JPH02118690U - - Google Patents
Info
- Publication number
- JPH02118690U JPH02118690U JP2486089U JP2486089U JPH02118690U JP H02118690 U JPH02118690 U JP H02118690U JP 2486089 U JP2486089 U JP 2486089U JP 2486089 U JP2486089 U JP 2486089U JP H02118690 U JPH02118690 U JP H02118690U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- cooling means
- cooling
- surface cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はこの考案の一実施例によるプリント基
板の半田付装置を示す概念図、第２図は従来のプ
リント基板の半田付装置を示す断面である。
１はプリント基板、２はキヤリア、３は爪、４
はハンダバス、５は下面冷却手段、６は風、７は
レール、８は上面冷却手段、９はインバータ制御
回路、１０は入力装置。なお、図中、同一符号は
同一または相当部分を示す。
FIG. 1 is a conceptual diagram showing a printed circuit board soldering apparatus according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view showing a conventional printed circuit board soldering apparatus. 1 is a printed circuit board, 2 is a carrier, 3 is a nail, 4
5 is a solder bath, 5 is a lower surface cooling means, 6 is a wind, 7 is a rail, 8 is an upper surface cooling means, 9 is an inverter control circuit, and 10 is an input device. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
有したプリント基板の半田付装置において、上記
下面冷却手段に加えて上記プリント基板の上部近
傍に、プリント基板の上面を冷却する上面冷却手
段を設けるようにしたことを特徴とするプリント
基板の半田付装置。 In a printed circuit board soldering apparatus having a lower surface cooling means for cooling the lower surface of the printed circuit board, in addition to the lower surface cooling means, an upper surface cooling means for cooling the upper surface of the printed circuit board is provided near the upper part of the printed circuit board. A printed circuit board soldering device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2486089U JPH02118690U (en) | 1989-03-03 | 1989-03-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2486089U JPH02118690U (en) | 1989-03-03 | 1989-03-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02118690U true JPH02118690U (en) | 1990-09-25 |
Family
ID=31245077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2486089U Pending JPH02118690U (en) | 1989-03-03 | 1989-03-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02118690U (en) |
-
1989
- 1989-03-03 JP JP2486089U patent/JPH02118690U/ja active Pending