JPS63153489U - - Google Patents
Info
- Publication number
- JPS63153489U JPS63153489U JP1987045810U JP4581087U JPS63153489U JP S63153489 U JPS63153489 U JP S63153489U JP 1987045810 U JP1987045810 U JP 1987045810U JP 4581087 U JP4581087 U JP 4581087U JP S63153489 U JPS63153489 U JP S63153489U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- pin
- substrate
- hole
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000012212 insulator Substances 0.000 description 1
Description
第１図は本考案の一実施例を示した側面図、第
２図は第１図に示した半導体チツプソケツトと基
板との接着状態を示した図、第３図は従来の半導
体チツプソケツトを示した側面図、第４図は第３
図に示した半導体チツプソケツトと基板との接着
状態を示した図である。
１……基板表面と対向する面、２……ピン、３
……半導体チツプと対向する面、４……ホール、
２０……突起絶縁物。
Figure 1 is a side view showing an embodiment of the present invention, Figure 2 is a diagram showing the state of adhesion between the semiconductor chip socket shown in Figure 1 and the substrate, and Figure 3 is a diagram showing a conventional semiconductor chip socket. Side view, Figure 4 is the 3rd
FIG. 3 is a diagram showing the state of adhesion between the semiconductor chip socket shown in the figure and the substrate. 1...Surface facing the substrate surface, 2...Pin, 3
...Surface facing the semiconductor chip, 4...Hole,
20... Protrusion insulator.
Claims (1)
ケツトにおいて、前記基板表面と対向する面に、
前記基板のホールに挿着するピンと、このピンと
前記基板表面と所定間隙を保持する突起手段とを
有し、前記半導体チツプと対向する面に、前記半
導体チツプのピンが挿着されるホールを有するこ
とを特徴とする半導体チツプソケツト。 In a semiconductor chip socket for mounting a semiconductor chip on a board, a surface opposite to the surface of the board has a
The semiconductor chip has a pin inserted into a hole in the substrate, a protruding means for maintaining a predetermined gap between the pin and the surface of the substrate, and a hole in a surface facing the semiconductor chip, into which the pin of the semiconductor chip is inserted. A semiconductor chip socket characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987045810U JPS63153489U (en) | 1987-03-30 | 1987-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987045810U JPS63153489U (en) | 1987-03-30 | 1987-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63153489U true JPS63153489U (en) | 1988-10-07 |
Family
ID=30864886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987045810U Pending JPS63153489U (en) | 1987-03-30 | 1987-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63153489U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11077806B2 (en) | 2012-04-20 | 2021-08-03 | Hitachi Metals, Ltd. | Complex harness |
-
1987
- 1987-03-30 JP JP1987045810U patent/JPS63153489U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11077806B2 (en) | 2012-04-20 | 2021-08-03 | Hitachi Metals, Ltd. | Complex harness |
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