JPS6385664U - - Google Patents
Info
- Publication number
- JPS6385664U JPS6385664U JP18014786U JP18014786U JPS6385664U JP S6385664 U JPS6385664 U JP S6385664U JP 18014786 U JP18014786 U JP 18014786U JP 18014786 U JP18014786 U JP 18014786U JP S6385664 U JPS6385664 U JP S6385664U
- Authority
- JP
- Japan
- Prior art keywords
- processing chamber
- chamber
- wafer
- arm
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003028 elevating effect Effects 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 claims 6
- 238000005192 partition Methods 0.000 claims 1
- 238000010884 ion-beam technique Methods 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Description
第１図は、この考案の一実施例に係るエンドス
テーシヨンを示す概略平面図である。第２図は、
第１図の線―に沿う拡大断面図である。第３
図は、従来のエンドステーシヨンの一例を示す概
略平面図である。
２…処理室、４…イオンビーム、６…プラテン
、１０…ウエハ、２６ａ〜２６ｃ…昇降台、２８
ａ，２８ｂ…予備真空室、３０…アーム、３２ａ
〜３２ｃ…弁体。
FIG. 1 is a schematic plan view showing an end station according to an embodiment of this invention. Figure 2 shows
FIG. 2 is an enlarged sectional view taken along line - in FIG. 1; Third
The figure is a schematic plan view showing an example of a conventional end station. 2...Processing chamber, 4...Ion beam, 6...Platen, 10...Wafer, 26a-26c...Elevating table, 28
a, 28b...Preliminary vacuum chamber, 30...Arm, 32a
~32c... Valve body.
Claims (1)
理室と大気側との間でウエハを出し入れするため
の予備真空室と、処理室内に設けられているウエ
ハを移載するためのアームとを有するエンドステ
ーシヨンにおいて、処理室におけるアームの移動
領域内の所にウエハを載置して昇降させる昇降台
を設け、処理室の天井部であつて前記昇降台の上
方に前記予備真空室を離接させ、かつ前記アーム
に、ウエハを載置可能であり昇降台によつて昇降
させられてそれと共働して処理室と予備真空室間
を仕切る真空弁の作用をする弁体を設けているこ
とを特徴とするエンドステーシヨン。 A processing chamber for processing wafers in a vacuum, a preliminary vacuum chamber for taking wafers in and out between the processing chamber and the atmosphere side, and an arm provided in the processing chamber for transferring wafers. In the end station, an elevating table for placing a wafer and raising and lowering the wafer is provided within the movement area of the arm in the processing chamber, and the preparatory vacuum chamber is attached and separated from the ceiling of the processing chamber and above the elevating table. and the arm is provided with a valve body on which a wafer can be placed, which is raised and lowered by a lifting table, and which cooperates with the lifting table to act as a vacuum valve to partition the processing chamber and the preliminary vacuum chamber. End station featuring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986180147U JPH0623562Y2 (en) | 1986-11-21 | 1986-11-21 | End station |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986180147U JPH0623562Y2 (en) | 1986-11-21 | 1986-11-21 | End station |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6385664U true JPS6385664U (en) | 1988-06-04 |
| JPH0623562Y2 JPH0623562Y2 (en) | 1994-06-22 |
Family
ID=31123838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986180147U Expired - Lifetime JPH0623562Y2 (en) | 1986-11-21 | 1986-11-21 | End station |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0623562Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02294474A (en) * | 1989-04-14 | 1990-12-05 | Leybold Ag | Apparatus for cathode sputtering |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6280268U (en) * | 1985-11-08 | 1987-05-22 |
-
1986
- 1986-11-21 JP JP1986180147U patent/JPH0623562Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6280268U (en) * | 1985-11-08 | 1987-05-22 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02294474A (en) * | 1989-04-14 | 1990-12-05 | Leybold Ag | Apparatus for cathode sputtering |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0623562Y2 (en) | 1994-06-22 |