JPS6315100B2 - - Google Patents

Info

Publication number
JPS6315100B2
JPS6315100B2 JP13006481A JP13006481A JPS6315100B2 JP S6315100 B2 JPS6315100 B2 JP S6315100B2 JP 13006481 A JP13006481 A JP 13006481A JP 13006481 A JP13006481 A JP 13006481A JP S6315100 B2 JPS6315100 B2 JP S6315100B2
Authority
JP
Japan
Prior art keywords
wafer
grinding wheel
grinding
finish
rough
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP13006481A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5834751A (ja
Inventor
Takashi Sano
Atsushi Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Hitachi Seiko Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Seiko Ltd filed Critical Hitachi Seiko Ltd
Priority to JP13006481A priority Critical patent/JPS5834751A/ja
Publication of JPS5834751A publication Critical patent/JPS5834751A/ja
Publication of JPS6315100B2 publication Critical patent/JPS6315100B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10Single-purpose machines or devices
    • B24B7/16Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
JP13006481A 1981-08-21 1981-08-21 ウエハ研削盤 Granted JPS5834751A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13006481A JPS5834751A (ja) 1981-08-21 1981-08-21 ウエハ研削盤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13006481A JPS5834751A (ja) 1981-08-21 1981-08-21 ウエハ研削盤

Publications (2)

Publication Number Publication Date
JPS5834751A JPS5834751A (ja) 1983-03-01
JPS6315100B2 true JPS6315100B2 (sv) 1988-04-02

Family

ID=15025147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13006481A Granted JPS5834751A (ja) 1981-08-21 1981-08-21 ウエハ研削盤

Country Status (1)

Country Link
JP (1) JPS5834751A (sv)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59232758A (ja) * 1983-06-13 1984-12-27 Matsushita Electric Ind Co Ltd 球面加工装置
JPS6044206A (ja) * 1983-08-19 1985-03-09 Kitamura Kikai Kk 多軸立型フライス盤における工具長調整装置
JPS6076959A (ja) * 1983-09-30 1985-05-01 Fujitsu Ltd 半導体装置の製造方法
JPS60242951A (ja) * 1984-05-17 1985-12-02 Matsushita Electric Ind Co Ltd 面取り加工システム
JPS60242953A (ja) * 1984-05-17 1985-12-02 Matsushita Electric Ind Co Ltd 面取り加工装置
JP4808278B2 (ja) * 1999-01-06 2011-11-02 株式会社東京精密 平面加工装置及び方法
JP4455750B2 (ja) * 2000-12-27 2010-04-21 株式会社ディスコ 研削装置

Also Published As

Publication number Publication date
JPS5834751A (ja) 1983-03-01

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