JPS63145329U - - Google Patents

Info

Publication number
JPS63145329U
JPS63145329U JP3675287U JP3675287U JPS63145329U JP S63145329 U JPS63145329 U JP S63145329U JP 3675287 U JP3675287 U JP 3675287U JP 3675287 U JP3675287 U JP 3675287U JP S63145329 U JPS63145329 U JP S63145329U
Authority
JP
Japan
Prior art keywords
wafer
arm
holding surface
buffer member
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3675287U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3675287U priority Critical patent/JPS63145329U/ja
Publication of JPS63145329U publication Critical patent/JPS63145329U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の一実施例を示すウエハの熱
処理装置の断面図で第2図―線拡大断面相当
図、第2図は従来のウエハの熱処理装置を示す平
面図、第3図は第2図の―線断面図である。 図において、1は半導体ウエハの熱処理装置、
5は上下ビーム、7はウエハ搬送アーム、7aは
第1アーム、7bは第2アーム、7cは第3アー
ム、7hは真空吸着用孔、7jは緩衝ゴム、8は
第1加熱プレート、9は第2加熱プレート、21
〜24は半導体ウエハ。尚、各図中、同一符号は
同一又は相当部分を示す。
Figure 1 is a cross-sectional view of a wafer heat treatment apparatus showing an embodiment of this invention; Figure 2 is an enlarged sectional view corresponding to a line; Figure 2 is a plan view of a conventional wafer heat treatment apparatus; 2 is a cross-sectional view taken along the line -- in FIG. 2. In the figure, 1 is a semiconductor wafer heat treatment device;
5 is a vertical beam, 7 is a wafer transfer arm, 7a is a first arm, 7b is a second arm, 7c is a third arm, 7h is a vacuum suction hole, 7j is a buffer rubber, 8 is a first heating plate, 9 is a second heating plate, 21
~24 is a semiconductor wafer. In each figure, the same reference numerals indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ウエハを熱処理する加熱プレートと、上動して
ウエハを持ち上げる上下ビームと、持ち上げられ
たウエハを下側から保持し保持面に吸着固定して
搬送するアームとを具備するウエハの熱処理装置
において、上記アームの保持面に緩衝部材を配置
し、上記ウエハをこの緩衝部材上に載置した状態
で吸着固定可能としたことを特徴とするウエハの
熱処理装置。
A wafer heat treatment apparatus comprising a heating plate for heat-treating a wafer, a vertical beam that moves upward to lift the wafer, and an arm that holds the lifted wafer from below and transports the wafer by suctioning and fixing it to a holding surface. A wafer heat processing apparatus characterized in that a buffer member is disposed on the holding surface of the arm, and the wafer can be fixed by suction while placed on the buffer member.
JP3675287U 1987-03-13 1987-03-13 Pending JPS63145329U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3675287U JPS63145329U (en) 1987-03-13 1987-03-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3675287U JPS63145329U (en) 1987-03-13 1987-03-13

Publications (1)

Publication Number Publication Date
JPS63145329U true JPS63145329U (en) 1988-09-26

Family

ID=30847451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3675287U Pending JPS63145329U (en) 1987-03-13 1987-03-13

Country Status (1)

Country Link
JP (1) JPS63145329U (en)

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