JPS63170978U - - Google Patents
Info
- Publication number
- JPS63170978U JPS63170978U JP6244987U JP6244987U JPS63170978U JP S63170978 U JPS63170978 U JP S63170978U JP 6244987 U JP6244987 U JP 6244987U JP 6244987 U JP6244987 U JP 6244987U JP S63170978 U JPS63170978 U JP S63170978U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- light emitting
- emitting element
- element support
- support lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011810 insulating material Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図乃至第３図は本考案発光装置の一つの実
施例を説明するためのもので、第１図は断面図、
第２図は分解斜視図、第３図は製造に用いるリー
ドフレームの斜視図、第４図は本考案発光装置の
変形例を示す断面図、第５図は従来例の分解斜視
図である。
符号の説明、１……ヘツダー、２，２……リー
ド、２ａ……発光素子支持リード、２ｂ……アー
ス端子、３……発光素子、５，５，６……リード
逃げ孔。
1 to 3 are for explaining one embodiment of the light emitting device of the present invention, and FIG. 1 is a sectional view;
2 is an exploded perspective view, FIG. 3 is a perspective view of a lead frame used for manufacturing, FIG. 4 is a sectional view showing a modification of the light emitting device of the present invention, and FIG. 5 is an exploded perspective view of a conventional example. Explanation of symbols: 1... Header, 2, 2... Lead, 2a... Light emitting element support lead, 2b... Earth terminal, 3... Light emitting element, 5, 5, 6... Lead escape hole.
Claims (1)
ドを含む複数本のリードが貫通状に支持され、 上記ヘツダーの下面にリード逃げ孔を有するヒ
ートシンクが該リード逃げ孔を上記リードが通る
状態で配置され、 上記発光素子支持リードの上端部には発光素子
が支持され、 発光素子支持リードのリード逃げ孔から下側へ
突出した部分の基部が上記ヒートシンクに接続さ
れ、 そして、発光素子支持リードのリード逃げ孔か
ら下側へ突出した部分がアース端子とされた ことを特徴とする発光装置。[Claims for Utility Model Registration] A header made of an insulating material has a plurality of leads including a light emitting element support lead supported in a penetrating manner, and a heat sink having lead relief holes on the lower surface of the header connects the lead relief holes to the leads. A light emitting element is supported on the upper end of the light emitting element support lead, a base of a portion of the light emitting element support lead protruding downward from the lead escape hole is connected to the heat sink, and A light emitting device characterized in that a portion of an element support lead protruding downward from a lead escape hole is used as a ground terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6244987U JPS63170978U (en) | 1987-04-24 | 1987-04-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6244987U JPS63170978U (en) | 1987-04-24 | 1987-04-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63170978U true JPS63170978U (en) | 1988-11-07 |
Family
ID=30896741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6244987U Pending JPS63170978U (en) | 1987-04-24 | 1987-04-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63170978U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012039156A (en) * | 2007-03-30 | 2012-02-23 | Seoul Semiconductor Co Ltd | Light-emitting diode lamp with low thermal resistance |
-
1987
- 1987-04-24 JP JP6244987U patent/JPS63170978U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012039156A (en) * | 2007-03-30 | 2012-02-23 | Seoul Semiconductor Co Ltd | Light-emitting diode lamp with low thermal resistance |