JPH069492Y2 - Wafer cleaning / drying equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a cleaning / drying apparatus for semiconductor wafers, and more particularly to a cleaning / drying apparatus for processing each wafer after dicing.

[Conventional technology]

Conventional cleaning and drying equipment supplies wafers on the table,
After performing vacuum suction and cleaning and drying while rotating the table, air was blown from the table surface to blow up the wafer so that the wafer floated above the table and the wafer was taken out by a transfer pad or tweezers.

[Problems to be solved by the invention]

The conventional wafer cleaning / drying apparatus described above blows air from the table surface when the wafer is taken out from the table.
Since the wafer is floated and its posture is not regulated, when the wafer floats from the table, the wafer slips on the table, making it difficult to take out the wafer with tweezers, etc. However, there is a problem that the workability is very poor because it requires careful handling. Also, when water droplets attached to the back surface of the wafer taken out of the table are gradually dried, dust is attached to the back surface of the wafer, or when stored in a cassette, the attached water droplets fall onto another wafer surface and dust, It is one of the factors that cause dirt and the like.

An object of the present invention is to provide a wafer cleaning / drying apparatus that solves the above problems.

[Differences from the Prior Art of Invention]

In contrast to the conventional wafer cleaning / drying apparatus described above, the present invention has an original content of supporting the peripheral edge of a semiconductor wafer and holding it to regulate the attitude of the wafer.

The wafer cleaning / drying apparatus of the present invention is a wafer cleaning / drying apparatus for cleaning and drying a semiconductor wafer after dicing by holding the semiconductor wafer after the dicing process in vacuum on the table by evacuation from vacuum holes provided at a plurality of locations on the table. , The vacuum hole of the table is switchably connected to an evacuation device and an air blowing device, and further, the peripheral edge of the semiconductor wafer separated from the table by receiving air pressure is held and the wafer is used as the vacuum hole of the table. On the other hand, a holding unit for pulling up to an upper position is provided, and while the semiconductor wafer is being pulled up to a position above the vacuum hole of the table by the holding unit, the table blows air from the plurality of vacuum holes provided. It is characterized by rotating and drying the surface of the said wafer.

〔Example〕

 Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIGS. 1 and 2 are views showing a first embodiment of the present invention.

1 and 2, the table 2 is rotatably supported on a support base 7 about a vertical axis, and a plurality of vacuum holes 5, 5 ... Are opened in the table surface of the table 2 to form vacuum holes. 5 is connected to the vacuuming device 8 and the air blowing device 9 by an air path 5a so as to be switchable via valves 10a and 10b. Furthermore, the four cylinders 3, which are located on the outer periphery of the table 2,
3 are vertically planted, and the L-shaped upper block 4 that fits into the notch 2a of the table 2 and supports the back surface of the wafer 1 is attached to the rod 3a of each cylinder 3.

The wafer 1 that has completed the dicing is set on the table 2 with tweezers. In this case, the valve 10a is opened, and the vacuum hole 8 of the table 2 is evacuated by the vacuuming device 8 to vacuum-adsorb the wafer 1 to the table 2, and cleaning and drying are performed while rotating the table 2 at low speed and high speed. . After the work is completed, stop the table 2 and then close the valve 10a and the valve 10b.
And low pressure air is supplied from the air blowing device 9 to the vacuum holes 5 of the table 2 to blow the wafer 1 onto the table 2
Make it more separated. In this state, the cylinder 3 is operated so that the back surface of the wafer 1 is supported by the upper block 4 attached to the rod 3a and lifted to a position above the vacuum hole 5 of the table 2. Next, the table 2 is rotated while blowing high-pressure air from the vacuum holes 5 of the table 2 to dry the back surface of the wafer, and after completion of the drying, the wafer is taken out with tweezers.

(Embodiment 2) FIG. 3 is a side view showing a second embodiment of the present invention.

In this embodiment, the wafer 1 lifted from the table 2 is sucked by using the transfer pad 6, carried out from the table 2 and stored in a cassette.

In this embodiment, the wafer 1 is lifted from the table 2 and vacuum-adsorbed by the transfer pad 6, so that stable wafer transfer can be performed and wafer cracking can be reduced.

[Effect of device]

As described above, according to the present invention, after the wafer cleaning / drying work is completed, when the wafer is taken out from the table, the wafer is lifted from the table and held, so that the wafer cracking at the time of taking out the wafer is eliminated and the work is easily performed. be able to. Also, by drying the water droplets that have adhered to the back surface of the wafer when the wafer is lifted, dust that adheres to the back surface can be reduced, and when stored in a cassette, etc., water droplets may drop onto other wafer surfaces. It has the effect of eliminating dust and dirt.

[Brief description of drawings]

1 is a plan view of a stage portion of a wafer cleaning / drying apparatus of the present invention, FIG. 2 is a side view of FIG. 1, and FIG. 3 is a second view of the present invention.
FIG. 3 is a plan view showing a stage portion of the wafer cleaning / drying apparatus according to the example of FIG. 1 ... Wafer, 2 ... Table 3 ... Cylinder, 4 ... Upper block 5 ... Vacuum hole, 6 ... Conveying pad 8 ... Vacuating device, 9 ... Air blowing device

Claims (1)

[Scope of utility model registration request] 1. A wafer cleaning / drying apparatus for cleaning and drying a semiconductor wafer after dicing by holding the vacuumed semiconductor wafer on the table by evacuation from a plurality of vacuum holes provided on the table. The vacuum hole is switchably connected to the vacuuming device and the air blowing device.
A holding unit for holding the peripheral edge of the semiconductor wafer separated from the table under air pressure and pulling the wafer to a position above the vacuum hole of the table is provided, and the semiconductor wafer is turned into the vacuum hole of the table by the holding unit. On the other hand, while the table is being raised, the table is rotated while blowing air from the plurality of vacuum holes to dry the surface of the wafer.