JPS57152154A - Structure of terminal part of air-tight sealing vessel - Google Patents

Structure of terminal part of air-tight sealing vessel

Info

Publication number
JPS57152154A
JPS57152154A JP3646081A JP3646081A JPS57152154A JP S57152154 A JPS57152154 A JP S57152154A JP 3646081 A JP3646081 A JP 3646081A JP 3646081 A JP3646081 A JP 3646081A JP S57152154 A JPS57152154 A JP S57152154A
Authority
JP
Japan
Prior art keywords
vessel body
air
vessel
tight sealing
terminal members
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3646081A
Other languages
English (en)
Other versions
JPS6315747B2 (ja
Inventor
Tadayoshi Ando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Denka Inc
Original Assignee
Fuji Denka Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Denka Inc filed Critical Fuji Denka Inc
Priority to JP3646081A priority Critical patent/JPS57152154A/ja
Publication of JPS57152154A publication Critical patent/JPS57152154A/ja
Publication of JPS6315747B2 publication Critical patent/JPS6315747B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Photovoltaic Devices (AREA)
JP3646081A 1981-03-16 1981-03-16 Structure of terminal part of air-tight sealing vessel Granted JPS57152154A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3646081A JPS57152154A (en) 1981-03-16 1981-03-16 Structure of terminal part of air-tight sealing vessel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3646081A JPS57152154A (en) 1981-03-16 1981-03-16 Structure of terminal part of air-tight sealing vessel

Publications (2)

Publication Number Publication Date
JPS57152154A true JPS57152154A (en) 1982-09-20
JPS6315747B2 JPS6315747B2 (ja) 1988-04-06

Family

ID=12470425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3646081A Granted JPS57152154A (en) 1981-03-16 1981-03-16 Structure of terminal part of air-tight sealing vessel

Country Status (1)

Country Link
JP (1) JPS57152154A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59134279U (ja) * 1982-12-20 1984-09-07 株式会社フジ電科 気密端子
WO1989003123A1 (en) * 1987-09-25 1989-04-06 Aegis, Inc. Microcircuit package with corrosion resistant pins and methof of making
US5434358A (en) * 1993-12-13 1995-07-18 E-Systems, Inc. High density hermetic electrical feedthroughs

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4310512Y1 (ja) * 1965-09-22 1968-05-08
JPS5091271A (ja) * 1973-12-12 1975-07-21
JPS5097370U (ja) * 1973-12-29 1975-08-14
JPS526179U (ja) * 1975-06-30 1977-01-17

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS526179B2 (ja) * 1972-11-10 1977-02-19

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4310512Y1 (ja) * 1965-09-22 1968-05-08
JPS5091271A (ja) * 1973-12-12 1975-07-21
JPS5097370U (ja) * 1973-12-29 1975-08-14
JPS526179U (ja) * 1975-06-30 1977-01-17

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59134279U (ja) * 1982-12-20 1984-09-07 株式会社フジ電科 気密端子
JPS623898Y2 (ja) * 1982-12-20 1987-01-28
WO1989003123A1 (en) * 1987-09-25 1989-04-06 Aegis, Inc. Microcircuit package with corrosion resistant pins and methof of making
US5434358A (en) * 1993-12-13 1995-07-18 E-Systems, Inc. High density hermetic electrical feedthroughs

Also Published As

Publication number Publication date
JPS6315747B2 (ja) 1988-04-06

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