG. 1 is a sectional view;
FIG. 2 is an exploded perspective view, FIG. 3 is a perspective view of a lead frame used for manufacturing, and FIGS. 4 to 6 are for explaining the second embodiment of the light emitting device of the present invention. 5 is a sectional view, FIG. 5 is an exploded perspective view, FIG. 6 is a perspective view of a lead frame used for manufacturing, and FIG. 7 is a perspective view of a conventional example of a light emitting device. Explanation of symbols, 1...Header, 2...Lead,
2a... Light emitting element support lead, 3... Light emitting element,
7, 12... Conductive member serving as a ground terminal.
Claims (1)
リードのうちの１つであるところの発光素子を保
持するリードをアース端子となる他の導電部材に
接続してなる ことを特徴とする発光装置。[Scope of Claim for Utility Model Registration] A lead holding a light emitting element, which is one of a plurality of leads supported by a header made of an insulating material, is connected to another conductive member serving as a ground terminal. A light emitting device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6082687U JPS63167769U (en) | 1987-04-22 | 1987-04-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6082687U JPS63167769U (en) | 1987-04-22 | 1987-04-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63167769U true JPS63167769U (en) | 1988-11-01 |
Family
ID=30893594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6082687U Pending JPS63167769U (en) | 1987-04-22 | 1987-04-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63167769U (en) |
-
1987
- 1987-04-22 JP JP6082687U patent/JPS63167769U/ja active Pending