JPS63185266U - - Google Patents
Info
- Publication number
- JPS63185266U JPS63185266U JP1987076855U JP7685587U JPS63185266U JP S63185266 U JPS63185266 U JP S63185266U JP 1987076855 U JP1987076855 U JP 1987076855U JP 7685587 U JP7685587 U JP 7685587U JP S63185266 U JPS63185266 U JP S63185266U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- light emitting
- header
- emitting element
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012212 insulator Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図は本考案発光装置の一つの実施例を示す
断面図、第２図は従来例を示す斜視図である。
符号の説明、１……ヘツダー、２……リード、
２ａ……発光素子支持リード、３……発光素子、
５……ヒートシンク、６……リード逃げ孔、７…
…ヒートシンクのヘツダーから食み出して折り曲
げられた部分。
FIG. 1 is a sectional view showing one embodiment of the light emitting device of the present invention, and FIG. 2 is a perspective view showing a conventional example. Explanation of symbols, 1...Header, 2...Lead,
2a...Light emitting element support lead, 3...Light emitting element,
5...Heat sink, 6...Lead escape hole, 7...
...The part that protrudes from the header of the heat sink and is bent.
Claims (1)
ないリードが絶縁体からなるヘツダーに貫通状に
固定され、 上記ヘツダーの下面に、上記の発光素子を支持
しないリードを逃げるリード逃げ孔を少なくとも
備えたヒートシンクが、上記の発光素子を支持す
るリードとは接触せしめられ上記リード逃げ孔を
上記の発光素子を支持しないリードが非接触で通
るような状態で固定され、 上記ヒートシンクが少なくとも一部において上
記ヘツダーから食み出すように形成され、 上記ヒートシンクの上記ヘツダーから食み出す
ように形成された部分が上記ヘツダーに対して略
直角に折り曲げられてなる ことを特徴とする発光装置。[Claims for Utility Model Registration] A lead that supports the light emitting element and a lead that does not support the light emitting element are fixed to a header made of an insulator in a penetrating manner, and the lead that does not support the light emitting element escapes from the lower surface of the header. A heat sink having at least a lead relief hole is brought into contact with the lead supporting the light emitting element, and is fixed in such a state that a lead not supporting the light emitting element passes through the lead relief hole without contact, and the heat sink is formed such that at least a portion of the heat sink protrudes from the header, and the portion of the heat sink that is formed so as to protrude from the header is bent at a substantially right angle to the header. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987076855U JPS63185266U (en) | 1987-05-22 | 1987-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987076855U JPS63185266U (en) | 1987-05-22 | 1987-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63185266U true JPS63185266U (en) | 1988-11-29 |
Family
ID=30924319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987076855U Pending JPS63185266U (en) | 1987-05-22 | 1987-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63185266U (en) |
-
1987
- 1987-05-22 JP JP1987076855U patent/JPS63185266U/ja active Pending