JPH01121932U - - Google Patents
Info
- Publication number
- JPH01121932U JPH01121932U JP1825388U JP1825388U JPH01121932U JP H01121932 U JPH01121932 U JP H01121932U JP 1825388 U JP1825388 U JP 1825388U JP 1825388 U JP1825388 U JP 1825388U JP H01121932 U JPH01121932 U JP H01121932U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- processing machine
- mounting table
- wafer processing
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
Landscapes
- Jigs For Machine Tools (AREA)
Description
第１図ａ，ｂは本考案の第１の実施例による半
導体ウエハー加工機の載物台の構成を示す上面図
及び縦断面図、第２図ａ，ｂは本考案の第２の実
施例による半導体ウエハー加工機の載物台の構成
を示す上面図及び縦断面図である。
１：半導体ウエハー、２：台、２ａ：接触部、
３：エアー吸引穴、４：エアー吸引ブロツク、５
：支持レール。
1A and 1B are top views and vertical sectional views showing the configuration of a stage of a semiconductor wafer processing machine according to the first embodiment of the present invention, and FIGS. 2A and 2B are the second embodiment of the present invention. FIG. 2 is a top view and a vertical cross-sectional view showing the configuration of a stage of a semiconductor wafer processing machine manufactured by Kogyo. 1: semiconductor wafer, 2: stand, 2a: contact part,
3: Air suction hole, 4: Air suction block, 5
:Support rail.
Claims (1)
載置する台と、前記台と隣接し、かつ載置された
半導体ウエハーの下面から離間された位置に半導
体ウエハーを固定するためのエアー吸引穴とから
成ることを特徴とする半導体ウエハー加工機の載
物台。[Scope of Claim for Utility Model Registration] In a mounting table for a semiconductor wafer processing machine, a table having an opening in the center on which the periphery of a semiconductor wafer is placed, and a lower surface of the semiconductor wafer placed adjacent to said table. 1. A stage for a semiconductor wafer processing machine, comprising: an air suction hole for fixing a semiconductor wafer at a position spaced from the mounting table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1825388U JPH01121932U (en) | 1988-02-15 | 1988-02-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1825388U JPH01121932U (en) | 1988-02-15 | 1988-02-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01121932U true JPH01121932U (en) | 1989-08-18 |
Family
ID=31232732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1825388U Pending JPH01121932U (en) | 1988-02-15 | 1988-02-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01121932U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006245252A (en) * | 2005-03-03 | 2006-09-14 | Dainippon Printing Co Ltd | Jig for placing silicon wafer, and surface shape detecting method for fine structure |
| JP2012156418A (en) * | 2011-01-28 | 2012-08-16 | Lintec Corp | Support apparatus of plate like member |
| JP2015185665A (en) * | 2014-03-24 | 2015-10-22 | リンテック株式会社 | Sheet peeling device and peeling method |
-
1988
- 1988-02-15 JP JP1825388U patent/JPH01121932U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006245252A (en) * | 2005-03-03 | 2006-09-14 | Dainippon Printing Co Ltd | Jig for placing silicon wafer, and surface shape detecting method for fine structure |
| JP4522889B2 (en) * | 2005-03-03 | 2010-08-11 | 大日本印刷株式会社 | Silicon wafer mounting jig and surface shape detection method of fine structure |
| JP2012156418A (en) * | 2011-01-28 | 2012-08-16 | Lintec Corp | Support apparatus of plate like member |
| JP2015185665A (en) * | 2014-03-24 | 2015-10-22 | リンテック株式会社 | Sheet peeling device and peeling method |