JPS63153572U - - Google Patents
Info
- Publication number
- JPS63153572U JPS63153572U JP4528487U JP4528487U JPS63153572U JP S63153572 U JPS63153572 U JP S63153572U JP 4528487 U JP4528487 U JP 4528487U JP 4528487 U JP4528487 U JP 4528487U JP S63153572 U JPS63153572 U JP S63153572U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- component mounting
- solder resist
- diameter
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例のスルーホール基板
の要部を示す断面図、第２図は第１図のスルーホ
ール基板に電子部品を半田付実装した状態を示す
断面図、第３図は従来のスルーホール基板の要部
を示す断面図である。
１，２１……部品実装面、２，２２……半田付
面、３，４，２３，２４……ランド、５，１１，
２５，３１……フイルム状のソルダーレジスト、
６，２６……スルーホール、７，２７……基材、
８……電子部品のリード、９……半田、１０，３
０……部品実装用穴。
Fig. 1 is a sectional view showing the main parts of a through-hole board according to an embodiment of the present invention, Fig. 2 is a sectional view showing electronic components soldered and mounted on the through-hole board of Fig. 1, and Fig. 3. 1 is a cross-sectional view showing the main parts of a conventional through-hole board. 1, 21... Component mounting surface, 2, 22... Soldering surface, 3, 4, 23, 24... Land, 5, 11,
25, 31... film-like solder resist,
6, 26... Through hole, 7, 27... Base material,
8...Electronic component lead, 9...Solder, 10,3
0... Hole for component mounting.
Claims (1)
被覆してあり、スルーホールとほぼ同軸に部品実
装用穴が前記ソルダーレジストに設けてあるスル
ーホール基板において、前記ソルダーレジストの
部品実装用穴の径がスルーホールの径よりも小さ
いことを特徴とするスルーホール基板。 In a through-hole board in which a film-like solder resist covers the component mounting surface and a component mounting hole is provided in the solder resist almost coaxially with the through hole, the diameter of the component mounting hole in the solder resist is through-hole. A through-hole board characterized by being smaller than the diameter of the hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4528487U JPS63153572U (en) | 1987-03-27 | 1987-03-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4528487U JPS63153572U (en) | 1987-03-27 | 1987-03-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63153572U true JPS63153572U (en) | 1988-10-07 |
Family
ID=30863883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4528487U Pending JPS63153572U (en) | 1987-03-27 | 1987-03-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63153572U (en) |
-
1987
- 1987-03-27 JP JP4528487U patent/JPS63153572U/ja active Pending