KR200241556Y1 - Wafer transfer - Google Patents

Abstract

The present invention relates to a wafer transfer, the vertical rotation shaft 110 is rotatably installed in the main body 10 of the grinding device of the semiconductor wafer; A rotating arm 120 having one end coupled to the vertical rotation shaft 110; A support member 130 coupled to the other end of the rotary arm 120; A vacuum suction tube 140 connected to an upper center of the support member 130 from the vertical rotation shaft 110 and sucking air from the lower side of the support member 130; It is coupled to the lower side of the support member 130, the tension portion 151 is provided on the lower edge and is in communication with the vacuum suction tube 140, the vacuum suction tube 140 when the suction suction air uniformly on the surface of the semiconductor wafer (W) And a wafer suction pad 150 having a plurality of vacuum suction holes 152 formed thereon, wherein the wafer transfer applies the suction force uniformly to the surface of the semiconductor wafer when the wafer transfer sucks the semiconductor wafer generated by the cleaning liquid. By preventing cracks from occurring, it has the effect of improving the yield of semiconductor elements.

Description

Wafer Transfer {WAFER TRANSFER}

The present invention relates to a wafer transfer, and more particularly, to a wafer transfer that prevents cracking in the semiconductor wafer by applying a suction force uniformly to the surface of the semiconductor wafer even if the semiconductor wafer is tensioned by the cleaning liquid. .

In general, after the manufacturing process of the semiconductor wafer, the back surface of the unnecessary semiconductor wafer is ground to reduce the volume of the chip and at the same time to perform the grinding operation to facilitate heat dissipation when packaged.

Referring to the accompanying drawings, a grinding device of a semiconductor wafer used for grinding the back surface of a semiconductor wafer is as follows.

1 is a perspective view of a grinding apparatus of a conventional semiconductor wafer. As shown, the grinding apparatus of the semiconductor wafer is a waiting table in which the semiconductor wafer is temporarily waited by the wafer loading / unloading arm 20 from the wafer cassette 1 on the upper side of the main body 10 on which the plurality of wafer cassettes 1 are located. 30, a turntable 60 having a plurality of chuck tables 40 and first cleaning means 50 on the upper surface, and a standby table 30 conveying the semiconductor wafer between the chuck tables 40. A grinding means 80 consisting of an initial grinding machine 81 and a finishing grinding machine 82 and a second cleaning means 90 for washing the ground semiconductor wafer. ) Are each provided.

When the wafer cassette 1 equipped with a plurality of semiconductor wafers is loaded on the main body 10, the wafer loading / unloading arm 20 carries the semiconductor wafers from the wafer cassette 1 to the waiting table 30. The vacuum is sucked by the wafer transfer 70 and transferred to the chuck table 40.

The chuck table 40 sucks the semiconductor wafer transferred by the wafer transfer 70 in a vacuum, and then moves to the lower side of the initial grinding machine 81 by the rotation of the turntable 60.

When the chuck table 40 equipped with the semiconductor wafer is located below the initial grinding machine 81, the initial grinding machine 81 moves downward to grind the semiconductor wafer adsorbed on the chuck table 40, and the semiconductor wafer is ground. After finishing, the initial grinding machine 81 is moved upward, the semiconductor wafer initially ground by the initial grinding machine 81 is moved to the finishing grinding machine 82 by the rotation of the turntable 60, by the finishing grinding machine 82 The finish is ground.

When the semiconductor wafer finishes the final grinding by the finishing grinder 82, the finishing grinder 82 moves upward, and the turntable 60 rotates to move the chuck table 40 to the unloading position. At this time, the grinding surface of the semiconductor wafer is washed by the first cleaning means (50).

After the cleaning, the semiconductor wafer is moved from the chuck table 40 to the waiting table 30 by the wafer transfer 70, and is attached to the second cleaning means 90 located between the waiting table 30 and the chuck table 40. By washing again.

The semiconductor wafer transferred to the waiting table 30 is carried out to the wafer cassette 1 by the wafer carrying in / out arm 20 so that the grinding process is completed.

The wafer transfer 70 provided in the conventional grinding device for semiconductor wafers is provided with a wafer adsorption pad for absorbing the upper surface of the semiconductor wafer.

2 is a plan view of a wafer adsorption pad of a wafer transfer of a conventional grinding device for semiconductor wafers. As illustrated, the wafer suction pad 71 has a convex tension portion 71a formed at an edge thereof, and a vacuum suction port 71b is formed at the center thereof.

Since the wafer adsorption pad 71 is made of rubber material, even if the wafer transfer 70 presses the semiconductor wafer to pick up the semiconductor wafer, the semiconductor wafer is absorbed by the elastic force of the rubber and the buffering action of the tension portion 71a. Has the advantage of being less stressed.

However, since the wafer adsorption pad 71 has only one vacuum suction hole 71b at the center, when the wafer adsorption pad 71 vacuum-absorbs the semiconductor wafer, the suction force of the wafer adsorption pad 71 is increased. Is concentrated in the center of the.

Accordingly, when the wafer transfer 70 adsorbs the semiconductor wafer adsorbed on the chuck table 40, the semiconductor wafer is tensioned by the cleaning liquid supplied from the first cleaning means 50, thereby causing the semiconductor wafer to bend. The moment (bending monent) is bent by the action has a problem that the crack (crack) occurs from the weak portion of the semiconductor wafer.

The present invention is to solve the above-mentioned problems, an object of the present invention is to apply a suction force to the surface of the semiconductor wafer uniformly when picking up the semiconductor wafer adsorbed to the chuck table as a cleaning liquid to the semiconductor wafer adsorbed on the chuck table The present invention provides a wafer transfer that improves the yield of a semiconductor device by preventing the occurrence of cracks in the semiconductor wafer by safely picking up the semiconductor wafer even when the tension occurs.

The present invention for achieving the above object is a vertical rotary shaft rotatably installed in the main body of the grinding device of the semiconductor wafer; A rotating arm having one end coupled to the vertical rotation shaft; A support member coupled to the other end of the rotary arm; A vacuum suction pipe connected to the upper center of the support member from the vertical rotation shaft and sucking air from the lower side of the support member; It is coupled to the lower side of the support member, the lower portion is provided with a tension portion, the wafer suction pad includes a plurality of vacuum suction pads are formed in communication with the vacuum suction tube to apply a suction force evenly to the surface of the semiconductor wafer when the vacuum suction tube sucks air Characterized in that.

The vacuum suction port of the wafer suction pad includes: a suction hole formed at the center of the wafer suction pad, a first suction line having a circular band shape around the suction hole; And a second suction line having a cross shape around the suction hole.

1 is a perspective view of a grinding apparatus of a conventional semiconductor wafer;

2 is a plan view of a wafer adsorption pad of a wafer transfer of a grinding device of a conventional semiconductor wafer;

3 is a cross-sectional view of the wafer transfer according to the present invention,

4 is a plan view of a wafer adsorption pad of the wafer transfer according to the present invention.

<Description of Symbols for Main Parts of Drawings>

100: wafer transfer 110: vertical axis of rotation

120: rotating arm 130: support member

140: vacuum suction pipe 150: wafer suction pad

151: tension unit 152: vacuum suction port

152a: suction hole 152b: first suction line

152c: second suction line

Hereinafter, with reference to the accompanying drawings, the most preferred embodiment of the present invention will be described in more detail so that those skilled in the art can easily practice.

The same parts as in FIG. 1 will be denoted by the same reference numerals and description thereof will be omitted.

3 is a cross-sectional view of the wafer transfer according to the present invention, Figure 4 is a plan view of the wafer adsorption pad of the wafer transfer according to the present invention. As shown in the drawing, the wafer transfer device 100 which sucks and transports the semiconductor wafers W in a vacuum between the waiting table 30 and the chuck table 40 in the grinding device of the semiconductor wafer is largely rotated with the vertical axis of rotation 110. An arm 120, a support member 130, a vacuum suction tube 140, and a wafer suction pad 150 are provided.

The vertical rotation shaft 110 is rotatably installed in the main body 10 of the grinding device of the semiconductor wafer, and inside the vacuum suction path to be connected to a vacuum suction pump (not shown) provided in the main body 10 of the grinding device of the semiconductor wafer. 111 is formed vertically, one end of the rotary arm 120 is coupled to the upper side by a bolt (B).

Rotating arm 120 is rotated by the rotation of the vertical axis of rotation 110, a through hole 121 penetrating the upper and lower sides is formed, the cover 122 is coupled to the upper side, the other end bolt (B) By the support member 130 is coupled.

The support member 130 has a disk shape, the vacuum suction tube 140 is connected to the center, the wafer suction pad 150 is coupled to the lower side.

The vacuum suction pipe 140 connects the center of the vacuum suction path 111 and the support member 130 of the vertical rotation shaft 110. To this end, the vacuum suction pipe 140 has one end coupled to the connection valve 141 which is provided on the upper side of the combined rotary arm 120 of the vertical rotation shaft 110 and communicates with the vacuum suction path 111, and the other end is the rotary arm. The through hole 121 of 120 penetrates from the upper side to the lower side and is coupled to the connection valve 142 provided at the center of the support member 130.

Wafer adsorption pad 150 is coupled to the lower side of the support member 130, the tension portion 151 is provided on the lower edge, and communicates with the vacuum suction tube 140 connected to the center of the support member 130, the vacuum suction tube ( When the air suctions 140, a plurality of vacuum suction openings 152 are formed to apply the suction force uniformly to the surface of the semiconductor wafer (W).

Meanwhile, the vacuum suction opening 152 of the wafer suction pad 150 has a suction hole 152a formed at the center as shown in FIG. 4 and a first suction line having a circular band shape around the suction hole 152a. 152b and a second suction line 152c having a cross shape around the suction hole 152a. Accordingly, the first and second suction lines 152b and 152c together with the suction hole 152a may apply suction force to the entire surface of the semiconductor wafer W when the wafer transfer 150 vacuum-absorbs the semiconductor wafer W. .

The operation of the wafer transfer having such a structure is performed as follows.

When the wafer transfer 100 picks up the semiconductor wafer W from the standby table 30 or the chuck table 40, air suction force generated from the vacuum pump is installed in the vertical rotation shaft 110. It is applied to the entire surface of the semiconductor wafer W through the suction holes 152a and the first and second suction lines 152b and 152c of the wafer suction pad 150 along the 111 and the vacuum suction tube 140.

Therefore, since the suction force of the wafer transfer 100 is uniformly applied to the entire surface of the semiconductor wafer W, the cleaning liquid is supplied from the first cleaning means 50 to the semiconductor wafer W adsorbed on the chuck table 40. Since the bending moment does not act on the semiconductor wafer W even when tension is generated, the wafer transfer 100 can safely pick up the semiconductor wafer W adsorbed on the chuck table 40.

According to a preferred embodiment of the present invention as described above, even when the semiconductor wafer is picked up by the cleaning liquid when the wafer transfer is picked up by the chuck table, the crack is applied to the semiconductor wafer by applying a suction force uniformly to the surface of the semiconductor wafer. To prevent this from happening.

As described above, the wafer transfer according to the present invention is applied evenly to the surface of the semiconductor wafer when picking up the semiconductor wafer adsorbed on the chuck table, even if the tension caused by the cleaning liquid on the semiconductor wafer adsorbed on the chuck table occurs. By picking up the wafer safely, it is possible to prevent cracks in the semiconductor wafer and to prevent cracks in the semiconductor wafer, thereby improving the yield of semiconductor devices.

What has been described above is just one embodiment for performing a wafer transfer according to the present invention, the present invention is not limited to the above embodiment, the subject matter of the present invention as claimed in the utility model registration claims below Without departing from the technical spirit of the present invention to the extent that any person of ordinary skill in the art to which the invention belongs can be variously modified.

Claims (2)

In the transfer arm for sucking and transporting the semiconductor wafer by vacuum between the waiting table and the chuck table in the grinding device of the semiconductor wafer, A vertical rotating shaft rotatably installed on a main body of the grinding device of the semiconductor wafer; A rotating arm having one end coupled to the vertical rotation shaft; A support member coupled to the other end of the rotary arm; A vacuum suction pipe connected to an upper center of the support member from the vertical rotation shaft and suctioning air from a lower side of the support member; The suction unit is coupled to the lower side of the support member, the tension portion is provided at the bottom edge, and the vacuum suction tube communicates with the vacuum suction tube so that the vacuum suction tube applies a suction force uniformly to the surface of the semiconductor wafer when the vacuum suction tube sucks air. pad; Wafer transfer comprising a. According to claim 1, wherein the vacuum suction port of the wafer suction pad, A suction hole formed at a center of the wafer suction pad; A first suction line having a circular band shape around the suction hole; A second suction line having a cross shape around the suction hole; Wafer transfer, characterized in that consisting of.