JPS63158859A - 電子部品 - Google Patents
電子部品Info
- Publication number
- JPS63158859A JPS63158859A JP31226487A JP31226487A JPS63158859A JP S63158859 A JPS63158859 A JP S63158859A JP 31226487 A JP31226487 A JP 31226487A JP 31226487 A JP31226487 A JP 31226487A JP S63158859 A JPS63158859 A JP S63158859A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- base material
- layer
- added
- electronic part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 26
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 19
- 239000000956 alloy Substances 0.000 claims abstract description 19
- 229910052718 tin Inorganic materials 0.000 claims abstract description 16
- 229910052742 iron Inorganic materials 0.000 claims abstract description 15
- 238000009792 diffusion process Methods 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 11
- 239000000654 additive Substances 0.000 claims abstract description 9
- 230000000996 additive effect Effects 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 6
- 229910000765 intermetallic Inorganic materials 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 8
- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 229910052725 zinc Inorganic materials 0.000 abstract description 3
- 230000003292 diminished effect Effects 0.000 abstract 1
- 239000010949 copper Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000006104 solid solution Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229910018082 Cu3Sn Inorganic materials 0.000 description 2
- 229910001297 Zn alloy Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 244000205754 Colocasia esculenta Species 0.000 description 1
- 235000006481 Colocasia esculenta Nutrition 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 240000007472 Leucaena leucocephala Species 0.000 description 1
- 235000010643 Leucaena leucocephala Nutrition 0.000 description 1
- 229910007565 Zn—Cu Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31226487A JPS63158859A (ja) | 1987-12-11 | 1987-12-11 | 電子部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31226487A JPS63158859A (ja) | 1987-12-11 | 1987-12-11 | 電子部品 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11281383A Division JPS605550A (ja) | 1983-06-24 | 1983-06-24 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63158859A true JPS63158859A (ja) | 1988-07-01 |
JPH0366813B2 JPH0366813B2 (enrdf_load_stackoverflow) | 1991-10-18 |
Family
ID=18027148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP31226487A Granted JPS63158859A (ja) | 1987-12-11 | 1987-12-11 | 電子部品 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63158859A (enrdf_load_stackoverflow) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58112813A (ja) * | 1981-12-25 | 1983-07-05 | Niigata Eng Co Ltd | 軌道車両における空気タイヤ異常検出方法 |
JPS605550A (ja) * | 1983-06-24 | 1985-01-12 | Toshiba Corp | 電子部品 |
-
1987
- 1987-12-11 JP JP31226487A patent/JPS63158859A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58112813A (ja) * | 1981-12-25 | 1983-07-05 | Niigata Eng Co Ltd | 軌道車両における空気タイヤ異常検出方法 |
JPS605550A (ja) * | 1983-06-24 | 1985-01-12 | Toshiba Corp | 電子部品 |
Also Published As
Publication number | Publication date |
---|---|
JPH0366813B2 (enrdf_load_stackoverflow) | 1991-10-18 |
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