JPS63145329U - - Google Patents
Info
- Publication number
- JPS63145329U JPS63145329U JP3675287U JP3675287U JPS63145329U JP S63145329 U JPS63145329 U JP S63145329U JP 3675287 U JP3675287 U JP 3675287U JP 3675287 U JP3675287 U JP 3675287U JP S63145329 U JPS63145329 U JP S63145329U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- arm
- holding surface
- buffer member
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 7
- 230000032258 transport Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 2
Description
第１図はこの考案の一実施例を示すウエハの熱
処理装置の断面図で第２図―線拡大断面相当
図、第２図は従来のウエハの熱処理装置を示す平
面図、第３図は第２図の―線断面図である。
図において、１は半導体ウエハの熱処理装置、
５は上下ビーム、７はウエハ搬送アーム、７ａは
第１アーム、７ｂは第２アーム、７ｃは第３アー
ム、７ｈは真空吸着用孔、７ｊは緩衝ゴム、８は
第１加熱プレート、９は第２加熱プレート、２１
〜２４は半導体ウエハ。尚、各図中、同一符号は
同一又は相当部分を示す。
Figure 1 is a cross-sectional view of a wafer heat treatment apparatus showing an embodiment of this invention; Figure 2 is an enlarged sectional view corresponding to a line; Figure 2 is a plan view of a conventional wafer heat treatment apparatus; 2 is a cross-sectional view taken along the line -- in FIG. 2. In the figure, 1 is a semiconductor wafer heat treatment device;
5 is a vertical beam, 7 is a wafer transfer arm, 7a is a first arm, 7b is a second arm, 7c is a third arm, 7h is a vacuum suction hole, 7j is a buffer rubber, 8 is a first heating plate, 9 is a second heating plate, 21
~24 is a semiconductor wafer. In each figure, the same reference numerals indicate the same or corresponding parts.
Claims (1)
ウエハを持ち上げる上下ビームと、持ち上げられ
たウエハを下側から保持し保持面に吸着固定して
搬送するアームとを具備するウエハの熱処理装置
において、上記アームの保持面に緩衝部材を配置
し、上記ウエハをこの緩衝部材上に載置した状態
で吸着固定可能としたことを特徴とするウエハの
熱処理装置。 A wafer heat treatment apparatus comprising a heating plate for heat-treating a wafer, a vertical beam that moves upward to lift the wafer, and an arm that holds the lifted wafer from below and transports the wafer by suctioning and fixing it to a holding surface. A wafer heat processing apparatus characterized in that a buffer member is disposed on the holding surface of the arm, and the wafer can be fixed by suction while placed on the buffer member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3675287U JPS63145329U (en) | 1987-03-13 | 1987-03-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3675287U JPS63145329U (en) | 1987-03-13 | 1987-03-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63145329U true JPS63145329U (en) | 1988-09-26 |
Family
ID=30847451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3675287U Pending JPS63145329U (en) | 1987-03-13 | 1987-03-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63145329U (en) |
-
1987
- 1987-03-13 JP JP3675287U patent/JPS63145329U/ja active Pending
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