JPS63153529U - - Google Patents
Info
- Publication number
- JPS63153529U JPS63153529U JP4729187U JP4729187U JPS63153529U JP S63153529 U JPS63153529 U JP S63153529U JP 4729187 U JP4729187 U JP 4729187U JP 4729187 U JP4729187 U JP 4729187U JP S63153529 U JPS63153529 U JP S63153529U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- vacuum
- cleaning
- drying
- vacuum hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000007664 blowing Methods 0.000 description 1
Landscapes
- Cleaning In General (AREA)
Description
第１図は本考案のウエハ洗浄乾燥装置のステー
ジ部の平面図、第２図は第１図の側面図、第３図
は本考案の第２の実施例に係るウエハ洗浄乾燥装
置のステージ部を示す平面図である。
１……ウエハ、２……テーブル、３……シリン
ダ、４……アツパーブロツク、５……真空孔、６
……搬送パツド、８……真空引き装置、９……エ
アー吹出装置。
FIG. 1 is a plan view of the stage section of the wafer cleaning and drying apparatus of the present invention, FIG. 2 is a side view of FIG. 1, and FIG. 3 is the stage section of the wafer cleaning and drying apparatus according to the second embodiment of the present invention. FIG. 1...Wafer, 2...Table, 3...Cylinder, 4...Upper block, 5...Vacuum hole, 6
...Conveyance pad, 8...Vacuum pulling device, 9...Air blowing device.
Claims (1)
ダイシング加工後の半導体ウエハを該テーブルに
真空保持して該ウエハを洗浄、乾燥するウエハ洗
浄乾燥装置において、前記テーブルの真空孔を真
空引き装置とエアー吹出装置とに切替可能に接続
し、さらに、エアー圧を受けて前記テーブルより
分離した半導体ウエハの周縁を保持して該ウエハ
をテーブルの真空孔に対し上方位置に引き上げる
保持部を装備したことを特徴とするウエハ洗浄乾
燥装置。 In a wafer cleaning and drying device that holds a diced semiconductor wafer under vacuum on the table by drawing a vacuum from a vacuum hole provided in the table, cleaning and drying the wafer, the vacuum hole of the table is connected to a vacuum drawing device and an air blower. The present invention is characterized by being equipped with a holding part that is switchably connected to the apparatus, and further includes a holding part that receives air pressure to hold the peripheral edge of the semiconductor wafer separated from the table and lifts the wafer to a position above the vacuum hole of the table. Wafer cleaning and drying equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987047291U JPH069492Y2 (en) | 1987-03-30 | 1987-03-30 | Wafer cleaning / drying equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987047291U JPH069492Y2 (en) | 1987-03-30 | 1987-03-30 | Wafer cleaning / drying equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63153529U true JPS63153529U (en) | 1988-10-07 |
| JPH069492Y2 JPH069492Y2 (en) | 1994-03-09 |
Family
ID=30867759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987047291U Expired - Lifetime JPH069492Y2 (en) | 1987-03-30 | 1987-03-30 | Wafer cleaning / drying equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH069492Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012156416A (en) * | 2011-01-28 | 2012-08-16 | Lintec Corp | Support apparatus and support method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55102236A (en) * | 1979-01-30 | 1980-08-05 | Matsushita Electric Ind Co Ltd | Manufacuturing method of semiconductor device |
| JPS56118347A (en) * | 1980-02-22 | 1981-09-17 | Hitachi Ltd | Drying device |
| JPS57188347U (en) * | 1981-05-22 | 1982-11-30 |
-
1987
- 1987-03-30 JP JP1987047291U patent/JPH069492Y2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55102236A (en) * | 1979-01-30 | 1980-08-05 | Matsushita Electric Ind Co Ltd | Manufacuturing method of semiconductor device |
| JPS56118347A (en) * | 1980-02-22 | 1981-09-17 | Hitachi Ltd | Drying device |
| JPS57188347U (en) * | 1981-05-22 | 1982-11-30 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012156416A (en) * | 2011-01-28 | 2012-08-16 | Lintec Corp | Support apparatus and support method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH069492Y2 (en) | 1994-03-09 |