JPS63102264U - - Google Patents
Info
- Publication number
- JPS63102264U JPS63102264U JP1986197921U JP19792186U JPS63102264U JP S63102264 U JPS63102264 U JP S63102264U JP 1986197921 U JP1986197921 U JP 1986197921U JP 19792186 U JP19792186 U JP 19792186U JP S63102264 U JPS63102264 U JP S63102264U
- Authority
- JP
- Japan
- Prior art keywords
- compound semiconductor
- diagonal line
- light
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 150000001875 compounds Chemical class 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000000605 extraction Methods 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Description
第１図は本考案実施例の発光素子の斜視図で、
第２図はその発光素子を用いた投光器の要部断面
図である。
１……化合物半導体、１５……光取出部、１６
……囲繞電極、２……球体。
FIG. 1 is a perspective view of a light emitting device according to an embodiment of the present invention.
FIG. 2 is a sectional view of a main part of a floodlight using the light emitting element. 1...Compound semiconductor, 15...Light extraction part, 16
... Surrounding electrode, 2... Sphere.
Claims (1)
になるように表面周辺部に囲繞電極を有し、その
光取出部に透光性の球体を載置した発光素子にお
いて、その化合物半導体は表面が菱形をした四角
柱である事を特徴とする発光素子。 (2) 前記化合物半導体の表面は、前記球体の直
径と略等しい長さの対角線と、その長さより長い
対角線とを有している事を特徴とする前記実用新
案登録請求の範囲第１項記載の発光素子。[Claims for Utility Model Registration] (1) A surrounding electrode is provided around the surface of the compound semiconductor so that the light extraction portion is approximately at the center of the surface, and a translucent sphere is placed in the light extraction portion. A light-emitting device characterized in that the compound semiconductor is a square prism with a diamond-shaped surface. (2) The surface of the compound semiconductor has a diagonal line whose length is approximately equal to the diameter of the sphere, and a diagonal line whose length is longer than the diagonal line, as set forth in claim 1 of the utility model registration claim. light emitting element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986197921U JPH08767Y2 (en) | 1986-12-22 | 1986-12-22 | Light emitting element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986197921U JPH08767Y2 (en) | 1986-12-22 | 1986-12-22 | Light emitting element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63102264U true JPS63102264U (en) | 1988-07-02 |
| JPH08767Y2 JPH08767Y2 (en) | 1996-01-10 |
Family
ID=31158132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986197921U Expired - Lifetime JPH08767Y2 (en) | 1986-12-22 | 1986-12-22 | Light emitting element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08767Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5322386A (en) * | 1976-08-12 | 1978-03-01 | Sanyo Electric Co Ltd | Polarity identifying method of light emitting diode pellets |
| JPS5961127A (en) * | 1982-09-30 | 1984-04-07 | Fujitsu Ltd | Method for liquid-phase epitaxial growth |
-
1986
- 1986-12-22 JP JP1986197921U patent/JPH08767Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5322386A (en) * | 1976-08-12 | 1978-03-01 | Sanyo Electric Co Ltd | Polarity identifying method of light emitting diode pellets |
| JPS5961127A (en) * | 1982-09-30 | 1984-04-07 | Fujitsu Ltd | Method for liquid-phase epitaxial growth |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08767Y2 (en) | 1996-01-10 |