JPH0336114U - - Google Patents

Info

Publication number
JPH0336114U
JPH0336114U JP9669989U JP9669989U JPH0336114U JP H0336114 U JPH0336114 U JP H0336114U JP 9669989 U JP9669989 U JP 9669989U JP 9669989 U JP9669989 U JP 9669989U JP H0336114 U JPH0336114 U JP H0336114U
Authority
JP
Japan
Prior art keywords
hole
lead terminal
electronic component
component body
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9669989U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9669989U priority Critical patent/JPH0336114U/ja
Publication of JPH0336114U publication Critical patent/JPH0336114U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例の平面図、第2図は
その−線断面図、第3図は本考案の他の実施
例の平面図、第4図はその−線断面図、第5
図は従来例の平面図、第6図は第5図の−線
断面図、第7図a及びbと第8図a及びbはいず
れも従来例の作用説明図である。 1……コア、3……リード端子接着用穴、4…
…凹部、5……接着剤、6……リード端子。
Fig. 1 is a plan view of one embodiment of the present invention, Fig. 2 is a sectional view taken along the - line, Fig. 3 is a plan view of another embodiment of the invention, and Fig. 4 is a sectional view taken along the - line. 5
6 is a plan view of the conventional example, FIG. 6 is a cross-sectional view taken along the line -- in FIG. 5, and FIGS. 1...core, 3...hole for lead terminal adhesion, 4...
... recess, 5 ... adhesive, 6 ... lead terminal.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品本体表面に、リード端子接着用穴を形
成すると共に該穴に連なる浅い凹部を形成し、該
穴及び凹部に接着剤を注入し、該穴に挿入したリ
ード端子を電子部品本体に接着してなる電子部品
のリード端子取付構造。
A hole for adhering a lead terminal is formed on the surface of the electronic component body, and a shallow recess connected to the hole is formed, an adhesive is injected into the hole and the recess, and the lead terminal inserted into the hole is adhered to the electronic component body. Lead terminal mounting structure for electronic components.
JP9669989U 1989-08-21 1989-08-21 Pending JPH0336114U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9669989U JPH0336114U (en) 1989-08-21 1989-08-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9669989U JPH0336114U (en) 1989-08-21 1989-08-21

Publications (1)

Publication Number Publication Date
JPH0336114U true JPH0336114U (en) 1991-04-09

Family

ID=31645886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9669989U Pending JPH0336114U (en) 1989-08-21 1989-08-21

Country Status (1)

Country Link
JP (1) JPH0336114U (en)

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