JPH033743U - - Google Patents
Info
- Publication number
- JPH033743U JPH033743U JP6375489U JP6375489U JPH033743U JP H033743 U JPH033743 U JP H033743U JP 6375489 U JP6375489 U JP 6375489U JP 6375489 U JP6375489 U JP 6375489U JP H033743 U JPH033743 U JP H033743U
- Authority
- JP
- Japan
- Prior art keywords
- suction
- wafer
- suction surface
- handling device
- wafer handling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
第１図は本考案による第１の実施例を示す図、
第２図は本考案による第２の実施例を示す図、第
３図は従来のウエーハハンドリング状態を示す図
、第４図は真空ピンセツトの構造を示す断面図、
第５図は本考案が解決しようとする問題点を説明
する図、である。
図において、１，１１……ウエーハハンドリン
グ装置、１ａ，１１ａ……吸着面、１ｂ，１１ｂ
……吸着口、１ｃ，１１ｃ……ガイド面、１ｄ，
１１ｄ……真空流路、２……収納容器、３…炉芯
管、４……半導体基板、４ａ……オリエンテーシ
ヨンフラツト、を示す。
FIG. 1 is a diagram showing a first embodiment of the present invention;
FIG. 2 is a diagram showing a second embodiment of the present invention, FIG. 3 is a diagram showing a conventional wafer handling state, and FIG. 4 is a sectional view showing the structure of the vacuum tweezers.
FIG. 5 is a diagram illustrating the problem that the present invention attempts to solve. In the figure, 1, 11...wafer handling device, 1a, 11a... suction surface, 1b, 11b
...Suction port, 1c, 11c...Guide surface, 1d,
11d... Vacuum channel, 2... Storage container, 3... Furnace tube, 4... Semiconductor substrate, 4a... Orientation flat.
Claims (1)
し、該吸着面１ａに真空吸着用の吸着口１ｂを具
備することを特徴とするウエーハハンドリング装
置。 A wafer handling device characterized in that it has a suction surface 1a that comes into close contact with the peripheral edge of the wafer 4, and that the suction surface 1a is provided with a suction port 1b for vacuum suction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6375489U JPH033743U (en) | 1989-05-31 | 1989-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6375489U JPH033743U (en) | 1989-05-31 | 1989-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH033743U true JPH033743U (en) | 1991-01-16 |
Family
ID=31594083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6375489U Pending JPH033743U (en) | 1989-05-31 | 1989-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH033743U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101394387B1 (en) * | 2007-06-25 | 2014-05-14 | 세메스 주식회사 | Unit for loading a substrate and apparatus for bonding dies having the unit |
| CN114260670A (en) * | 2021-12-13 | 2022-04-01 | 奥美森智能装备股份有限公司 | Automatic insert elbow machine |
| CN114260688A (en) * | 2021-12-13 | 2022-04-01 | 奥美森智能装备股份有限公司 | Vacuum elbow box |
-
1989
- 1989-05-31 JP JP6375489U patent/JPH033743U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101394387B1 (en) * | 2007-06-25 | 2014-05-14 | 세메스 주식회사 | Unit for loading a substrate and apparatus for bonding dies having the unit |
| CN114260670A (en) * | 2021-12-13 | 2022-04-01 | 奥美森智能装备股份有限公司 | Automatic insert elbow machine |
| CN114260688A (en) * | 2021-12-13 | 2022-04-01 | 奥美森智能装备股份有限公司 | Vacuum elbow box |