JPS63163275U - - Google Patents
Info
- Publication number
- JPS63163275U JPS63163275U JP5566487U JP5566487U JPS63163275U JP S63163275 U JPS63163275 U JP S63163275U JP 5566487 U JP5566487 U JP 5566487U JP 5566487 U JP5566487 U JP 5566487U JP S63163275 U JPS63163275 U JP S63163275U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- soldering iron
- feeding mechanism
- iron
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 10
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は、本考察の一部断面図、第２図は、本
考察の実施例における使用方法の図を示す。
１０１……こて先、１０２……ナツト、１０３
……放熱板、１０４……陶磁器、１０５……握り
部分、１０６……ローラー、１０７……半田、２
０１……電子部品の配線、２０２……基板上の配
線、２０３……基板、２０４……半田、２０５…
…ローラー、２０６……半田ごて。
FIG. 1 is a partial cross-sectional view of the present study, and FIG. 2 is a diagram showing the method of use in the embodiment of the present study. 101...Tip, 102...Natsuto, 103
... Heat sink, 104 ... Ceramic, 105 ... Grip part, 106 ... Roller, 107 ... Solder, 2
01... Wiring of electronic components, 202... Wiring on board, 203... Board, 204... Solder, 205...
...roller, 206...soldering iron.
Claims (1)
送り出し機構が、前記半田を制御するように配置
したことを特徴とする半田ごて装置。[Scope of Claim for Utility Model Registration] (a) A soldering iron, (b) consisting of a soldering iron, (c) solder, and (d) a feeding mechanism, (e) said iron and solder being integrated, and A soldering iron device characterized in that the feeding mechanism is arranged to control the solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5566487U JPS63163275U (en) | 1987-04-13 | 1987-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5566487U JPS63163275U (en) | 1987-04-13 | 1987-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63163275U true JPS63163275U (en) | 1988-10-25 |
Family
ID=30883773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5566487U Pending JPS63163275U (en) | 1987-04-13 | 1987-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63163275U (en) |
-
1987
- 1987-04-13 JP JP5566487U patent/JPS63163275U/ja active Pending