JPS63149539U - - Google Patents

Info

Publication number
JPS63149539U
JPS63149539U JP4236187U JP4236187U JPS63149539U JP S63149539 U JPS63149539 U JP S63149539U JP 4236187 U JP4236187 U JP 4236187U JP 4236187 U JP4236187 U JP 4236187U JP S63149539 U JPS63149539 U JP S63149539U
Authority
JP
Japan
Prior art keywords
stem
lead
stem body
main surface
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4236187U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4236187U priority Critical patent/JPS63149539U/ja
Publication of JPS63149539U publication Critical patent/JPS63149539U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本考案の一実施例の断面図、第2図
は、従来の半導体ステムの断面図である。 11……ステム本体、12……リード貫通孔、
13……絶縁部材、14……凸部、15……リー
ド、20……半導体ステム。
FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional semiconductor stem. 11...Stem body, 12...Lead through hole,
13...Insulating member, 14...Protrusion, 15...Lead, 20 ...Semiconductor stem.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 主面に素子装着部を有するステム本体と、該ス
テム本体に複数個形成されたリード貫通孔と、該
リード貫通孔に絶縁部材を介して貫挿・固着され
たリードとを有する半導体ステムにおいて、複数
個の絶縁部材をステム本体の主面と反対側の下面
側に凸状に突出したことを特徴とする半導体ステ
ム。
A semiconductor stem having a stem body having an element mounting portion on the main surface, a plurality of lead through holes formed in the stem body, and a lead inserted and fixed to the lead through hole via an insulating member, A semiconductor stem characterized in that a plurality of insulating members protrude convexly from a lower surface opposite to a main surface of a stem body.
JP4236187U 1987-03-23 1987-03-23 Pending JPS63149539U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4236187U JPS63149539U (en) 1987-03-23 1987-03-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4236187U JPS63149539U (en) 1987-03-23 1987-03-23

Publications (1)

Publication Number Publication Date
JPS63149539U true JPS63149539U (en) 1988-10-03

Family

ID=30858194

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4236187U Pending JPS63149539U (en) 1987-03-23 1987-03-23

Country Status (1)

Country Link
JP (1) JPS63149539U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4327734Y1 (en) * 1966-04-19 1968-11-15

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4327734Y1 (en) * 1966-04-19 1968-11-15

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