JPS6315747B2 - - Google Patents
Info
- Publication number
- JPS6315747B2 JPS6315747B2 JP56036460A JP3646081A JPS6315747B2 JP S6315747 B2 JPS6315747 B2 JP S6315747B2 JP 56036460 A JP56036460 A JP 56036460A JP 3646081 A JP3646081 A JP 3646081A JP S6315747 B2 JPS6315747 B2 JP S6315747B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- mounting base
- container body
- terminal mounting
- elongated hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005219 brazing Methods 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 229910000833 kovar Inorganic materials 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Photovoltaic Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3646081A JPS57152154A (en) | 1981-03-16 | 1981-03-16 | Structure of terminal part of air-tight sealing vessel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3646081A JPS57152154A (en) | 1981-03-16 | 1981-03-16 | Structure of terminal part of air-tight sealing vessel |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57152154A JPS57152154A (en) | 1982-09-20 |
JPS6315747B2 true JPS6315747B2 (US07709020-20100504-C00041.png) | 1988-04-06 |
Family
ID=12470425
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3646081A Granted JPS57152154A (en) | 1981-03-16 | 1981-03-16 | Structure of terminal part of air-tight sealing vessel |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57152154A (US07709020-20100504-C00041.png) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59134279U (ja) * | 1982-12-20 | 1984-09-07 | 株式会社フジ電科 | 気密端子 |
AU2538188A (en) * | 1987-09-25 | 1989-04-18 | Aegis Inc. | Microcircuit package with corrosion resistant pins and method of making |
US5434358A (en) * | 1993-12-13 | 1995-07-18 | E-Systems, Inc. | High density hermetic electrical feedthroughs |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4310512Y1 (US07709020-20100504-C00041.png) * | 1965-09-22 | 1968-05-08 | ||
JPS5091271A (US07709020-20100504-C00041.png) * | 1973-12-12 | 1975-07-21 | ||
JPS526179B2 (US07709020-20100504-C00041.png) * | 1972-11-10 | 1977-02-19 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5326934Y2 (US07709020-20100504-C00041.png) * | 1973-12-29 | 1978-07-08 | ||
JPS5437963Y2 (US07709020-20100504-C00041.png) * | 1975-06-30 | 1979-11-13 |
-
1981
- 1981-03-16 JP JP3646081A patent/JPS57152154A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4310512Y1 (US07709020-20100504-C00041.png) * | 1965-09-22 | 1968-05-08 | ||
JPS526179B2 (US07709020-20100504-C00041.png) * | 1972-11-10 | 1977-02-19 | ||
JPS5091271A (US07709020-20100504-C00041.png) * | 1973-12-12 | 1975-07-21 |
Also Published As
Publication number | Publication date |
---|---|
JPS57152154A (en) | 1982-09-20 |
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